CONNECT WITH US
NEWS TAGGED DESIGN
Tuesday 15 September 2026
Sivers Semiconductors positions laser arrays as solution to copper's limits

At this year's China International Optoelectronic Expo (CIOE), Sivers Semiconductor brought two products to its booth that trace the...

Tuesday 15 September 2026
Swiss drone maker shifts production to Taiwan

Shinkong Synthetic Fibers Corporation (SSFC) is working with Swiss drone company Jedsy through its investment in Earthbook, bringing...

Monday 14 September 2026
Foxconn subsidiary broadens AI interconnect role as 1.6T enters deployment
AI data centers are moving decisively toward 1.6T connectivity, with 800G now mainstream in AI clusters and 400G remaining common in general cloud and enterprise deployments.
Monday 14 September 2026
Sandisk recruits engineers in Korea as memory talent race heats up

Sandisk is making an unusual push into engineering recruitment in South Korea, seeking talent across NAND system architecture, NAND...

Monday 14 September 2026
Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

Google Cloud CEO Thomas Kurian recently revealed that Google's overall payback period for AI server investments is less than two years,...

Monday 14 September 2026
CPO nears mass production — next battle about interfaces, yield and maintenance
As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
Monday 14 September 2026
AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon c...
Monday 14 September 2026
India's chip show nearly doubles in two years, with suppliers leading the build-out
The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies,...
Friday 11 September 2026
Taiwan govt boosts EDA R&D to target global gaps
Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
Friday 11 September 2026
Huawei, Xiaomi, Apple take different bets on foldables

Competition in the foldable smartphone market is intensifying as Huawei, Xiaomi, and Apple roll out or prepare next-generation foldable...

Friday 11 September 2026
Apple makes the hinge, not the screen, the centerpiece of its first foldable
Apple has built its first foldable around a component nobody sees. The iPhone Duo, unveiled 9 September and on sale from 23 October at a starting price of US$1,999, is defined less...
Friday 11 September 2026
Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a...
Thursday 10 September 2026
MicroIP lands NT$630 million AI smart-building contract in northern Taiwan
MicroIP said on Sept. 10 that it secured a systems integration contract worth about NT$630 million for a major AI smart residential project in northern Taiwan. The agreement is expected...
Thursday 10 September 2026
STMicroelectronics ties AI data center carbon cuts to power design, not location
STMicroelectronics (ST) recently shared its perspective on balancing AI growth with sustainability during a press conference in Taiwan. The company emphasized that controlling carbon...
Thursday 10 September 2026
SK Hynix says 3D DRAM will borrow from logic foundry playbook
SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...