Orders for AMD's Ontario chips, which will be the first Fusion APU the vendor brings to market, are expected to play a key contributor for Taiwan Semiconductor Manufacturing Company's...

Taiwan Semiconductor Manufacturing Company (TSMC) will break ground soon for the construction of Fab 15 at the Central Taiwan Science Park (CTSP), according to an invitation to the...

Powerchip Technology has reiterated its efforts to expand the company's NAND flash business, while maintaining DRAM as a focus. Company chairman Frank Huang revealed recently that...

Samsung Electronics has developed what it claims is the industry's first 32GB load-reduced, dual-inline memory module (LRDIMM) for server applications, according to the company. Mass...

Interuniversity Microelectronics Center (IMEC) has announced the extension of its Europractice IC service with the offering of Taiwan Semiconductor Manufacturing Company's (TSMC's)...

Globalfoundries has announced plans to add nearly 110,000-square feet of clean room space at its 12-inch Fab 1 in Dresden, with the first output from the new facility expected in...

United Microelectronics Corporation (UMC) inaugurated new factory buildings (Phase 3 and Phase 4) at its 12-inch Fab 12A located at the Southern Taiwan Science Park (STSP) on May...

Elpida Memory has developed a 2-gigabit (2Gb) DDR mobile RAM using a 40nm process, according to the company. The new mobile RAM has a chip size of less than 50-square millimeter,...

AMD reportedly plans to outsource wafer starts for its Fusion CPUs with integrated graphics to Taiwan Semiconductor Manufacturing Company (TSMC) using bulk 40nm process technology,...

United Microelectronics Corporation (UMC) has revealed it will hold a ceremony to officially kick off operations of the phase-three and phase-four production facilities at its 12-inch...

United Microelectronics Corporation (UMC) looks to grow sales of chips from 65nm and more advanced technologies, according to UMC CEO Shih-Wei Sun speaking at the company's quarterly...

Taiwan Semiconductor Manufacturing Company (TSMC) has provided positive guidance for the second quarter of 2010, and upwardly revised its forecast for 2010 global semiconductor and...

Elpida Memory has announced that it completed development of a 4Gb DDR3 SDRAM, which it claims is the highest density DDR3 in the DRAM industry.

Winbond Electronics has quietly recruited part of former Qimonda's R&D team and will develop a 46nm Buried Wordline stack process, making it the first Taiwan-based DRAM maker...

Powerchip Semiconductor Corporation (PSC) is set to kick off shipments of its 40nm NAND flash chips in the second half of 2010, according to company chairman Frank Huang. Its flash...