MicroIP said on Sept. 10 that it secured a systems integration contract worth about NT$630 million for a major AI smart residential project in northern Taiwan. The agreement is expected...
STMicroelectronics (ST) recently shared its perspective on balancing AI growth with sustainability during a press conference in Taiwan. The company emphasized that controlling carbon...
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU...
AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
Himax Technologies this week announced an industry-leading automotive touch and display driver integration chip (TDDI) that supports a high-speed eDP interface, combining eDP, touch...
For Samsung Electronics' two loss-making logic businesses, OpenAI's declaration that it is jointly producing and researching next-generation chips with the Korean company matters less...
SEMIFIVE has begun mass production of HyperAccel's data center inference accelerator using Samsung Foundry's 4nm process, marking the Korean custom-silicon company's first large-scale...
Arm is stepping up its role in AI infrastructure as cloud providers, original equipment makers, and software partners build systems for agentic AI, a shift that could affect data centers...
Qualcomm's multi-generation agreement to build customized AI inference silicon and optical interconnects for Amazon gives the company something its data center roadmap has lacked since...
Samsung Electronics has moved to accelerate its silicon photonics push by using the same test partners selected by Taiwan Semiconductor Manufacturing Co. for key validation work, according...
Indian chip design company IndieSemiC is targeting shipments of 3 to 5 million locally made Wi-Fi modules in FY27-28, betting that security requirements for CCTV equipment will encourage...
SK Hynix reportedly ended talks with LG Electronics over outsourcing part of the backend design for a next-generation enterprise SSD (eSSD) controller, but the memory maker told DIGITIMES...
