Demand for custom-built chips from system vendors remains promising for OSATs that offer high-end backend services, such as ASE Technology (ASEH), Amkor Technology and Powertech Technology...
Taiwan-based ASE Technology Holding (ASEH) ranked 72 in the "2023 Asia Supply Chain Market Cap 100 Ranking," representing a significant improvement from the 81 it held a year earli...
China has been developing modern semiconductor technology for more than 30 years, with its state capital support to the industry greater than those once provided by Japan, South Korea...
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor...
Taiwan's ICs and materials distributors are keen on diversifying business deployments and product applications into fields such as biotech, healthcare, green energy and even device...
Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department,...
The Dutch government has succumbed to Washington's pressures, despite earlier comments from Dutch Foreign Trade Minister Liesje Schreinemacher that the Netherlands would not "copy...
Chiplet interconnect startup Eliyan Corporation, based in Califronia, has raised US$40 million Series A funding, backed by four investors including Intel Capital and Micron Ventures...
US-based foundry SkyWater Technology has completed the first phase of its program to establish silicon interposer manufacturing, according to an announcement on November 3. The program,...
Despite TSMC's robust sales in the past few years and estimated strong performance in 2023, geopolitical tensions will continue to influence the foundry's decision in capacity expansion...
High-profile semiconductor industry leaders in China recently gathered at the just-ended SEMICON China Executive Summit seeking to find ways out for China's future IC development...
For mature manufacturing process, 3D IC packaging is expected to become their alternative solution to advanced processes and will develop faster than expected under the latest US...
