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NEWS TAGGED 40NM
Thursday 8 April 2010
TSMC delivers interoperable EDA formats for advanced process technologies
Taiwan Semiconductor Manufacturing Company (TSMC) has made available several unified and interoperable electronic design automation (EDA) technology files for its 65nm, 40nm and 28nm...
Monday 29 March 2010
Samsung to ship 40nm-class, 32GB DRAM module for servers
Samsung Electronics has announced that it has begun shipping samples of the industry's highest-density memory module for server systems. The 32 gigabyte (GB) module has been designed...
Friday 26 March 2010
Elpida readies 40nm 4Gb DRAM
Elpida Memory has revealed it is set to begin volume-producing 4Gb DRAM chips using 40nm-class process technology for server products and desktop PCs. The announcement comes around...
Monday 22 March 2010
Nvidia initial batch of GeForce GTX 400 series to have fewer cores than expected
Nvidia's initial batch of GeForce GTX 480/470-based graphics cards will have fewer cores than the originally expected 512 due to low 40nm yield at Taiwan Semiconductor Manufacturing...
Wednesday 17 March 2010
Global Unichip to begin 40nm tape-out for China IC designers in 2Q10
Global Unichip has received orders for 40nm chip production from China and will begin design tape-out in the second quarter, according to company president Jim Lai. Global Unichip...
Friday 26 February 2010
GPU shortage unlikely to be solved before May
The current shortage of graphics chips, which is being caused largely by low yields of the 40nm process at Taiwan Semiconductor Manufacturing Company (TSMC), is unlikely to be completely...
Thursday 25 February 2010
TSMC to begin trial production on 22nm process in 3Q12, says R&D head
Taiwan Semiconductor Manufacturing Company (TSMC) is scheduled to enter trial production on its 22nm high performance process node in the third quarter of 2012, and then move to the...
Wednesday 24 February 2010
Samsung expands DDR3 lineup with 40nm 4Gb chip
Samsung Electronics has begun mass producing four-gigabit (4Gb) DDR3 devices using 40nm-class process technology, according to the company. The memory maker also revealed plans to...
Friday 5 February 2010
Equipment lead-time constraints good for DRAM industry, says PTI chairman
With delivery lead times for immersion scanners extending, supply from upstream DRAM makers will not grow substantially until the fourth quarter of 2010, according to DK Tsai, chairman...
Wednesday 3 February 2010
UMC swings to profit in 4Q09; increases 2010 capex
United Microelectronics Corporation (UMC) has announced net profits of NT$4.396 billion (US$137 million) for the fourth quarter of 2009, showing a return to profitability from losses...
Wednesday 3 February 2010
TSMC spends NT$6 billion on equipment and fab construction
Taiwan Semiconductor Manufacturing Company (TSMC) announced on February 2 that it has spent nearly NT$6 billion (US$187.18 million) for front-end equipment procurement, cleanroom...
Monday 1 February 2010
Winbond president announces entrance into 40nm war
Winbond Electronics has announced it will begin 40nm development in 2010, according to company president Chan Tung-Yi. The company declined to comment on whether it will cooperate...
Friday 29 January 2010
TSMC says capex to reach US$4.8 billion in 2010
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its projected capex for 2010 will top US$4.8 billion, an increase of 79.7% from US$2.671 billion spent in 2009...
Thursday 28 January 2010
TSMC 4Q09 profits more than double; 40nm sales contribution rise
Taiwan Semiconductor Manufacturing Company (TSMC) has announced that its fourth-quarter 2009 net income soared 162.5% on year to NT$32.67 billion (US$1.02 billion), while consolidated...
Tuesday 26 January 2010
DRAM contract prices flat in 2H January, says DRAMeXchange
Contract quotes for 2GB DDR2 modules have remained unchanged at US$41 for the second half of January, and the price of 2GB DDR3 parts also remained flat at US$41, DRAMeXchange data...