CONNECT WITH US
NEWS TAGGED DESIGN
Tuesday 1 October 2024
Status of liquid cooling solutions for AI servers

Introduction

Tuesday 1 October 2024
TSMC talks about key advancements of 3Dblox
TSMC is advancing system-level innovation by improving the 3D IC design ecosystem through enhanced collaboration with foundries, customers, and partners, according to a recent blog...
Monday 30 September 2024
Rising AI server customization fuels supply chain tech upgrades
To meet the growing demand for computing power, cloud service providers are ramping up purchases of AI servers. However, suppliers in the electronic connection industry are finding...
Friday 27 September 2024
AI's role in shaping the future of semiconductor, energy efficiency: insights from Synopsys' VP
As AI continues to captivate the tech world, industry experts are shifting their focus to the next big challenge: energy efficiency. Brandon Wang, vice president of corporate strategy...
Friday 27 September 2024
Unisoc secures CNY4 billion to drive chip innovation and global presence, backed by Pudong Venture Capital
Unisoc, a leading Chinese chip design company, has secured CNY4 billion (US$548 million) in equity financing, primarily through state-backed platforms including Pudong Venture Capital,...
Friday 27 September 2024
US DoD authorizes 83 domestic firms; Taiwan chipmakers target tier 2 supply chain orders
A list of "Accredited Suppliers" for semiconductor design, wafer foundry, packaging, and testing, among other services, was recently published by the Defense Microelectronics Activity...
Friday 27 September 2024
PSMC and Tata finalize fab cooperation, Modi commits to two key promises to Frank Huang
Powerchip has announced the signing of a definitive agreement with Tata Electronics in New Delhi. Under the agreement, Powerchip will assist Tata Electronics in constructing India's...
Wednesday 25 September 2024
MediaTek races ahead with early Dimensity 9400 launch, aims to outpace Qualcomm in 2024
MediaTek is set to launch its latest flagship mobile platform, the Dimensity 9400, with reports indicating its release will come earlier than Qualcomm's in 2024.
Wednesday 25 September 2024
UK showcases compound semiconductor prowess, Wales leads growing partnership with Taiwan
Each year, SEMICON has become a platform for industry players to showcase their advancements and evolved into a stage for nations participating in the global chip war to demonstrate...
Wednesday 25 September 2024
Foxconn-backed automotive IC design house to set up R&D center in India
Foxconn-backed SiliconAuto established a new R&D center in Bengaluru that will specialize in designing semiconductor products and developing SoC solutions for the automotive industry...
Wednesday 25 September 2024
Samsung splits from Naver on AI accelerator project, pursues independent development
Samsung Electronics and Naver previously announced a collaboration to develop artificial intelligence (AI) accelerators for servers. However, recent reports suggest that the two companies...
Wednesday 25 September 2024
Taiwan IC design houses urged to accelerate migration to advanced nodes
Taiwan's government is urging local IC design houses to speed up their migration to advanced semiconductor manufacturing processes to avoid cut-throat pricing competition from China...
Tuesday 24 September 2024
Vietnam unveils semiconductor policy for 2050
Vietnam has unveiled its semiconductor roadmap for 2025-2050, aiming to establish three fabs, 20 integrated circuit (IC) backend houses, and 300 IC design houses as part of its goal...
Monday 23 September 2024
Taiwan leads in semiconductor manufacture; Japan academics urge collaboration
Japan is the industry leader in materials and equipment, while Taiwan maintains an overwhelming advantage in semiconductor manufacturing, according to Takashi Hattori, deputy representative...
Monday 23 September 2024
First OSAT facility supported by former cricketer inaugurated in Maharashtra, India
India-based RRP Electronics inaugurated an INR120 billion (US$1.4 billion) OSAT facility in Maharashtra, the second chipmaking project after Adani-Tower Semiconductor's wafer fab...
Holtek
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research