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    NEWS TAGGED DESIGN
    Saturday 2 May 2026
    After buying Ansys, Synopsys starts merging the two stacks

    Hardware design is entering a system-level reset, with Synopsys moving simulation to the core of product development. With Ansys 2026...

    Friday 1 May 2026
    Hardware bottlenecks emerge as humanoid robotics race intensifies
    Competition in humanoid robotics has intensified in recent years, with advances in artificial intelligence and machine learning often cited as the main drivers of progress. However,...
    Wednesday 29 April 2026
    Supermicro opens largest US campus in Silicon Valley, producing AI infrastructure
    Supermicro's new 32.8-acre Silicon Valley campus will add hundreds of US positions and expand domestic production of AI infrastructure, signaling increased US capacity for enterprises...
    Wednesday 29 April 2026
    Data center power and cooling overhaul will reshape global AI infrastructure
    Rising AI server power density is forcing data centers to adopt centralized, higher-voltage power and upgraded cooling, with implications for operators, suppliers, and investors. Shifts...
    Wednesday 29 April 2026
    Kemflo bets on BIM and recycling tech to target US$100 billion semiconductor water market
    Kemflo announced it is positioning its BIM design and recycling technologies to capture growing demand for industrial water treatment from the semiconductor and electronics sectors,...
    Wednesday 29 April 2026
    Lexus launches eighth-generation ES in Taiwan with hybrid share nearing 60%
    Hotai Motor Co., the official distributor of Lexus in Taiwan, launched the all-new eighth-generation ES on April 28, unveiling hybrid and pure electric versions as part of a multi-pathway...
    Wednesday 29 April 2026
    Nvidia's LPX cabinet and Foxconn's supply lead reshape inference-era AI infrastructure
    The shift from model training to real-time inference, driven by open-source agent applications, is reshaping global data center design and supplier dynamics, with implications for...
    Tuesday 28 April 2026
    Commentary: Honor retools for humanoid robotics, rewrites AI device playbook

    Honor's surprise win at this year's Beijing humanoid robot half-marathon has stirred industry debate, not only for its on-track performance...

    Tuesday 28 April 2026
    Empyrean draws retail inflows while profit falls, testing China EDA valuations
    China's domestic EDA software developer Empyrean Technology is attracting a growing base of retail investors even as its earnings weaken, underscoring a widening gap between market...
    Tuesday 28 April 2026
    OpenAI eyes agentic AI phone but faces challenges beyond chip design
    OpenAI's agentic AI phone could reshape mobile markets and supply chains by forcing incumbents to respond. Still, success depends on delivering both interface breakthroughs and competitive...
    Tuesday 28 April 2026
    Emerging supplier targets low-earth orbit satellite market with cryogenic high-frequency cables
    An electronics components firm, U-leam, founded in September 2022, said it is targeting the low-earth orbit satellite market by supplying high-frequency connectors, cable assemblies,...
    Tuesday 28 April 2026
    Cadence signals strong start to 2026 as AI drives growth across EDA and IP

    Cadence Design Systems reported a robust first quarter for 2026, underscoring how accelerating demand for AI is reshaping semiconductor...

    Tuesday 28 April 2026
    AI-driven demand and record backlog fuel Cadence's strong start to 2026
    Cadence Design Systems reported a solid first quarter for 2026, with growth driven by accelerating AI demand and sustained customer investment in chip and system design tools.
    Monday 27 April 2026
    Samsung reportedly breaks 10nm barrier with first single-digit nanometer DRAM working die
    Samsung Electronics has reportedly become the first company in the world to develop a single-digit nanometer-class 10a DRAM working die, using the prototype to fine-tune process conditions...
    Monday 27 April 2026
    HCL-Foxconn JV taps Taiwan's CTCI to build India OSAT facility
    The HCL-Foxconn joint venture has selected Taiwan-based engineering firm CTCI as the engineering, procurement, and construction (EPC) partner for its upcoming outsourced semiconductor...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook