TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.
The South Korean government has selected 40 R&D projects from 11 core investment sectors and plans to invest KRW13.5 trillion (around US$10.24 billion) by 2030. It will also give...
Samsung Electronics's DS (Device Solutions) division is rumored to be officially introducing fan-out wafer-level packaging (FOWLP) into mass production starting in the fourth quarter...
Demand for advanced packaging has been weak so far in 2023 compared to previous years, with high-performance computing (HPC) chips showing better momentum than handset application...
With TSMC customers cutting back on orders or delaying shipment pull-in in the first quarter of 2023, market doubts are emerging about whether the foundry's overall business operations...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking...
Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...
Taiwanese OSAT ASE Technology Holding (ASE) continues to enhance its solutions for automotive ICs including sensors, electronic control units (ECU), and power devices, stepping up...
Advanced Semiconductor Engineering (ASE), a subsidiary of ASE Technology Holding, has introduced its most advanced fan-out package-on-package (FOPoP) solution to reduce latency and...
While Tesla aims to reduce the amount of silicon carbide (SiC) components by 75%, sources in the related industrial sectors nevertheless believe that SiC, with its good heat resistance...
Lin Jun-cheng, who previously worked in TSMC's advanced packaging and testing department, has been appointed as Samsung Electronics' VP of advanced packaging business, raising concerns...
Automotive mmWave radars are widely believed to become important supporting components for future vehicles. Major OSATs including China's JCET, Taiwan's ASE Technology, and US-based...
JCET recently announced that it provides advanced packaging HVM solutions for 4D millimeter-wave (mmWave) radar to multiple customers in order to meet the increasingly diverse and...
Chinese OSATs JCET, Tongfu Microelectronics, and HT-Tech are reportedly lowering prices to attract orders for mature ICs while also making progress in advanced packaging technology...
Samsung Electronics and SK Hynix reportedly have been aggressively lobbying relevant units in Washington to seek a waiver from US chips curbs on China, aiming to prevent their existing...
