AMD CEO Lisa Su will meet with her TSMC counterpart CC Wei during her upcoming visit to Taiwan, as the US chip vendor looks to secure support from the foundry house and other value...
AMD chair and CEO Lisa Su will arrive in Taiwan in early October to meet major suppliers including TSMC and ASE Technology, according to industry sources.
MediaTek is set to mass produce its new HPC chips at TSMC in 2023 using advanced process node and CoWoS (chip on wafer on substrate) packaging technology, according to backend supply...
Equipment demand for mid- to high-end flip-chip (FC) and other advanced packaging remains robust, while demand for conventional wirebonding packaging is slowing down, according to...
TSMC is involved in an R&D project led by Nvidia to use its silicon photonic (SiPh) integration technology called COUPE (compact universal photonic engine) for graphics hardware...
Topco Scientific, which mainly distributes photoresist, silicon wafers and CMP slurry products to foundry houses, is looking to actively develop its third-generation semiconductor...
TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization...
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
The second half of 2022 is set to be particularly weak for many high-tech businesses, but Taiwan-based fab toolmakers engaged in TSMC's supply chain remain on track for sales growth...
Demand for materials analysis (MA) and reliability analysis (RA) services remains robust for chips built using advanced process manufacturing and advanced packaging, according to...
In the advanced packaging field, the competition among OSATS on both sides of the Taiwan Straits, such as Taiwan-based ASE Technology Holding and China-based JCET Group, is heating...
ASE Technology Holding (ASEH) has reiterated the OSAT will post sequential revenue increases through the fourth quarter of this year despite heightened macro volatility.
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Many foundry houses and IDMs are mulling scaling back or postponing their capacity expansions amid sharply weakening chip demand for consumer applications, except for TSMC, which...
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
