ASE Technology and other first-tier IC backend houses have seen their fab capacity utilization rates start loosening, as fabless clients have also begun to ask them to defer order...
OSAT ASE Technology Holding (ASEH) expects its capacity utilization rate to drop slightly in the fourth quarter of 2022, and has revised downward its capex outlook this year by about...
The semiconductor industry players are forming a regional cluster in Europe, with the support of EU's semiconductor initiative to decrease its dependence on Asia. Seeing growing demand...
TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...
TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
AMD CEO Lisa Su will meet with her TSMC counterpart CC Wei during her upcoming visit to Taiwan, as the US chip vendor looks to secure support from the foundry house and other value...
AMD chair and CEO Lisa Su will arrive in Taiwan in early October to meet major suppliers including TSMC and ASE Technology, according to industry sources.
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Equipment demand for mid- to high-end flip-chip (FC) and other advanced packaging remains robust, while demand for conventional wirebonding packaging is slowing down, according to...
TSMC is involved in an R&D project led by Nvidia to use its silicon photonic (SiPh) integration technology called COUPE (compact universal photonic engine) for graphics hardware...
Topco Scientific, which mainly distributes photoresist, silicon wafers and CMP slurry products to foundry houses, is looking to actively develop its third-generation semiconductor...
TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization...
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
