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NEWS TAGGED ADVANCED PACKAGING
Wednesday 11 January 2023
Market Cap 100: ASE keeps deepening advanced packaging solution development
Taiwan-based ASE Technology Holding (ASEH) ranked 72 in the "2023 Asia Supply Chain Market Cap 100 Ranking," representing a significant improvement from the 81 it held a year earli...
Friday 23 December 2022
Why China's semiconductor development falls short of expectations
China has been developing modern semiconductor technology for more than 30 years, with its state capital support to the industry greater than those once provided by Japan, South Korea...
Thursday 22 December 2022
ASE talks about SiP development trends
OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.
Monday 19 December 2022
A challenge for Foxconn to venture into chiplet packaging segment
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor...
Wednesday 14 December 2022
IC, materials distributors keen on diversifying biz deployments
Taiwan's ICs and materials distributors are keen on diversifying business deployments and product applications into fields such as biotech, healthcare, green energy and even device...
Wednesday 14 December 2022
Global wafer foundry industry, 2023 and beyond

Introduction

Tuesday 13 December 2022
Samsung adjusts semiconductor department for advanced packaging ambition
Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department,...
Friday 9 December 2022
ASML undaunted by Dutch export controls?
The Dutch government has succumbed to Washington's pressures, despite earlier comments from Dutch Foreign Trade Minister Liesje Schreinemacher that the Netherlands would not "copy...
Thursday 10 November 2022
Chiplet interconnect startup Eliyan, backed by Intel and Micron, announced successful tape-out on TSMC's 5nm node
Chiplet interconnect startup Eliyan Corporation, based in Califronia, has raised US$40 million Series A funding, backed by four investors including Intel Capital and Micron Ventures...
Monday 7 November 2022
US foundry SkyWater announces progress in reshoring advanced packaging capability
US-based foundry SkyWater Technology has completed the first phase of its program to establish silicon interposer manufacturing, according to an announcement on November 3. The program,...
Friday 4 November 2022
TSMC capacity expansions facing potential changes with geopolitical influences
Despite TSMC's robust sales in the past few years and estimated strong performance in 2023, geopolitical tensions will continue to influence the foundry's decision in capacity expansion...
Thursday 3 November 2022
SEMICON China Forum: Find ways out under US trade ban
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
Wednesday 2 November 2022
3D IC packaging to develop faster under US trade sanctions against China, says AP Memory chair
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...
Wednesday 2 November 2022
First-tier backend houses see falling capacity utilization rates
ASE Technology and other first-tier IC backend houses have seen their fab capacity utilization rates start loosening, as fabless clients have also begun to ask them to defer order...
Monday 31 October 2022
PTI plans 40% capex cut in 2023
Backend house Powertech Technology (PTI) expects its capex for 2023 to be about 40% lower than this year's level estimated at NT$17 billion.