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Friday 21 August 2026
Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
Friday 21 August 2026
Honor Robot Phone moves from concept to mass production

With the official launch of Honor's new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers...

Friday 21 August 2026
Analyst: CPO gains momentum as AI interconnect demands outpace chip gains
The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
Friday 21 August 2026
800VDC adoption in AI data centers is set to reshape power chip demand
A shift to 800VDC power architectures in next-generation AI data centers is gathering pace, with implications for GPU planning, power semiconductor demand, and rack design. Many vendors...
Friday 21 August 2026
Longcheer and Luxshare move into robot ODM
China consumer electronics ODMs are extending their R&D, supply chain integration and mass production capabilities into the embodied AI robot market. Longcheer announced on August...
Thursday 20 August 2026
SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
Thursday 20 August 2026
Qualcomm targets NT$10,000 entry-level PCs as 4 brands adopt
Qualcomm is moving into the entry-level PC market with its Snapdragon C platform as Apple's US$599 MacBook Neo and surging DRAM and NAND costs squeeze low-priced Windows laptops from...
Thursday 20 August 2026
PGC Helps Startups Accelerate ASIC Development with Turnkey Services

With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys...

Wednesday 19 August 2026
China's new automotive chip rules target the last mile to vehicle adoption

China has introduced five automotive chip certification and accreditation industry standards aimed at easing a key obstacle to domestic...

Tuesday 18 August 2026
Mitsubishi taps Foxconn EV platform for ASX VR-e launch

Mitsubishi Motors will launch its new all-electric SUV, the ASX VR-e, in Australia and New Zealand in the fourth quarter of 2026, with...

Tuesday 18 August 2026
Humanoid robots expose the limits of chasing higher TOPS

Humanoid robots are moving from demonstrations toward mass production, changing the priorities of chip design. Instead of simply chasing...

Tuesday 18 August 2026
MediaTek widens ASIC services as market share surges

MediaTek has reportedly landed major orders for Google TPU products in recent years, even appearing to challenge Broadcom's position...

Monday 17 August 2026
AI server growth is lifting Taiwan ODM revenue, but margins now face the harder test
Taiwan's top six original design manufacturers are seeing AI servers become the main revenue engine in 2026, but the boom is also bringing heavier exposure to expensive GPUs, CPUs,...
Monday 17 August 2026
AI server tracker: Demand drives strong growth across Taiwan's CCL, design services, substrate, and testing supply chains
Taiwan's AI server supply chain continued to show strong growth in July 2026, with revenue rising across copper-clad laminate (CCL), design services, substrates, and testing. All four...
Sunday 16 August 2026
Samsung, SK Hynix HBM4 hiring war drains South Korea's chip design talent
South Korea's semiconductor talent shortage is intensifying as Samsung Electronics and SK Hynix recruit experienced chip designers for increasingly complex HBM4 products, drawing key...