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    Taiwanese suppliers expand China capacity with AI components in focus
    Aug 24, 18:36
    Commentary: YMTC IPO highlights strong profits but three hurdles remain
    Aug 24, 18:36
    Foxconn's China investment returns lead Taiwan peers on AI and HPC demand
    Aug 24, 18:36
    Nvidia and SK Hynix diverge on CPO as 3D optics-centric design may arrive after 2030
    Aug 24, 18:36
    Tactical drone market shifts as startups and incumbents compete and cooperate
    Aug 24, 18:36
    NEWS TAGGED DESIGN
    Monday 24 August 2026
    AI chip roadmaps force faster changes in data-center design, Cadence says
    Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
    Monday 24 August 2026
    Interview: Inside Foxconn's playbook for the sovereign AI data center race
    Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Monday 24 August 2026
    India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
    India has announced an INR625 billion (US$6.53 billion) Mobile Phone Manufacturing Scheme aimed at moving the country's electronics industry beyond large-scale assembly and toward...
    Monday 24 August 2026
    Xiaomi unveils second-generation humanoid robot at Beijing conference

    Xiaomi unveiled its second-generation humanoid robot at the 2026 World Robot Conference in Beijing, where the machine made its first...

    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    Friday 21 August 2026
    Honor Robot Phone moves from concept to mass production

    With the official launch of Honor's new Robot Phone, foreign media outlets have renewed their attention on how Chinese smartphone makers...

    Friday 21 August 2026
    Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains
    The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...
    Friday 21 August 2026
    800VDC adoption in AI data centers is set to reshape power chip demand
    A shift to 800VDC power architectures in next-generation AI data centers is gathering pace, with implications for GPU planning, power semiconductor demand, and rack design. Many vendors...
    Friday 21 August 2026
    Longcheer and Luxshare move into robot ODM
    China consumer electronics ODMs are extending their R&D, supply chain integration and mass production capabilities into the embodied AI robot market. Longcheer announced on August...
    Thursday 20 August 2026
    SK Hynix's new HBM team lands in Nvidia and AMD's backyard — co-design is becoming the way to win HBM4 orders
    SK Hynix is reported to be assembling a high-bandwidth memory (HBM) design team in Silicon Valley, a move that would deepen its co-design work with major US chip customers. Analysts...
    Thursday 20 August 2026
    Qualcomm targets NT$10,000 entry-level PCs as 4 brands adopt
    Qualcomm is moving into the entry-level PC market with its Snapdragon C platform as Apple's US$599 MacBook Neo and surging DRAM and NAND costs squeeze low-priced Windows laptops from...
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services

    With more than 35 years of experience in ASIC design services, Progate Group Corporation (PGC, TPEx: 8227), a member of the TSMC Design Center Alliance (DCA) and a Synopsys...

    Wednesday 19 August 2026
    China's new automotive chip rules target the last mile to vehicle adoption

    China has introduced five automotive chip certification and accreditation industry standards aimed at easing a key obstacle to domestic...

    Tuesday 18 August 2026
    Mitsubishi taps Foxconn EV platform for ASX VR-e launch

    Mitsubishi Motors will launch its new all-electric SUV, the ASX VR-e, in Australia and New Zealand in the fourth quarter of 2026, with...

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    BIZ FOCUS
    Aug 24, 08:00
    STMicroelectronics Unveils ISO 21780-Compliant 48V Pre-Driver with 8-Channel Flexibility
    Monday 24 August 2026
    iCometrue to Showcase Glass-Based AI Multichip Packaging Solutions at SEMICON Taiwan 2026
    Thursday 20 August 2026
    Corning-IRICO Trade Secret Case Enters New Phase
    Thursday 20 August 2026
    PGC Helps Startups Accelerate ASIC Development with Turnkey Services
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