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NEWS TAGGED ADVANCED PACKAGING
Thursday 2 March 2023
JCET provides customers with advanced packaging HVM solutions for 4D mmWave radar
JCET recently announced that it provides advanced packaging HVM solutions for 4D millimeter-wave (mmWave) radar to multiple customers in order to meet the increasingly diverse and...
Wednesday 22 February 2023
China OSATs drop prices for mature ICs
Chinese OSATs JCET, Tongfu Microelectronics, and HT-Tech are reportedly lowering prices to attract orders for mature ICs while also making progress in advanced packaging technology...
Tuesday 14 February 2023
Samsung, SK Hynix aggressively lobbying for waiver from US chip rules on China
Samsung Electronics and SK Hynix reportedly have been aggressively lobbying relevant units in Washington to seek a waiver from US chips curbs on China, aiming to prevent their existing...
Thursday 2 February 2023
OSATs see promising demand for custom-built chips
Demand for custom-built chips from system vendors remains promising for OSATs that offer high-end backend services, such as ASE Technology (ASEH), Amkor Technology and Powertech Technology...
Thursday 19 January 2023
Samsung to grow foundry IP partner ecosystem
Samsung Electronics reportedly is looking to boost its semiconductor IP sales by working closely with silicon IP and design service companies.
Wednesday 11 January 2023
Market Cap 100: ASE keeps deepening advanced packaging solution development
Taiwan-based ASE Technology Holding (ASEH) ranked 72 in the "2023 Asia Supply Chain Market Cap 100 Ranking," representing a significant improvement from the 81 it held a year earli...
Friday 23 December 2022
Why China's semiconductor development falls short of expectations
China has been developing modern semiconductor technology for more than 30 years, with its state capital support to the industry greater than those once provided by Japan, South Korea...
Thursday 22 December 2022
ASE talks about SiP development trends
OSAT ASE Group recently shared its vision regarding development trends for system-in-package (SiP) technology.
Monday 19 December 2022
A challenge for Foxconn to venture into chiplet packaging segment
Foxconn Technology's (Hon Hai Precision Industry) latest announcement to invite Shang-Yi Chiang, TSMC veteran and former SMIC executive, as the chief strategy officer of its semiconductor...
Wednesday 14 December 2022
IC, materials distributors keen on diversifying biz deployments
Taiwan's ICs and materials distributors are keen on diversifying business deployments and product applications into fields such as biotech, healthcare, green energy and even device...
Wednesday 14 December 2022
Global wafer foundry industry, 2023 and beyond

Introduction

Tuesday 13 December 2022
Samsung adjusts semiconductor department for advanced packaging ambition
Samsung Electronics's Device Solutions (DS) division recently adjusted its organization by adding an advanced packaging team under the Test & System Package (TSP) department,...
Friday 9 December 2022
ASML undaunted by Dutch export controls?
The Dutch government has succumbed to Washington's pressures, despite earlier comments from Dutch Foreign Trade Minister Liesje Schreinemacher that the Netherlands would not "copy...
Thursday 10 November 2022
Chiplet interconnect startup Eliyan, backed by Intel and Micron, announced successful tape-out on TSMC's 5nm node
Chiplet interconnect startup Eliyan Corporation, based in Califronia, has raised US$40 million Series A funding, backed by four investors including Intel Capital and Micron Ventures...
Monday 7 November 2022
US foundry SkyWater announces progress in reshoring advanced packaging capability
US-based foundry SkyWater Technology has completed the first phase of its program to establish silicon interposer manufacturing, according to an announcement on November 3. The program,...
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research