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Tuesday 29 September 2026
TSMC helps VSMC build first Singapore fab in 22 months at lower cost than US
VSMC, the joint venture between Vanguard International Semiconductor (VIS) and NXP Semiconductors, officially opened its first 12-inch wafer fab in Singapore on September 28, completing...
Tuesday 29 September 2026
Qualcomm, Liquid AI tout on-device AI potential at Snapdragon Summit
Qualcomm Technologies held its Snapdragon Summit 2026 in Maui, Hawaii, from September 22 to 24. During the keynote on the second day, Qualcomm president and CEO Cristiano Amon spoke...
Tuesday 29 September 2026
Meta adds camera-free AI glasses as Samsung prepares 2026 launch
Meta has introduced a camera-free smart glasses model while Samsung Electronics prepares to enter the AI glasses market in 2026, as privacy concerns and product design trade-offs reshape...
Tuesday 29 September 2026
Advantech's North America expansion signals a deeper shift toward local manufacturing, services

Advantech is expanding manufacturing, engineering, and fulfillment capabilities in North America as demand grows for locally designed...

Tuesday 29 September 2026
Behind CoWoS (part 2): How TSMC turned a niche packaging experiment into an industry standard
As chip design enters the AI era, heterogeneous integration is driving foundry giants like TSMC, Samsung, and Intel to bring advanced front-end fab capabilities into back-end packaging...
Sunday 27 September 2026
Keysight pushes design-to-deployment standard for AI cluster validation

As AI applications expand rapidly across industries, testing and validation have become essential to moving innovation from R&D...

Thursday 24 September 2026
Cadence, Synopsys certify TSMC A14 design flows ahead of 2028 production

Cadence Design Systems and Synopsys have achieved certification for key design flows on TSMC's A14 process, expanding the design ecosystem...

Thursday 24 September 2026
Samsung reportedly shifts sub-10nm DRAM roadmap toward hybrid bonding
Samsung Electronics has reportedly revised the roadmap for its first sub-10nm DRAM generation, making a wafer-to-wafer hybrid-bonding architecture the baseline for its D0a process...
Thursday 24 September 2026
Industrial software giants race to build industry world models
While generative AI has surged into mainstream consumer use thanks to ChatGPT, the adoption of AI across industrial sectors has progressed at a much slower pace. Industry analysts...
Thursday 24 September 2026
LSTC links with Rapidus to revive Japan's advanced chipmaking

Japan's Leading-edge Semiconductor Technology Center (LSTC) is building a public-private-academic framework around Rapidus, which plans...

Wednesday 23 September 2026
Taiwan tire maker Cheng Shin turns 'virtual tires' into an EV development weapon

Taiwanese tire maker Cheng Shin Rubber, best known for its Maxxis brand, is nearing its 60th anniversary and using AI and digital twins...

Wednesday 23 September 2026
Lightmatter launches an optical module that cuts AI cluster fiber in half
US photonics company Lightmatter has launched an optical module that sends and receives data over a single strand of fiber. The company says this halves the cabling needed to connect...
Tuesday 22 September 2026
Anthropic, OpenAI expected to start buying memory directly in 2027
Anthropic and OpenAI are expected to start buying memory directly from manufacturers in 2027 as model developers take greater control of chip and data-center design, potentially broadening...
Tuesday 22 September 2026
Apple's reported AI server push could reshape its role in enterprise infrastructure

Apple is reportedly developing an enterprise AI inference server powered by its in-house M8 Ultra chips. This move could mark its return...

Monday 21 September 2026
SK Hynix pushes deeper into logic for next-generation 3D DRAM

SK Hynix is pushing deeper into logic design as it develops a next-generation 3D DRAM architecture that could separate memory-cell processing...