The ongoing trend of automotive electrification, intelligentization and connectivity are driving a significant increase in the quantity and cost of chips used in vehicles. The cost...
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
As the geopolitical tensions between the US and China are leading to reshaping the global supply chain landscape, China-based JCET is looking to grab a bigger pie of the rising Chinese...
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
The production of AI server chips necessitates not only advanced process fabrication but also the packaging used for high-end HPC processors; however, the supply of advanced packaging...
Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Intel's planned new assembly and testing plant in Poland may help take orders from external customers for Intel Foundry Services (IFS), particularly for advanced packaging and testing...
Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...
With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...
TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip...
TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration,...
TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate...
