In the advanced packaging field, the competition among OSATS on both sides of the Taiwan Straits, such as Taiwan-based ASE Technology Holding and China-based JCET Group, is heating...
ASE Technology Holding (ASEH) has reiterated the OSAT will post sequential revenue increases through the fourth quarter of this year despite heightened macro volatility.
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Many foundry houses and IDMs are mulling scaling back or postponing their capacity expansions amid sharply weakening chip demand for consumer applications, except for TSMC, which...
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
Taiwan-based OSATs including ASE Technology and Powertech Technology (PTI) continue to see their midrange and high-end IC packaging manufacturing capacity utilization rates stay at...
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
IC analysis and inspection lab Material Science Service (MSScorps) is upbeat about its longer-term business prospects, citing brisk demand for advanced packaging and third-generation...
An opening ceremony has been held recently at TSMC's 3DIC R&D center in Japan to mark the completion of cleanroom construction at the facility, according to the Taiwan-based fo...
Foxconn Technology (Hon Hai Precision Industry) has been expanding its IC backend business through subsidiaries, such as ShunSin Technology and Qingdao KoreSemi, according to industry...
TSMC at the company's annual technology symposium for North America unveiled its next-generation N2 process powered by nanosheet transistors. N2 is scheduled to begin production in...
Chip demand for 5G, AI, and automotive applications continues to grow robustly, but substrates needed to process related chips will remain in short supply until at least 2025, which...
Robust AI and HPC processor orders have boosted TSMC's chip-on-wafer-on-substrate (CoWoS) packaging capacity utilization to nearly 100%, according to industry sources.
