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Wednesday 11 November 2026
Samsung targets early 2027 for first 3D Cube-H design kit
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Wednesday 11 November 2026
Alibaba files to spin off chip design unit T-Head for Hong Kong IPO
Alibaba filed for a Hong Kong IPO for its chip design unit, T-Head, as a spin-off on November 10. The separate listing would let investors gain direct exposure to the group's chipmaking...
Wednesday 11 November 2026
SK Hynix taps HBM veteran to lead US business as competition intensifies
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
Wednesday 11 November 2026
Intel expands 18A reach with Wildcat Lake AI PC chips
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
Wednesday 11 November 2026
Taiwan lets companies fast-track or delay patent examinations
Taiwan's Intellectual Property Office (TIPO) has introduced measures allowing companies to accelerate or delay patent examinations based on their business strategies. Intel, MediaTek,...
Wednesday 11 November 2026
China's Huaqin looks beyond AI servers with US$150M wafer foundry investment
China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening...
Wednesday 11 November 2026
Wave Photonics eyes Singapore as Asian quantum hub
UK photonic integrated circuit (PIC) startup Wave Photonics is expanding in Asia and, despite partnerships with the Hon Hai Research Institute (HHRI) and Taiwan-based EDA companies,...
Tuesday 10 November 2026
Automotive architecture shifts to zonal control as AI cyber risks rise
Automotive electrical/electronic architecture (E/EA) continues to evolve—moving from early distributed control systems to today's mature domain-based architectures, and now ushering...
Tuesday 10 November 2026
Samsung SDI reportedly set to lead early battery supply for Boston Dynamics' Atlas
Samsung SDI is expected to provide most of the initial battery supply for Atlas, the humanoid robot developed by Hyundai Motor Group's Boston Dynamics, according to South Korean industry...
Tuesday 10 November 2026
Novatek faces AI infrastructure squeeze, pins growth ramp-up on new products
Novatek Microelectronics, a leading Taiwanese display driver IC (DDI) design house, hosted its quarterly earnings conference last week. Novatek President and Vice Chairman Steve Wang...
Tuesday 10 November 2026
Exclusive: Designing light for everyone—Wave Photonics seeks to make custom photonic chips accessible
In a Cambridge laboratory, an automated testing machine sits at the end of a process that has traditionally demanded years of specialized engineering: designing a photonic chip, sending...
Tuesday 10 November 2026
Taiwan begins 6G spectrum prep as 4G licenses expire in 2030
Taiwan's Ministry of Digital Affairs (MODA) plans to begin preparatory work in 2027 for a potential 6G spectrum release, as licenses for the 700MHz, 900MHz, and 1800MHz bands are due...
Monday 9 November 2026
DeepSeek Harness active users quadruple as plugin ecosystem expands
DeepSeek said its open-source AI agent framework, DeepSeek Harness, had 1.54 million daily active users as of November 4, more than quadrupling in less than three months. The company...
Monday 9 November 2026
Paras Semiconductors teams with US-based BroadPak on advanced packaging plant in India
Paras Semiconductors, a subsidiary of Indian defense company Paras Defence & Space Technologies, announced a strategic technology partnership with US-based BroadPak Corporation...
Saturday 7 November 2026
Analysis: Britain's semiconductor paradox—world-class innovation, but who captures the value?
As artificial intelligence reshapes global chipmaking, the UK's strength in design, materials and research is being tested by a longstanding challenge: turning technological breakthroughs...