Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...

Artificial Intelligence (AI) is driving demand for servers, high-end chips, and advanced packaging, with 3D chips as a potential star in next-generation advanced packaging technology...

Advanced packaging and testing technologies shined brightly at SEMICON Taiwan 2023 due to a focus on AI, HPC, and automotive chips. This included various showcases of new products...

InnoCare Optoelectronics (INCX), a subsidiary of panel maker Innolux that specializes in the development of flat panels for medical applications, is collaborating with Smart Chain...

Micron Technology has disclosed plans for its Taiwan facility to become the hub of advanced packaging for high bandwidth memory (HBM).

Topco Scientific (TSC), a leading semiconductor material distributor, is expanding its advanced packaging material supply operations. In addition to silicon wafers and photoresist,...

High-end AI server shipments are forecast to reach 337,000 units in 2024, with the generative AI market reaching US$109 billion by 2030, at a compound annual growth rate (CAGR) of...

Recent statements by TSMC and Intel regarding their ambitious capital expenditure plans for advanced packaging have raised the bar for incumbent competitors and new entrants alike,...

Intel has invested a total of US$8 billion in Malaysia, and is committing an additional US$6 billion for the construction of new semiconductor facilities there, including a 3D advanced...

With major CSPs aggressively building AI servers and pushing up demand for AI processors and HBM memory, global advanced packaging capacity is predicted to expand by 30–40%...

The importance of advanced packaging to the continuation of Moore's Law has already attracted TSMC and Intel to the field.

Since ChatGPT ignited a race among competitors to develop their generative AI system in early 2023, the high-computing power demand has pushed up the sales of AI GPUs.

The AI trend is now a worldwide phenomenon, with Nvidia CEO Jensen Huang even declaring that "Nvidia is betting everything on AI." In 2023, the AI server supply chain became one of...

LED leadframe specialist I-Chiun Precision Industry has stepped up efforts to improve its product mixes, with plans to enhance its heatspreader output for advanced packaging, according...

Amkor Technology is ramping up its capacity for advanced packaging production, with monthly output for 2.5D packaging expected to reach 5,000 wafers in the first half of 2024, up...