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Friday 23 May 2025
Trend Micro offers enterprise AI security platform across data in cloud or on-premises; AI security solution integrated with Nvidia enterprise AI factory validated design
Global enterprise cybersecurity leader Trend Micro Incorporated (TYO: 4704; TSE: 4704) today announced that it's bringing powerful and simplified security capabilities to Nvidia Enterprise...
Friday 23 May 2025
Jabil and AVL deal to develop next-gen vehicle electronics

On May 21, Jabil, a global manufacturing solutions provider for the automotive industry, announced that it has signed a memorandum of...

Friday 23 May 2025
OpenAI bets big on hardware: US$6.5B acquisition of io Products signals shift from software to disruptive AI devices
OpenAI is set to acquire hardware startup io Products—founded by former Apple design chief Jony Ive—for nearly US$6.5 billion, marking a bold entry into the consumer hardware...
Thursday 22 May 2025
Xiaomi vaults to 3nm with XRing O1, pairing custom AP with external baseband
Xiaomi's XRing O1 will debut in the 15S Pro smartphone and Pad 7 Ultra, reportedly built on TSMC's second-gen 3nm (N3E) process. With around 19 billion transistors, the chip ranks...
Thursday 22 May 2025
Lotes responds to GB300 design change, aims to enter Nvidia mass production list

As the AI boom continues to reshape the global tech supply chain, Taiwan-based connector manufacturer Lotes is navigating uncertainty...

Thursday 22 May 2025
Texas Instruments champions safe, scalable humanoid robotics at Computex 2025
Safety systems, power efficiency, and seamless communication between more than 40 motors and sensors stand as the primary obstacles to bringing humanoid robots from prototype to production,...
Wednesday 21 May 2025
Altair drives multiphysics simulation solutions to accelerate electronics design innovation
The high power consumption of electronic systems, driven by applications in Artificial Intelligence (AI) and High-Performance Computing (HPC), is generating a significant demand to...
Tuesday 20 May 2025
Huawei unveils HarmonyOS PCs: foldable design, full-stack control, cross-device ecosystem
Huawei, on May 19, 2025, launched its first personal computers powered by HarmonyOS, after five years of development involving more than 10,000 engineers. The MateBook Pro and MateBook...
Tuesday 20 May 2025
Montage Technology embraces CXL innovation to scale memory and bandwidth for enhanced data center performance
Montage Technology is a global fabless semiconductor design company specializing in data processing and interconnect chip solutions. Founded in 2004, the company is headquartered...
Tuesday 20 May 2025
Xiaomi pledges CNY50 billion investment in chip design over next decade
Xiaomi founder and CEO Jun Lei announced on May 19 via Weibo that the company will unveil its first 3nm mobile system-on-chip (SoC), the "Xring O1," on May 22. He also revealed that...
Tuesday 20 May 2025
Xiaomi's XRing SoC: next HiSilicon breakthrough or Zeku-style flameout?
Years after launching the Pinecone Surge S1 in 2017, Xiaomi founder and CEO Lei Jun announced the company's return to in-house smartphone chip design. Its new self-developed SoC,...
Monday 19 May 2025
Pegatron announces Computex 2025 debut as 'TECH MAKER,' poised to drive forward leading innovation
Pegatron Corporation, a global leader in design and manufacturing services (DMS), today announces its inaugural appearance at Computex 2025. The event will be held from May 20 to...
Monday 19 May 2025
Ilitek begins integration of MediaTek's TCON unit, eyes expansion in notebook and industrial markets

Display driver IC design company Ilitek has officially launched the integration of MediaTek's TCON business, a strategic acquisition...

Friday 16 May 2025
Tesla's centralized 'vehicle brain' strategy loses traction as rivals embrace domain-zonal architectures
As the global automotive industry rapidly advances toward next-generation electronic and electrical (E/E) architectures, the combined use of domain controllers and zonal controllers...
Friday 16 May 2025
Cadence showcases AI-driven chip design advances at Taiwan forum
Cadence unveiled several collaborative projects with Taiwan's Ministry of Economic Affairs at its GenIC design forum, highlighting advances in AI-driven semiconductor development.