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Monday 19 October 2026
China probes Huawei-JAC Maextro V800 over brake pedal failure
China's premium electric vehicle (EV) market is facing renewed safety scrutiny following product defect concerns. Maextro, an ultra-luxury automotive brand jointly developed by Huawei...
Monday 19 October 2026
TSMC's only South Korean VCA partner ASICLAND eyes AI chip growth via Taiwan R&D
South Korean ASIC design solutions provider ASICLAND showcased its proprietary AxHub AI chip design and verification platform at SEDEX 2026 as it seeks to accelerate custom chip development...
Monday 19 October 2026
Micron develops robot memory as Samsung, SK Hynix target physical AI
Micron is developing a memory architecture for humanoid robots, joining Samsung Electronics and SK Hynix in efforts to serve AI systems that must process sensor data while operating...
Monday 19 October 2026
Nvidia's custom HBM pulls Samsung onto TSMC's 3nm process, report says
Nvidia's custom memory design is shifting control of how high-bandwidth memory (HBM) is built from memory makers to its largest customer, and steering a key part of that work to TSMC...
Friday 16 October 2026
AI server tracker: semiconductor testing and design services rally on compute demand
Within AI server tracking data, a clear parallel growth trajectory has emerged between semiconductor testing interface providers and chip design houses. Driven by the surge in artificial...
Friday 16 October 2026
Samsung, SK Hynix aim to ease AI memory bottlenecks with zHBM, HBF
Samsung Electronics and SK Hynix are developing new memory technologies to address growing bottlenecks in AI systems, with Samsung exploring a design that stacks high-bandwidth memory...
Friday 16 October 2026
China's YMTC targets 9,600 MT/s with 4F² DRAM design
China's Yangtze Memory Technologies (YMTC) is developing a next-generation 4F² DRAM design targeting data transfer speeds of 9,600 megatransfers per second (MT/s), expanding beyond...
Thursday 15 October 2026
Synopsys CEO says fully autonomous AI chip design remains out of reach
Synopsys CEO Sassine Ghazi said that fully autonomous chip development has not yet crossed the final hurdle to become reality, although the company has advanced from AI-assisted engineering...
Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be...
Thursday 15 October 2026
Onsemi and Sungrow deepen battery storage tie-up as demand rises for grid power
Onsemi has said its latest EliteSiC hybrid power module is now being used in Sungrow's PowerTitan 3.0 energy storage platform, a move aimed at improving efficiency, power density,...
Thursday 15 October 2026
Commentary: AI power demand pushes Taiwan's energy industry toward integrated systems
Energy Taiwan 2026 showcases an energy industry increasingly focused on integration, flexibility, and real-world deployment, as Taiwan balances its net-zero ambitions with rising electricity...
Thursday 15 October 2026
HiSilicon expands DDI push across all display sizes

Huawei subsidiary HiSilicon is actively expanding its display chip footprint, with its display driver IC (DDIC) development once again capturing...

Wednesday 14 October 2026
AVC unveils 6MW In-Row CDU at OCP, adds predictive cooling
Asia Vital Components (AVC) unveiled new liquid-cooling solutions, including direct liquid cooling (DLC) and an In-Row CDU, at the Open Compute Project (OCP) Global Summit, held October...
Wednesday 14 October 2026
AI computing demand drives water management integration at Tianyi
Rising AI computing demand is fueling capacity expansion in advanced semiconductor manufacturing, making water recycling, energy efficiency, and smart operations and maintenance key...
Wednesday 14 October 2026
Largan chairman casts doubt on Micro LED links for AI data centers
Largan Precision chairman En-ping Lin has questioned the viability of Micro LED-based optical links for AI data centers, citing concerns over power consumption, size, and transmission...