In June 2024, Vanguard International Semiconductor (VIS) and NXP unveiled plans to collaborate on establishing VSMC in Singapore, where they will build a 12-inch wafer fabrication...
In its latest semiconductor-related trade curbs against China, the US government didn't impose specific sanctions associated with 7nm mobile SoC manufactured by SMIC for Huawei and...
Chinese foundries including CanSemi Technology, GTA Semiconductor, and Nexchip Semiconductor have stepped up enhancing their mature-node manufacturing capability for automotive ICs,...
As Micron's MoU with the government of Gujarat, India is coming up in hours, Vedanta-Foxconn joint venture, which also plans to set up a wafer fab in the state, re-submitted its application...
Takeshi Kataoka, SVP and GM of Renesas Electronics' automotive solutions is in Taiwan for the second time this year and will deliver a remark at a Computex 2023 forum on Friday (June...
United Microelectronics Corporation (UMC), today announced that its 40nm RFSOI technology platform is now ready for production of millimeter-wave (mmWave) radio frequency (RF) front-end...
Pure-play foundry United Microelectronics (UMC) expects its wafer shipments and ASPs to both register about flat sequential increases in the first quarter of 2023, with its capacity...
With the US looking to broaden its chip tool ban against China with new rules set to be implemented in April, SMIC and other China-based foundries will have to halt the development...
Infineon Technologies and United Microelectronics Corporation (UMC) today announced a long-term strategic cooperation agreement to multiply capacity for the production of Infineon...
Taiwan-based OLED display driver IC (DDI) suppliers are preparing for an anticipated increasing demand from the handset and other sectors and have begun competing for available 40nm...
United Microelectronics (UMC) and Cadence Design Systems have jointly announced that the Cadence 3D-IC reference flow has been certified for UMC's chip stacking technologies.
Ehiway Microelectronics Technology has raised an undisclosed amount of funding through Series B+ round of financing. The proceeds will be utilized for the development of the company's...
The Japanese government has set its semiconductor development policy based on two major principles - security and revitalization, shifting from relying entirely on domestic companies...
Fabless chipmakers' demand for 22/28nm and 40nm process nodes has been relatively stable compared with other processes, since a variety of end-market applications require these processes,...
