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    Chinese automakers gain share in Europe as legacy carmakers partner to cut costs
    3h 5min ago
    Chinese PCB makers invest heavily to chase high-end markets
    3h 5min ago
    Alibaba Cloud pushes modular data centers in Wulanchabu
    3h 5min ago
    Eternal Precision Mechanics accelerates advanced packaging push with wafer lamination
    3h 5min ago
    Alibaba Cloud’s five super data centers shift into AI compute battlefields
    3h 5min ago
    NEWS TAGGED DESIGN
    Thursday 13 August 2026
    Foxconn broadens beyond AI servers with EVs, robotics and Japan chip fab above 90% utilisation
    Foxconn used its second-quarter 2026 earnings conference on August 12 to detail progress beyond its fast-growing AI server business, spanning cloud and data centre solutions, electric...
    Thursday 13 August 2026
    Cisco leans further into AI networking as hyperscaler orders near US$9.3 billion for the year
    Cisco Systems closed fiscal 2026 with record results and told investors that the AI-driven "networking supercycle" it has described is still in its early stages. The company backed...
    Thursday 13 August 2026
    OCP APAC 2026: Ayar Labs CEO says copper is holding back open compute, sees optical interconnects as way forward
    Speaking at the OCP APAC Summit 2026, Ayar Labs CEO Mark Wade argued that copper interconnects have become one of the biggest obstacles to realizing the vision of open computing.
    Thursday 13 August 2026
    Siemens EDA unveils AI-Native Design strategy in South Korea
    Siemens EDA has introduced an AI-Native Design strategy in Seoul, aiming to help chipmakers and system designers manage rising complexity while reducing the risk of AI errors. The...
    Thursday 13 August 2026
    Commentary: Shut out of Nvidia and AMD, Compal charts a different path to AI servers

    Compal chairman Ray Chen said the company was still a newcomer to AI servers two years ago but has now moved into the middle tier and...

    Thursday 13 August 2026
    Synopsys pushes into system design as Nvidia, AMD and Broadcom move up the stack
    Nvidia, AMD and Broadcom are moving beyond chip-level design into subsystems and complete systems, a shift that is increasing the need to account for thermal, electrical, mechanical...
    Thursday 13 August 2026
    Progate posts record profit on TSMC, Synopsys ecosystem gains
    Progate Group Corporation posted record second-quarter and first-half 2026 revenue and profit, as stronger operations and deeper ties with the TSMC, Synopsys, and ASE ecosystems boosted...
    Wednesday 12 August 2026
    OCP APAC 2026: Google says 48V hits wall as AI racks head toward megawatt scale
    Google used its keynote at the OCP APAC Summit in Taipei on August 11 to argue that the 48V power architecture widely used in data centers is running out of headroom as AI racks move...
    Wednesday 12 August 2026
    Foxconn earnings call eyes four themes: AI racks, transaction models, Apple, EVs
    Foxconn will hold its second quarter 2026 earnings call on the afternoon of August 12, as AI racks continue to ship and July consolidated revenue topped NT$900 billion (approx. US$27.9...
    Wednesday 12 August 2026
    OCP APAC 2026: TSMC says AI advanced packaging enters system-level battle

    AI computing demand is rapidly driving up chip integration complexity, pushing advanced packaging competition beyond single-device...

    Tuesday 11 August 2026
    UK Semiconductor Center makes Taiwan debut at SEMICON, strengthening strategic ties

    The UK Semiconductor Centre (UKSC), a leading organization in the UK semiconductor ecosystem, will lead a delegation of British semiconductor...

    Tuesday 11 August 2026
    Europe and US IDM giants expand China EV share on capacity, tech edge
    Major European and US integrated device manufactures (IDM) have faced strong competition from Chinese players within China's electric vehicle (EV) market in recent years, but many...
    Monday 10 August 2026
    Hiwin earns S&P and DJSI sustainability recognitions on four-way carbon cuts
    Hiwin, a major precision motion components maker, has accelerated its sustainability transformation in recent years and achieved two major milestones: it was included in the DJSI Emerging...
    Saturday 8 August 2026
    Commentary: China IC design rules reshape patent battles

    China's State Council has released a revised version of the regulations on the protection of IC layout designs, set to take effect...

    Friday 7 August 2026
    Analysis: TSMC expands Japan footprint with 3nm fab, advanced packaging push
    TSMC is expanding Japan's role in its global network as it prepares to add 3nm production in Kumamoto and deepens local capabilities in advanced packaging, chip design and next-generation...
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    BIZ FOCUS
    Jul 30, 08:00
    EDOM Accelerates Edge AI Deployment with NVIDIA Technologies
    Monday 1 June 2026
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Thursday 30 July 2026
    ACCM Introduces Celeritas SMC: A Production-Ready, Silicon-Matched Core for Advanced Packaging
    Wednesday 29 July 2026
    Arrow Drives System-Level Design, Turning Complexity into Competitive Advantage
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