Powertip Technology is transitioning from a module design and supply company to a solutions provider. The company has seen rising demand in the first half of 2026 as the electronics...
DeepSeek is reportedly working closely with Huawei to influence the design of its future AI chips, a link reportedly closer than typical supplier-customer relationships. The collaboration...
AI computing is pushing packaging density to its limits, with accelerator substrates expected to exceed 100x100mm and expand beyond 120x120mm within the next three to five years. As...
China's electronic design automation (EDA) industry is consolidating, with Shanghai-based S2C and Wuxi-based HyperSilicon merging into a unified digital front-end EDA platform. Backed...
China is proposing to extend AI technology export controls to chip design, memory technologies, and large-scale computing clusters, introducing specific technical thresholds for ea...
Market reports have recently suggested that MediaTek's tensor processing unit (TPU) v9 project with Google could face delays in volume production as Google reportedly revises the chip's...
Rugged edge computing brand – Cincoze has launched its new external EMC solution, the Power Protection Module (PPM), to further strengthen protection against the...
Generative AI is pushing chip power consumption and heat flux to unprecedented levels, driving AI packaging thermal management requirements from several hundred watts to the kilowatt...
Taiwanese electronics makers are deepening their presence in Mexico's Chihuahua state, drawn by surging US demand for AI servers, officials and business leaders told a seminar in Taipei...
Microsoft's early adoption of TSMC's 2nm process, a US$2 billion manufacturing partnership between TSMC and GlobalFoundries, and delays to Google's next-gen TPU highlight diverging...
IBM and Siemens will collaborate on research to develop IBM's nanostack transistor architecture, aiming to move its design toward manufacturing. The work could influence chip performance,...
China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei...
South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development...
Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating...
Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC...
