Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department,...
The Dutch government has succumbed to Washington's pressures, despite earlier comments from Dutch Foreign Trade Minister Liesje Schreinemacher that the Netherlands would not "copy...
Chiplet interconnect startup Eliyan Corporation, based in Califronia, has raised US$40 million Series A funding, backed by four investors including Intel Capital and Micron Ventures...
US-based foundry SkyWater Technology has completed the first phase of its program to establish silicon interposer manufacturing, according to an announcement on November 3. The program,...
Despite TSMC's robust sales in the past few years and estimated strong performance in 2023, geopolitical tensions will continue to influence the foundry's decision in capacity expansion...
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...
ASE Technology and other first-tier IC backend houses have seen their fab capacity utilization rates start loosening, as fabless clients have also begun to ask them to defer order...
OSAT ASE Technology Holding (ASEH) expects its capacity utilization rate to drop slightly in the fourth quarter of 2022, and has revised downward its capex outlook this year by about...
The semiconductor industry players are forming a regional cluster in Europe, with the support of EU's semiconductor initiative to decrease its dependence on Asia. Seeing growing demand...
TSMC is in talks with its major clients about the adoption of its new CoWoS-R+ packaging technology for HPC chips utilizing high-bandwidth memory such as HBM3, according to industry...
TSMC has seen capacity utilization rates for advanced integrated fan-out (InFO) and chip-on-wafer-on-substrate (CoWoS) packaging start loosening in the fourth quarter of 2022, due...
Automotive chips and power devices continue to see uneven supplies, and Taiwan's leading OSATs including ASE Technology and international IDMs such as Infineon, Renesas, NXP, ST Microelectronics...
