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Tuesday 6 October 2026
Huawei's Kirin 9050 Pro reveals new logic folding chip design
Huawei's Kirin 9050 Pro has been fully broken down by Chinese and overseas researchers, giving the market a closer look at the company's "LogicFolding" approach. Analysis from Geekerwan...
Tuesday 6 October 2026
Meta open-sources Muse Gadgets SDK for building AI devices
Meta has open-sourced the Muse Gadgets software development kit (SDK) and firmware code, allowing developers to build physical devices that interact with its AI assistant Muse and...
Monday 5 October 2026
Samsung opens Boston quantum design lab to expand US research push
Samsung Electronics has set up a Quantum Design Lab in the Boston area of Massachusetts and started hiring for it, marking a new phase in the company's push into quantum computing...
Monday 5 October 2026
Foxconn move smart long-term care pilot into real care settings
Foxconn and Shiangbao Longterm Care Group have advanced their smart long-term care collaboration into proof-of-concept trials at three care sites in Taiwan. The pilot, launched in...
Monday 5 October 2026
Kyushu's chip expo expands as Japan adds a chip design focus
Japan's Kyushu Semiconductor Industry Exhibition, known as K-Semi, grew 36% at this year's edition in Fukuoka, held from September 30 to October 1, 2026, as chip makers expanded their...
Monday 5 October 2026
Japan's strategic push to reclaim silicon supremacy with Rapidus
In a major effort to rebuild its national semiconductor industry, Japanese contract chipmaker Rapidus plans to partner with 17 domestic and international design firms to broaden its...
Monday 5 October 2026
Exclusive: A*STAR IME's Yu-chieh Chien targets next-gen SiC through 8-inch R&D, reliability gains

Singapore is building a semiconductor R&D hub by attracting both multinational investment and overseas research talent. Dr Yu-chieh Chien,...

Monday 5 October 2026
AI system integration eclipses chip specs
As AI develops rapidly across both cloud and edge environments, major chipmakers are devoting less attention to chip specifications and more to system-level design and ecosystems....
Saturday 3 October 2026
Synopsys reshapes EDA, IP business models as AI shifts revenue from seats to customer output
Synopsys is reshaping how it monetizes its two core businesses, electronic design automation (EDA) and semiconductor IP, as AI transforms engineering workflows. Announcements at the...
Friday 2 October 2026
Micron eyes NVHBM profits with TSMC custom HBM push
Micron is using an externally manufactured base die in NVHBM, a custom high-bandwidth memory (HBM) product it is co-developing with Nvidia, as the company bets that customization can...
Friday 2 October 2026
CSPs embrace multi-vendor co-design for custom ASICs, ending single-supplier era
Hyperscale cloud service providers (CSPs) are expanding their custom ASIC partner networks, accelerating a shift toward multi-vendor technology integration. Industry insiders note...
Thursday 1 October 2026
Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development
Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...
Thursday 1 October 2026
Qualcomm, Samsung redesign chip packaging as heat limits phone performance
Qualcomm and Samsung Electronics are redesigning how memory is packaged with flagship smartphone processors, as rising chip performance puts greater pressure on the limited cooling...
Thursday 1 October 2026
Synopsys raises long-term growth and margin targets, guides fiscal 2027 revenue to US$11.15 billion
Synopsys is betting that custom silicon and AI-driven chip design will lift its growth above the double-digit pace it previously targeted. At its investor day in New York on September...