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NEWS TAGGED ADVANCED PACKAGING
Thursday 30 March 2023
ASE steps up deployment in automotive electronics sector
Taiwanese OSAT ASE Technology Holding (ASE) continues to enhance its solutions for automotive ICs including sensors, electronic control units (ECU), and power devices, stepping up...
Thursday 16 March 2023
ASE advances fan-out PoP technology
Advanced Semiconductor Engineering (ASE), a subsidiary of ASE Technology Holding, has introduced its most advanced fan-out package-on-package (FOPoP) solution to reduce latency and...
Monday 13 March 2023
IC verification labs see growing advanced packaging opportunities in auto chip sector
While Tesla aims to reduce the amount of silicon carbide (SiC) components by 75%, sources in the related industrial sectors nevertheless believe that SiC, with its good heat resistance...
Friday 10 March 2023
Former TSMC R&D executive joins Samsung
Lin Jun-cheng, who previously worked in TSMC's advanced packaging and testing department, has been appointed as Samsung Electronics' VP of advanced packaging business, raising concerns...
Monday 6 March 2023
Major OSATs gearing up for automotive mmWave radar solutions
Automotive mmWave radars are widely believed to become important supporting components for future vehicles. Major OSATs including China's JCET, Taiwan's ASE Technology, and US-based...
Thursday 2 March 2023
JCET provides customers with advanced packaging HVM solutions for 4D mmWave radar
JCET recently announced that it provides advanced packaging HVM solutions for 4D millimeter-wave (mmWave) radar to multiple customers in order to meet the increasingly diverse and...
Wednesday 22 February 2023
China OSATs drop prices for mature ICs
Chinese OSATs JCET, Tongfu Microelectronics, and HT-Tech are reportedly lowering prices to attract orders for mature ICs while also making progress in advanced packaging technology...
Tuesday 14 February 2023
Samsung, SK Hynix aggressively lobbying for waiver from US chip rules on China
Samsung Electronics and SK Hynix reportedly have been aggressively lobbying relevant units in Washington to seek a waiver from US chips curbs on China, aiming to prevent their existing...
Thursday 2 February 2023
OSATs see promising demand for custom-built chips
Demand for custom-built chips from system vendors remains promising for OSATs that offer high-end backend services, such as ASE Technology (ASEH), Amkor Technology and Powertech Technology...
Thursday 19 January 2023
Samsung to grow foundry IP partner ecosystem
Samsung Electronics reportedly is looking to boost its semiconductor IP sales by working closely with silicon IP and design service companies.
Wednesday 11 January 2023
Market Cap 100: ASE keeps deepening advanced packaging solution development
Taiwan-based ASE Technology Holding (ASEH) ranked 72 in the "2023 Asia Supply Chain Market Cap 100 Ranking," representing a significant improvement from the 81 it held a year earli...
Friday 23 December 2022
Why China's semiconductor development falls short of expectations
China has been developing modern semiconductor technology for more than 30 years, with its state capital support to the industry greater than those once provided by Japan, South Korea...
Thursday 22 December 2022
ASE talks about SiP development trends
OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.
Monday 19 December 2022
A challenge for Foxconn to venture into chiplet packaging segment
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor...
Wednesday 14 December 2022
IC, materials distributors keen on diversifying biz deployments
Taiwan's ICs and materials distributors are keen on diversifying business deployments and product applications into fields such as biotech, healthcare, green energy and even device...