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    Saturday 5 September 2026
    Semicon Taiwan 2026: A windmill in the die bonder, and a Dutch bet on photonics
    Dutch equipment maker ITEC used Semicon Taiwan to promote a die-bonding architecture that it says triples throughput over earlier versions of the design by removing the largest source...
    Saturday 5 September 2026
    Exclusive: Taiwan's first tokamak to begin plasma testing by end of 2026
    Fusion energy, often referred to as an artificial sun, has become a central focus of global sustainable energy development in recent years. However, despite nearly 70 years of worldwide...
    Saturday 5 September 2026
    Taiwan satellite ground equipment output grows 13%, nears NT$300B

    Taiwan's satellite ground equipment industry posted 13% year-over-year growth in 2025 as local firms push deeper into the low-Earth...

    Friday 4 September 2026
    TSMC urges HBM makers to design for X-ray inspection as packaging grows more complex
    TSMC is calling for future HBM and DRAM designs to become more compatible with X-ray inspection, as increasingly complex advanced packaging makes buried defects harder to detect while...
    Friday 4 September 2026
    How agentic AI and 'AI physics' are reshaping chip design
    As semiconductor designs advance toward trillion-transistor packages, the traditional engineering playbook of simply adding more personnel or running legacy software faster has hit...
    Friday 4 September 2026
    Analysis: Physical AI upgrades autonomous driving and lifts Taiwan supply chains
    As end-to-end (E2E) autonomous driving architectures gradually become mainstream, the inference demands of physical AI are driving radical transformations in automotive system-on-chip...
    Friday 4 September 2026
    Chip leaders call for end to 'silo mentality' as AI scale-up demands cross-industry collab
    The rapid expansion of artificial intelligence is forcing a radical shift from individual chip design to holistic system-level engineering, requiring competitors and supply chain partners...
    Friday 4 September 2026
    Acer unveils IFA lineup with AI, slim notebooks, sustainability
    Acer used its next@acer global press conference in Berlin during IFA to unveil a broad lineup of new products, highlighting its push into AI, sustainability, thin-and-light notebooks,...
    Thursday 3 September 2026
    CHPT spans wafer to system-level testing
    Chunghwa Precision Test Tech showcased a range of test interface solutions for AI chips and high-performance computing (HPC) at SEMICON Taiwan 2026, including AI probe cards, memory...
    Thursday 3 September 2026
    CXMT expands global hiring to Japan for DDR5, LPDDR technology upgrade

    Chinese DRAM maker CXMT has launched its 2027 global recruitment campaign, opening roles across circuit design, R&D, mass-production...

    Thursday 3 September 2026
    UniVista expands China EDA stack with AI agents, native 3DIC tools
    Shanghai UniVista Industrial Software Group has launched an Agentic EDA framework, a native 3DIC physical-design tool and an advanced-process closure platform, expanding China's domestic...
    Thursday 3 September 2026
    BYD Semiconductor scales 4D radar chip for L2-L4 driving, deepening its in-house automotive sensing stack
    BYD Semiconductor has begun mass production of a new automotive-grade 4D millimetre-wave radar chip built around its Xuanji A3 intelligent-driving architecture, expanding its in-house...
    Thursday 3 September 2026
    Google to expand Taipei AI infrastructure center as Taiwan ties deepen
    Google will expand its AI infrastructure research and development center in Taipei's Shilin district, adding 60% more office space, as it deepens work with Taiwan's supply chain on...
    Wednesday 2 September 2026
    TSMC says Europe chip strategy is shifting from plans to demand creation
    The European semiconductor push is moving beyond factory construction toward demand, design support, and talent building, according to TSMC. For global readers, the shift matters because...
    Wednesday 2 September 2026
    Nvidia pushes into HBM base dies as NVHBM battle heats up
    The competition in high-bandwidth memory (HBM) is moving beyond DRAM stack height, bandwidth, and packaging to the base die at the very bottom of the package. As Nvidia pushes its...
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    BIZ FOCUS
    Sep 2, 08:22
    World Diamond Technology accelerates mass production of 300 mm diamond wafers
    Wednesday 2 September 2026
    Beyond Language: Indonesian Engineers Bridging Cultures in Taiwan's Semiconductor Industry
    Wednesday 2 September 2026
    Innovative Solutions for Fabricating High-Performance AI Multichip Packaging Using Glass Substrates
    Wednesday 2 September 2026
    8 September Hsinchu seminar: Silicon photonics driving AI chains
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