Samsung Electronics is preparing to escalate the foldable smartphone race. Industry sources say the company plans to launch a new foldable handset, internally dubbed "Wide Fold,"...
The rapid growth of generative AI and large-scale models has significantly increased power consumption in computing chips, pushing thermal management into critical focus. High-end...
Samsung has recruited semiconductor veteran John Rayfield, formerly a vice president at AMD, to bolster its Exynos GPU and system IP roadmap, signaling a renewed effort to regain...
Major contract electronics makers are accelerating strategic realignments in line with the rapid development of automotive electronics and architectures for software-defined vehicles...
Unlike IC design brands, IDM companies are typically conservative regarding demand conditions for the automotive chip market. The difference is partly related to operating base levels...
Amid sustained investments in AI computing infrastructure fueled by cloud service providers (CSPs) and large data centers, a structural differentiation has quietly emerged in the...
Cloud computing, GenAI, and high-performance computing continue to drive bandwidth and energy efficiency demands. Line rates have now been pushed beyond 100–200Gbps. The intense...
Samsung Electronics has moved ahead in the race to supply next-generation AI server memory, providing Nvidia with samples of its SOCAMM2 LPDDR-based modules. The development signals...
Onsemi has signed a collaboration agreement with GlobalFoundries to develop and manufacture next-generation gallium nitride (GaN) power devices, expanding its power semiconductor...
SK Hynix is accelerating the build-out of its M15X memory chip plant in Cheongju, South Korea, as the company installs manufacturing tools and moves into the final engineering phase...
A South Korean logic IC startup is moving closer to cable-free device design with the development of a 60GHz millimeter-wave communication chip designed to replace short-range wired...
On December 17, Rapidus announced a new suite of AI-based semiconductor design tools under its Rapidus AI-Assisted Design Solution (Raads), aimed at supporting the company's Rapid...
imec said it has launched a strategic alignment initiative with Japan's Advanced SoC Research for Automotive (ASRA) to coordinate efforts on standardizing chiplet architectures for...
As AI inference workloads grow and models expand rapidly, Samsung Electronics and SK Hynix are advancing high-bandwidth memory (HBM) technologies while integrating processing-in-memory...
