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NEWS TAGGED 12-INCH WAFER
Wednesday 9 January 2019
Winbond December revenues fall to 20-month low
Winbond Electronics, a maker of specialty DRAM and flash memory, saw its December revenues fall to a 20-month low of NT$3.69 billion (US$119.6 million).
Wednesday 26 December 2018
Xiamen public IC service platform boosts design capability
Xiamen IC Design Public Service Platform has played a crucial role in helping China IC designers operating in the country's southeastern port city upgrade their design and innovation...
Monday 24 December 2018
Foxconn reportedly to start 12-inch semiconductor fab construction in China in 2020
Foxconn Electronics' (Hon Hai Precision Industry) ambition in the chipmaking sector is taking shape. The Taiwan-based conglomerate reportedly has stuck a deal with China's Zhuhai...
Thursday 13 December 2018
UMC to spend NT$27 billion on capacity deployment
The board of directors of United Microelectronics (UMC) has authorized a capital budget execution of NT$27.406 billion (US$889.4 million) for capacity deployment.
Friday 30 November 2018
ASE reportedly to set up IC testing service center in Nanjing
ASE Technology Holding, the parent company of IC packagers Advanced Semiconductor Engineering (ASE) and Siliconware Precision Industries (SPIL), plans to set up an IC testing service...
Thursday 8 November 2018
SMIC expects to post 7-9% revenue decrease in 4Q18
China-based pure-play foundry Semiconductor Manufacturing International (SMIC) expects to post a revenue decline of 7-9% sequentially in the fourth quarter of 2018, with gross margin...
Thursday 1 November 2018
TSMC opens 12-inch fab in Nanjing
Taiwan Semiconductor Manufacturing Company (TSMC) held a ceremony on October 31 to mark the opening of its 12-inch wafer plant in Nanjing, China. Company chairman Mark Liu and CFO...
Tuesday 30 October 2018
Winbond set to ramp up 25nm DRAM chip production in 4Q18
Winbond Electronics saw shipments of chips built using 38nm process technology ramp up substantially to account for 24% of the chipmaker's total DRAM sales in the third quarter of...
Monday 8 October 2018
GlobalWafers to expand 12-inch wafer output in South Korea
Silicon wafer supplier GlobalWafers has disclosed plans to build new production lines for 12-inch wafers at its existing plant in South Korea.
Wednesday 3 October 2018
Winbond starts constructing new 12-inch fab
Winbond Electronics will hold a groundbreaking ceremony for its new 12-inch wafer fab in southern Taiwan on October 3, according to the Kaohsiung city government.
Wednesday 5 September 2018
Powerchip to undertake restructuring
Powerchip Technology has disclosed plans to implement a corporate restructuring project under which the company will transfer all its 12-inch fab operations to subsidiary Maxchip...
Tuesday 28 August 2018
Powerchip to build 2 new 12-inch fabs in Taiwan
Pure-play foundry Powerchip Technology has disclosed plans to construct two new 12-inch wafer fabs in Taiwan with total investment estimated at NT$278 billion (US$9.05 billion).
Monday 20 August 2018
Winbond board approves NT$20 billion for new 12-inch plant establishment
Taiwan-based Winbond Electronics, a manufacturer of specialty DRAM and NOR flash memory, expects to start constructing its new 12-inch wafer plant at the Kaohsiung Science Park (KSP),...
Thursday 16 August 2018
TSMC sees pickup in orders for mining ASICs
Taiwan Semiconductor Manufacturing Company (TSMC) and its design services partners have recently seen orders for cryptocurrency mining chips pick up, as major crypto mining machine...
Thursday 16 August 2018
Cadence to open subsidiary in Nanjing
EDA vendor Cadence Design Systems is scheduled to start operating a new subsidiary in Nanjing, China in September, according to industry sources.