Topco Scientific, which mainly distributes photoresist, silicon wafers and CMP slurry products to foundry houses, is looking to actively develop its third-generation semiconductor...
TSMC expects to scale up its advanced packaging production capacity in 2022, which will be 300% greater than that in 2018, and to further boost the output by 2026 thanks to the commercialization...
China's largest OSAT Jiangsu Changjiang Electronics Technology (JCET) has scored impressive revenue and profit gains for the first half of 2022, but is not optimistic about business...
The second half of 2022 is set to be particularly weak for many high-tech businesses, but Taiwan-based fab toolmakers engaged in TSMC's supply chain remain on track for sales growth...
Demand for materials analysis (MA) and reliability analysis (RA) services remains robust for chips built using advanced process manufacturing and advanced packaging, according to...
In the advanced packaging field, the competition among OSATS on both sides of the Taiwan Straits, such as Taiwan-based ASE Technology Holding and China-based JCET Group, is heating...
ASE Technology Holding (ASEH) has reiterated the OSAT will post sequential revenue increases through the fourth quarter of this year despite heightened macro volatility.
OSATs have started slowing down wirebonding and other mature packaging capacity expansions in response to waning chip demand for consumer applications, but leading players such as...
Many foundry houses and IDMs are mulling scaling back or postponing their capacity expansions amid sharply weakening chip demand for consumer applications, except for TSMC, which...
Taiwan-based backend houses including flip chip (FC) packaging, high-end testing, and IC test interface specialists are gearing up production for upcoming high-performance computing...
TSMC is on track to develop InFO_3D technology for processing mobile device chips that are going slimmer and lighter, looking to further expand its 3D Fabric lineup and serve more...
Taiwan-based OSATs including ASE Technology and Powertech Technology (PTI) continue to see their midrange and high-end IC packaging manufacturing capacity utilization rates stay at...
Heavyweight semiconductor players including sole EUV lithography equipment vendor ASML and top foundry TSMC have lately shed lights on latest front-end lithography and backend advanced...
IC analysis and inspection lab Material Science Service (MSScorps) is upbeat about its longer-term business prospects, citing brisk demand for advanced packaging and third-generation...
