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    Column: Taiwan suppliers map entry into the US Space Force supply chain
    6h 4min ago
    Samsung plans 2 nm GAA base die for HBM5 to boost AI memory speed
    6h 4min ago
    AI demand squeezes memory supply, pressuring PC and TV markets
    6h 4min ago
    Huawei reportedly plans glass substrate mass production in 2027 for AI chips
    6h 4min ago
    China's GenAI race shifts to open source ecosystems
    6h 4min ago
    Alibaba Cloud and Huawei quickly adapt Kimi K3 after open-source release
    6h 4min ago
    Commentary: China’s 2026 tech breakthroughs is reshaping its industry
    6h 4min ago
    NEWS TAGGED DESIGN
    Tuesday 28 July 2026
    Samsung trims Z Fold8 display module 10% using Flex Titanium
    Samsung Electronics has introduced Flex Titanium technology in its next-generation foldables, the Galaxy Z Fold8 and Z Fold8 Ultra, cutting display module thickness by 10% to make...
    Tuesday 28 July 2026
    Cadence raises 2026 outlook after record quarter, flags major Intel deal as revenue driver

    Cadence Design Systems posted stronger-than-expected second-quarter results on July 27 and raised its full-year revenue growth outlook...

    Tuesday 28 July 2026
    Nvidia remaps Asia's AI supply chain, raising fresh questions over Taiwan's edge
    Generative AI is reshaping the semiconductor and electronics industries while redefining how global supply chains divide roles across design, manufacturing, infrastructure, and app...
    Tuesday 28 July 2026
    From models to chips: Anthropic chip ambitions pull Korea deeper into the AI silicon race
    The push toward deeper sovereign control over the critical hardware stack underpinning AI models is gaining traction following news of Anthropic's outreach to SK hynix for supplies...
    Tuesday 28 July 2026
    Taiwan urged to move beyond hardware role in AI glasses race
    As global tech giants push into AR, VR, and spatial computing, Taiwan's chip and hardware strength could help it shape the next wave of AI glasses for users worldwide. But that opportunity...
    Monday 27 July 2026
    Nvidia's Vera CPU targets go beyond Intel and AMD
    After Nvidia has grown into a global giant on GPUs, why is it suddenly delving into CPUs? At first glance, its Vera is entering the server CPU market, where its rivals are naturally...
    Monday 27 July 2026
    Pegatron unveils AMD EPYC server platform for AI and HPC
    Pegatron unveiled a new server platform powered by AMD's sixth-generation EPYC processors at AMD Advancing AI 2026, targeting enterprise AI, agentic AI, high-performance computing...
    Monday 27 July 2026
    India's NIELIT and SCL expand access to indigenous semiconductor design kit through eChipHub
    India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process...
    Monday 27 July 2026
    IndieSemiC, Semtech partner on RISC-V IoT platform as India expands semiconductor design ecosystem
    Gujarat-based fabless semiconductor startup IndieSemiC has partnered with US-based semiconductor supplier Semtech Corporation to develop a new RISC-V-based system-in-package (SiP)...
    Monday 27 July 2026
    Samsung opens preorders for new foldables as Apple entry expected to reshape market
    Samsung Electronics has opened preorders for its latest Galaxy Z foldable smartphones and Galaxy smartwatches, introducing new devices as the global foldable smartphone market is expected...
    Saturday 25 July 2026
    Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
    Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
    Saturday 25 July 2026
    Huaqin's growing stake in Nexchip shows ODMs reaching upstream into chipmaking
    Huaqin Technology, the world's largest consumer-electronics original design manufacturer, has again increased its stake in Chinese foundry Nexchip Semiconductor, underscoring how contract...
    Friday 24 July 2026
    SK Hynix seeks US engineers for 3D stacked DRAM push

    SK Hynix is recruiting engineers in San Jose to co-design 3D stacked DRAM-on-logic with US customers, extending its custom memory strategy...

    Friday 24 July 2026
    Nvidia 800V HVDC enters production in 1Q27, Delta set for 2Q ramp
    SemiAnalysis recently forecast that large-scale deployment of Nvidia's native single-ended 800V high-voltage direct current power architecture could slip from the market's previous...
    Thursday 23 July 2026
    Moonshot AI model challenges EDA moat with 2-day chip design
    China AI startup Moonshot AI has drawn intense attention from the semiconductor industry after unveiling its new large language model Kimi K3, which delivered strong results across...
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    Research Report Database
    BIZ FOCUS
    Jun 1, 08:00
    LITEON Showcases AI at COMPUTEX Panel Featuring NVIDIA, Infineon, GIGABYTE
    Friday 29 May 2026
    Datotek Introduces AI PSSD Sustainable Storage Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    AGI Debuts DDR5 R-DIMM and Smart Industrial Solutions at COMPUTEX 2026
    Thursday 28 May 2026
    VIA Labs Announces MST Hub Controllers for Multi-Display USB-C Docking
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