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Thursday 16 July 2026
TSMC says 2nm has four times as many tape-outs as 3nm at the same stage
Customer tape-outs for TSMC's N2 process have reached four times the number recorded by its 3nm technology at the same stage, showing faster design activity as the foundry ramps production...
Thursday 16 July 2026
Apple lawsuit targets OpenAI's AI hardware ambitions
Apple has sued OpenAI for allegedly stealing trade secrets, but the real fight is over who controls the entry points of AI. As LLM technology converges, the case shows that competition...
Thursday 16 July 2026
Cadence launches agentic AI platform for PCB and package design
Cadence has launched the AuraStack AI Super Agent on Allegro AI Studio, positioning it as the world's first agentic AI platform for printed circuit board (PCB) and advanced packaging...
Thursday 16 July 2026
India trims chip subsidies but widens their reach as it courts electronics supply chain away from China
India approved two large incentive packages on July 15 that together recast how New Delhi subsidizes electronics manufacturing: learner-per-project chip subsidies spread across a much...
Thursday 16 July 2026
Samsung weighs outsourcing Google TPU back-end design as 2nm demand grows

Samsung Electronics is considering outsourcing some or all of the back-end design work for an input/output die in Google's reported...

Thursday 16 July 2026
Foxconn shows Model A and Model B EVs in Japan through CDMS push
Foxconn recently displayed its Model A and Model B electric vehicles in Tokyo, as the Taiwanese manufacturer stepped further into Japan's EV market. The vehicles were shown for the...
Wednesday 15 July 2026
South Korean court bars former Samsung NAND designers from working for SK Hynix
A South Korean court has partially granted Samsung Electronics' request to prevent two former NAND flash design employees from working for rival SK Hynix or its affiliates until April...
Wednesday 15 July 2026
Intel sends its most advanced 18A node into orbit with Starfire space chip

Intel has unveiled Starfire, a space-grade processor that leverages its leading-edge 18A manufacturing process for satellites and other...

Wednesday 15 July 2026
QBit Semiconductor June revenue hits record as SoC and ASIC demand rises
QBit Semiconductor reported a June consolidated revenue of NT$132 million (US$4.1 million) in 2026, a record high marking a rise of 108.5% from the previous month and 41.1% from a...
Tuesday 14 July 2026
Chinese AI glasses startups gain momentum, raising pressure on Taiwan's supply chain

The smart glasses market is developing rapidly, with brands adopting a more pragmatic approach to product design while placing greater emphasis...

Tuesday 14 July 2026
China launches first 8-inch 2D chip line to bypass EUV limits

Shanghai AtomIC Technology has launched what it describes as the world's first 8-inch pilot line for two-dimensional semiconductors, marking...

Tuesday 14 July 2026
Samsung brings HBM, logic, and optics together in packaging push
Samsung Electronics is developing advanced packaging technology that combines high-bandwidth memory (HBM), logic chips and silicon photonics (SiPh) as it seeks to address the rising...
Tuesday 14 July 2026
Interview: UK's AI sovereignty pitch — research at home, scale with Taiwan

As the world enters an AI-centric era, the global race for technological leadership is no longer defined only by who can build the...

Monday 13 July 2026
Tesla AI5 chip reportedly completes tape-out for Samsung's Texas fab

Samsung Electronics has reportedly completed the tape-out of its version of Tesla's AI5 chip for self-driving systems, with the chip...

Monday 13 July 2026
Nvidia's HVDC shift could reshape data center power chains worldwide
Nvidia's move toward high-voltage direct current (HVDC) power systems for artificial intelligence (AI) data centers could alter how global servers are built and powered. The shift...