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    Resonac develops 12-inch SiC substrate to target AI and EV demand
    6h 31min ago
    High-end GPUs may be slowing China’s AI compute expansion
    6h 31min ago
    2026 smartphone SoC battle centers on NPU as vendors boost cores and memory for agentic AI
    6h 31min ago
    LGES and Samsung SDI ESS orders reportedly fill two years of North America capacity
    6h 31min ago
    Analysis: China's 15th five-year plan spotlights diamond materials for AI cooling
    6h 31min ago
    NEWS TAGGED DESIGN
    Monday 14 September 2026
    Google TPU pays back investment in 1 year, creating upside for MediaTek, Broadcom ASIC revenues

    Google Cloud CEO Thomas Kurian recently revealed that Google's overall payback period for AI server investments is less than two years,...

    Monday 14 September 2026
    CPO nears mass production — next battle about interfaces, yield and maintenance
    As AI computing bandwidth keeps rising, optical interconnect architectures are moving beyond pluggable optical modules toward near-packaged optics (NPO) and co-packaged optics (CPO)...
    Monday 14 September 2026
    AI server tracker: Taiwan ASIC design houses diverge as AI projects enter different revenue cycles
    Taiwan's ASIC design-service suppliers all posted year-over-year revenue growth in August 2026, but the underlying figures point to sharply different stages of the custom-silicon c...
    Monday 14 September 2026
    India's chip show nearly doubles in two years, with suppliers leading the build-out
    The exhibitor list for Semicon India 2026 suggests the country's semiconductor push has moved past announcements and into procurement. The show has drawn 535 exhibiting companies,...
    Friday 11 September 2026
    Taiwan govt boosts EDA R&D to target global gaps
    Taiwan's National Science and Technology Council (NSTC) briefed Premier Jung-tai Cho on September 10, 2026, at an Executive Yuan meeting on the Chip-Driven, Taiwan-wide semiconductor...
    Friday 11 September 2026
    Huawei, Xiaomi, Apple take different bets on foldables

    Competition in the foldable smartphone market is intensifying as Huawei, Xiaomi, and Apple roll out or prepare next-generation foldable...

    Friday 11 September 2026
    Apple makes the hinge, not the screen, the centerpiece of its first foldable
    Apple has built its first foldable around a component nobody sees. The iPhone Duo, unveiled 9 September and on sale from 23 October at a starting price of US$1,999, is defined less...
    Friday 11 September 2026
    Samsung 2nm push gains momentum as Synopsys cuts NPU die area by 22%
    Synopsys has reported a 22% reduction in die area for a neural processing unit (NPU) implemented with its Fusion Compiler design tool on Samsung Foundry's SF2P process, providing a...
    Thursday 10 September 2026
    MicroIP lands NT$630 million AI smart-building contract in northern Taiwan
    MicroIP said on Sept. 10 that it secured a systems integration contract worth about NT$630 million for a major AI smart residential project in northern Taiwan. The agreement is expected...
    Thursday 10 September 2026
    STMicroelectronics ties AI data center carbon cuts to power design, not location
    STMicroelectronics (ST) recently shared its perspective on balancing AI growth with sustainability during a press conference in Taiwan. The company emphasized that controlling carbon...
    Thursday 10 September 2026
    SK Hynix says 3D DRAM will borrow from logic foundry playbook
    SK Hynix is signaling a shift in memory design that could matter far beyond South Korea. By adopting logic foundry techniques for 3D DRAM, the company is moving toward a future where...
    Thursday 10 September 2026
    Samsung trims foundry partner network as remaining DSPs gain momentum
    Samsung Electronics has reduced its foundry Design Solution Partner (DSP) network to 11 companies from 13, as the chipmaker shifts toward greater emphasis on partners that can secure...
    Thursday 10 September 2026
    Loongson raises funds to expand CPU and GPU development as AI inference boosts domestic chip plans
    Chinese CPU maker Loongson recently announced a CNY2.3 billion (approx. US$342.7 million) capital increase, with the funds mainly going into information technology chips and core CPU...
    Thursday 10 September 2026
    Nvidia reportedly drives testing interface capacity crunch, pushes Taiwan suppliers
    AI chip demand is tightening high-end testing interface capacity, and supply-chain sources say Nvidia has raised prices to secure most of the probe card and test socket output from...
    Thursday 10 September 2026
    Himax launches eDP TDDI for smart cockpit displays
    Himax Technologies this week announced an industry-leading automotive touch and display driver integration chip (TDDI) that supports a high-speed eDP interface, combining eDP, touch...
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    Research_DB
    BIZ FOCUS
    Sep 14, 08:00
    Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects
    Monday 14 September 2026
    Scaling Photonics: Assembly, Test and Fiber Automation at SEMICON Taiwan
    Friday 11 September 2026
    Toward Technologies Redefines Relay Solutions at SEMICON Taiwan 2026
    Friday 11 September 2026
    DAS Expands in Taiwan and Unveils World First at SEMICON
    Semicon_TW