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NEWS TAGGED DESIGN
Friday 15 May 2026
AI servers squeeze ODM margins as consignment gains traction
As AI server prices rise, original design manufacturers (ODMs) are hitting record revenue, but also coming under pressure on their gross margins. To defend profitability, manufacturers...
Friday 15 May 2026
Nvidia Vera Rubin issues reportedly cleared, supply chain eyes 3Q26 ramp
Market fears over Nvidia's next-generation Vera Rubin platform have eased after supply-chain sources said design issues tied to a cooling architecture change have largely been resolved...
Friday 15 May 2026
Auras says Nvidia Vera Rubin gold-plating change won't hit operations as revenue, profit jump
Auras Technology reported record first-quarter results and said it expects revenue and profit to grow quarter by quarter in 2026, dismissing market talk that a design tweak on Nvidia's...
Friday 15 May 2026
UMC rolls out 14nm FinFET platform for OLED driver ICs
United Microelectronics Corp. (UMC) has released a 14nm embedded high-voltage (eHV) FinFET technology platform for display driver ICs, marking a new step in the foundry's process roadmap...
Friday 15 May 2026
Malaysia's Arm-backed chip push lifts Oppstar, SkyeChip as startup ambitions expand beyond packaging
Malaysia is accelerating efforts to expand beyond semiconductor assembly and testing into chip design, following a government-backed initiative tied to access to Arm technology.
Friday 15 May 2026
InP compound semiconductors break AI power and bandwidth barriers
Indium phosphide (InP) and other compound semiconductors are taking on a bigger role as demand rises for highly efficient light emission and ultra-high-frequency transmission. Their...
Friday 15 May 2026
Interview: The 6G clock is ticking — and Ericsson wants Taiwan in its corner
The global mobile standards race has moved into the 6G prelude, with Ericsson saying the first fully implementable 6G specification is expected as early as March 2029. In an exclusive...
Thursday 14 May 2026
Sony launches Xperia 1 VIII in bid to reclaim ground in premium smartphone market
Sony announced on May 13 that it will launch the Xperia 1 VIII flagship phone as it seeks to reclaim market share amid intensifying competition in the premium smartphone segment. The...
Wednesday 13 May 2026
L&T Semiconductor Technologies signs multiyear agreement with Synopsys for AI-enabled power module design
L&T Semiconductor Technologies' multiyear agreement with Synopsys to use AI-enabled multiphysics simulation software could accelerate the development of power modules and intelligent...
Wednesday 13 May 2026
Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
Wednesday 13 May 2026
AI server tracker: GUC surges ahead as Faraday and Alchip face slower 2026 start

Taiwan's ASIC and design services sector is showing sharply diverging fortunes in 2026, with new monthly revenue data highlighting strong...

Tuesday 12 May 2026
Pan Jit and subsidiary sponsor Make NTU 2026 hackathon to push robotic gripper innovations
Pan Jit International and its subsidiary participated in Make NTU 2026, a 36-hour student hackathon hosted by the electrical engineering student association at National Taiwan University,...
Tuesday 12 May 2026
Ichia targets optical communications growth with Evercast Precision investment
Ichia Technologies announced on May 11 that it plans to make a cash-based strategic investment in optical communications components maker Evercast Precision, totaling no more than...
Monday 11 May 2026
PCL Technologies to buy precision plastics and metal parts maker to target CPO components for data centers
PCL Technologies announced that its board approved a plan to acquire 100% of Pingood Group, including Pingood Enterprise Co., Pingood (Thailand) Co., Ltd., Pingji Electronics (Dongguan)...
Monday 11 May 2026
Samsung eyes Exynos 2700 as test for chip-unit recovery
Samsung Electronics is looking to the tentatively named Exynos 2700 application processor (AP) as a key test for its non-memory semiconductor recovery, with the chip's adoption rate...