The concept of AI has continued to penetrate high-performance computing (HPC) and even the future car sector. Supply chain sources admitted that this is already a battle of "ecosystem,"...

TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.

The ABF substrate market segment is expected to regain prosperity in 2024, buoyed by rising demand for AI servers, according to market sources.

Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production...

Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, is gearing up for a surge in demand for automotive and chiplet solutions with its expanding...

At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.

The details of the US CHIPS and Science Act (also known as the CHIPS Act) subsidies, which aims to rebuild the country's local semiconductor supply chain, have been released, but...

TSMC is mulling to setting up an advanced packaging fab in Japan, according to sources at fab toolmakers.

TSMC came in as the world's third-largest OSAT when including its advanced packaging 3D fabric platform in 2022, according to market research quoted by China-based OSATs.

The South Korean government has selected 40 R&D projects from 11 core investment sectors and plans to invest KRW13.5 trillion (around US$10.24 billion) by 2030. It will also give...

Samsung Electronics's DS (Device Solutions) division is rumored to be officially introducing fan-out wafer-level packaging (FOWLP) into mass production starting in the fourth quarter...

Demand for advanced packaging has been weak so far in 2023 compared to previous years, with high-performance computing (HPC) chips showing better momentum than handset application...

With TSMC customers cutting back on orders or delaying shipment pull-in in the first quarter of 2023, market doubts are emerging about whether the foundry's overall business operations...

Global Unichip Corp. (GUC), the Advanced ASIC Leader, announced today that it has successfully taped out a test chip with an 8.6Gbps HBM3 Controller and PHY and GLink 2.3LL for AI/HPC/xPU/Networking...

Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, has reported revenue and net profits for 2022 both hit record highs of CNY33.76 billion (US$4.91...