中文網
  • 繁體
  • 简体
    •
    Trending
    CONNECT WITH US
    NEWS TAGGED DESIGN
    Wednesday 26 August 2026
    India chip manufacturing push exposes production-test skills gap, NI says
    India's semiconductor expansion is beginning to expose a shortage of engineers with experience in production testing, a capability that will become increasingly important as new OSAT...
    Wednesday 26 August 2026
    BOE, 3M expand materials partnership as foldable OLED competition intensifies
    BOE Technology Group and 3M have opened a joint research laboratory in Beijing that covers optical films, optically clear adhesives, structural adhesives and advanced materials development...
    Wednesday 26 August 2026
    OpenAI says Jalapeño cuts latency up to 3.6x, targeting the bottleneck that slows agents
    OpenAI said its first custom inference chip, Jalapeño, delivered faster responses and better power efficiency than competing systems in tests across several large language models...
    Tuesday 25 August 2026
    Tesla senior chip engineer joins DensityAI as in-house plans face more strain
    Tesla's senior director of AI hardware design, Shishuang Sun, joined DensityAI in July 2026, taking charge of packaging and system hardware development. The move came as Tesla continued...
    Tuesday 25 August 2026
    Anthropic bets on in-house chips, reshaping ASIC orders
    Anthropic confirmed on August 5 that it is building an internal silicon team to design custom chips for its Claude models, signaling a sharper push into self-developed AI hardware...
    Tuesday 25 August 2026
    Kaynes Technology and BOSGAME sign MoU to expand India market presence
    Kaynes Technology India and BOSGAME have signed a strategic memorandum of understanding to support BOSGAME's entry and expansion in India. The deal highlights how global hardware brands...
    Tuesday 25 August 2026
    TSMC, Intel, and Samsung battle over backside power delivery below 2nm
    As competition in advanced semiconductor manufacturing moves below the 2nm node, the battleground is no longer just shrinking transistors; it has expanded to how power is delivered...
    Tuesday 25 August 2026
    Russia's reusable Amur SPG rocket slips to 2031

    Russia's space agency Roscosmos has again delayed development of its first reusable rocket, Amur SPG, with its first launch now reportedly...

    Tuesday 25 August 2026
    Samsung pushes HBM toward logic, SK Hynix targets packaging at Hot Chips 2026
    Samsung Electronics and SK Hynix outlined different areas of emphasis for overcoming the next high-bandwidth memory (HBM) bottleneck at Hot Chips 2026, with Samsung pushing more logic...
    Monday 24 August 2026
    AI chip roadmaps force faster changes in data-center design, Cadence says
    Rapid changes in the power and thermal requirements of AI accelerators are forcing data-center designers to incorporate chip-level information earlier in the planning process, according...
    Monday 24 August 2026
    Interview: Inside Foxconn's playbook for the sovereign AI data center race
    Foxconn is repositioning its AI data center business around system integration, modular deployment, and sovereign computing, as the rapid growth of GPU infrastructure changes how customers...
    Monday 24 August 2026
    Weekly news roundup: Google diversifies custom chips, TSMC share falls, SK Hynix deepens HBM co-design
    Semiconductor supply chains, custom silicon, high-bandwidth memory (HBM), robotics, and India's chip buildout shaped this week's technology agenda, with major moves from Google, Marvell,...
    Monday 24 August 2026
    India targets domestic mobile phone design capabilities with new US$7.5 billion manufacturing scheme
    India has announced an INR625 billion (US$6.53 billion) Mobile Phone Manufacturing Scheme aimed at moving the country's electronics industry beyond large-scale assembly and toward...
    Monday 24 August 2026
    Xiaomi unveils second-generation humanoid robot at Beijing conference

    Xiaomi unveiled its second-generation humanoid robot at the 2026 World Robot Conference in Beijing, where the machine made its first...

    Friday 21 August 2026
    Xiaomi's Xring O3 nears launch on TSMC N3P, testing its in-house chip strategy
    Xiaomi is preparing to take its in-house smartphone silicon further upmarket, with founder and chairman Lei Jun confirming that a new generation of its Xring chip is on the...
    2/57 pages
    BIZ FOCUS
    Aug 31, 08:00
    NewPower Worldwide expands credit facility to $750M for growth
    Monday 31 August 2026
    Tescan Connects Buried Defect Localization to Nanoscale Analysis at SEMICON
    Thursday 27 August 2026
    ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026
    Tuesday 25 August 2026
    Conquer Advances Circuit Protection for AI Power With 50 Years of Expertise
    reportAIglasses