Chinese OSATs such as JCET are expanding their capacity in the city of Jiangyin on China's east coast, according to industry sources. Their expansion focuses on advanced packaging.
United Microelectronics (UMC) has certified Ansys' multiphysics solutions to simulate the foundry's latest 3D-IC WoW stacked technology, which will improve the power, efficiency,...
Robust demand for CoWoS and other advanced packaging will positively contribute to C Sun Manufacturing's sales operations in the second half of this year, according to the semiconductor...
TSMC expects to post revenues of between US$18.8 billion and US$19.6 billion in the fourth quarter of 2023, which is an 11.1% sequential increase at the midpoint. Gross margin and...
AI server supply chain sources reveal that companies such as Foxconn subsidiary Ingrasys are currently experiencing an excessive amount of orders. Their factory workers are working...
Micron Technology recently commemorated its 45th anniversary with the inauguration of its state-of-the-art assembly and testing facility in Batu Kawan, Penang,
The semiconductor market's slowdown has reshaped the landscape of contractors vying for projects, with TSMC's prominence in factory construction projects leading the way. The dynamic...
Samsung Electronics has unveiled a strategic memory roadmap, aiming to release a new generation of high-bandwidth memory (HBM) product, HBM4, by the year 2025. In this ambitious endeavor,...
Despite better-than-anticipated third-quarter revenues, TSMC is expected to reiterate its previously stated revenue and capex projections for 2023 at its upcoming investors conference,...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
Applied Materials and its equipment and materials partners have entered the supply chain for Intel's recently announced glass substrates for advanced packaging, according to industry...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
During a Q&A session with the press at Intel Innovation 2023, Intel CEO Pat Gelsinger discussed the company's current focus and strategy in light of intensifying competition among...
SKC, the specialized materials manufacturer under the SK Group is poised to invest in Chipletz, a US IC packaging startup, to enhance its capability in IC packaging.
A Taiwan-US supply chain partnership forum held in Taipei alongside the US Business Day on September 19 saw delegations of government and corporate representatives from both sides...
