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    Tuesday 25 August 2026
    Tesla senior chip engineer joins DensityAI as in-house plans face more strain
    Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
    Tuesday 25 August 2026
    Anthropic bets on in-house chips, reshaping ASIC orders
    Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
    Tuesday 25 August 2026
    Kaynes Technology and BOSGAME sign MoU to expand India market presence
    Kaynes Technology India and BOSGAME have signed a strategic memorandum of understanding to support BOSGAME's entry and expansion in India. The deal highlights how global hardware brands...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Tuesday 25 August 2026
    Russia's reusable Amur SPG rocket slips to 2031

    Russia's space agency Roscosmos has again delayed development of its first reusable rocket, Amur SPG, with its first launch now reportedly...

    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Monday 24 August 2026
    AI chip roadmaps force faster changes in data-center design, Cadence says
    Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
    Monday 24 August 2026
    Interview: Inside Foxconn's playbook for the sovereign AI data center race
    Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Monday 24 August 2026
    India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
    India has announced an INR625 billion (US$6.53 billion) Mobile Phone Manufacturing Scheme aimed at moving the country's electronics industry beyond large-scale assembly and toward...
    Monday 24 August 2026
    Xiaomi unveils second-generation humanoid robot at Beijing conference

    Xiaomi unveiled its second-generation humanoid robot at the 2026 World Robot Conference in Beijing, where the machine made its first...

    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    Honor Robot Phone moves from concept to mass production

    With the official launch of Honor's new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    800VDC adoption in AI data centers is set to reshape power chip demand
    A shift to 800VDC power architectures in next-generation AI data centers is gathering pace, with implications for GPU planning, power semiconductor demand, and rack design. Many vendors...
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    BIZ FOCUS
    Aug 25, 08:00
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    Tuesday 25 August 2026
    CYP Launches 4K60 Seamless Matrix Switcher to Simplify Multi-Source Operation
    Monday 24 August 2026
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
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