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Friday 13 November 2026
Qualcomm begins India job cuts as handset chip sales slide
Qualcomm has started laying off employees in India, its largest engineering base outside the US, as the chipmaker carries out a performance-focused global workforce reduction amid...
Thursday 12 November 2026
Huawei's new OSTA smartphone brand targets wider displays, AI features ahead of November 20 debut
Huawei is preparing to introduce a new smartphone sub-brand, OSTA, at a product launch event on November 20, potentially expanding its portfolio with a wider-format candybar smartphone...
Thursday 12 November 2026
Tekscend's cost strategy and global edge
As global foundry capacity expands and market dynamics shift, competitive pressures have intensified significantly across major manufacturing regions, particularly in mature process...
Thursday 12 November 2026
Apple, Samsung reportedly developing new foldable glass for 2028
Apple and Samsung Electronics are working with suppliers on foldable phone glass that is thinner at the hinge and thicker elsewhere, a design they are considering for 2028 models,...
Thursday 12 November 2026
TECO pivots to AI infrastructure services with Japan project
TECO Electric & Machinery is expanding into global AI computing infrastructure, announcing on the November 11 that it will partner with AI cloud service provider GMI Cloud and...
Wednesday 11 November 2026
Samsung targets early 2027 for first 3D Cube-H design kit
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Wednesday 11 November 2026
Alibaba files to spin off chip design unit T-Head for Hong Kong IPO
Alibaba filed for a Hong Kong IPO for its chip design unit, T-Head, as a spin-off on November 10. The separate listing would let investors gain direct exposure to the group's chipmaking...
Wednesday 11 November 2026
SK Hynix taps HBM veteran to lead US business as competition intensifies
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
Wednesday 11 November 2026
Intel expands 18A reach with Wildcat Lake AI PC chips
Intel is expanding its computing platform strategy for agentic AI and enterprise workloads with the Intel Core Series 3 processor, codenamed Wildcat Lake, targeting mainstream consumer...
Wednesday 11 November 2026
Taiwan lets companies fast-track or delay patent examinations
Taiwan's Intellectual Property Office (TIPO) has introduced measures allowing companies to accelerate or delay patent examinations based on their business strategies. Intel, MediaTek,...
Wednesday 11 November 2026
China's Huaqin looks beyond AI servers with US$150M wafer foundry investment
China's leading smart-device original design manufacturer (ODM), Huaqin Technology, plans to invest CNY1 billion (approx. US$149.86 million) in a wafer foundry venture, strengthening...
Wednesday 11 November 2026
Wave Photonics eyes Singapore as Asian quantum hub
UK photonic integrated circuit (PIC) startup Wave Photonics is expanding in Asia and, despite partnerships with the Hon Hai Research Institute (HHRI) and Taiwan-based EDA companies,...
Tuesday 10 November 2026
Automotive architecture shifts to zonal control as AI cyber risks rise
Automotive electrical/electronic architecture (E/EA) continues to evolve—moving from early distributed control systems to today's mature domain-based architectures, and now ushering...
Tuesday 10 November 2026
Samsung SDI reportedly set to lead early battery supply for Boston Dynamics' Atlas
Samsung SDI is expected to provide most of the initial battery supply for Atlas, the humanoid robot developed by Hyundai Motor Group's Boston Dynamics, according to South Korean industry...