LG Display (LGD) has fully deployed a self-developed artificial intelligence platform across its design, manufacturing, and business operations, marking a decisive push into digital...
Samsung Electronics plans to begin producing its in-house–designed high-performance CMOS image sensors (CIS) at its Austin, Texas, wafer fab in 2027 for Apple's iPhones. Industry...
Samsung Electronics is advancing development of its next-generation System-on-Panel (SoP) packaging technology, aiming to produce modules significantly larger than those possible...
Seoul Semiconductor, South Korea's leading LED manufacturer and the world's third-largest by market share in 2024, is intensifying its push into the fast-expanding micro LED sector...
Raja Koduri, former chief architect at Intel, has founded Oxmiq Labs, a GPU startup focused on developing and licensing RISC-V International architecture-based GPU hardware and software...
China's semiconductor industry posted CNY455 billion (approx. US$63.3 billion) in total investment during the first half of 2025, down 9.8% from a year earlier, according to a new...
Nvidia is reportedly collaborating with its supply chain to develop an advanced packaging architecture called Chip-on-Wafer-on-PCB (CoWoP) for its Rubin GPU platform. This new design...
SJ Semiconductor (Jiangyin) Corp. (SJ Semi), a major packaging and testing partner of Huawei's chip design arm HiSilicon, has received domestically developed back-end steppers from...
US President Donald Trump signaled on Monday that he'd be open to allowing Nvidia Corp. to sell a scaled-back version of its most advanced AI chip to China.
The accelerating demands of artificial intelligence are redrawing the blueprint of data center infrastructure, driving server design into an era defined by rack-scale integration,...
Taiwanese memory chipmakers are intensifying efforts to capture growth in customized AI applications, unveiling low-power, high-bandwidth alternatives to High Bandwidth Memory (HBM)...
At the OCP APAC 2025 conference, a high-profile panel brought together senior executives from TSMC, ASE, MediaTek, and Synopsys to examine how chiplets, advanced packaging, and next-generation...
Taiwan Space Agency (TASA) has officially announced a large-scale procurement project to industrialize the manufacturing of communications satellites, marking a major step toward...
In the wave of global digitalization and the proliferation of IoT devices, the application scope of wireless equipment has long surpassed traditional boundaries. From smart home appliances...
