Intel's planned new assembly and testing plant in Poland may help take orders from external customers for Intel Foundry Services (IFS), particularly for advanced packaging and testing...

Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...

With its crucial CoWoS (chip on wafer on substrate) backend technology in high demand for AI GPU chips, TSMC's long-established "one-stop-shop" advantage for advanced chips manufacturing...

TSMC's 3D Fabric advanced packaging and testing plant, AP6, has officially started operation. Advanced packaging and testing providers have indicated that the 3D Chiplet and System-on-Integrated-Chip...

ASE Technology and other OSATs capable of providing advanced packaging technology are all gearing up for a boom in demand for chiplets.

TSMC's Advanced Backend Fab 6, the foundry's first all-in-one automated advanced packaging and testing fab to realize 3DFabric front-end to back-end process and testing services integration,...

TSMC held its shareholders' meeting today, where chairman Mark Liu stated that the company has faced various global challenges in recent years, including the US-China trade war, climate...

The concept of AI has continued to penetrate high-performance computing (HPC) and even the future car sector. Supply chain sources admitted that this is already a battle of "ecosystem,"...

TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.

The ABF substrate market segment is expected to regain prosperity in 2024, buoyed by rising demand for AI servers, according to market sources.

Samsung Electronics is stepping up its deployment in the advanced packaging field, and reportedly will move its fan-out wafer-level packaging (FOWLP) technology to volume production...

Jiangsu Changjiang Electronics Technology (JCET), the largest China-based OSAT company, is gearing up for a surge in demand for automotive and chiplet solutions with its expanding...

At its 2023 North America Technology Symposium, TSMC showcased progress in its 2nm technology and new 3nm process variants, including an improved N3E.

The details of the US CHIPS and Science Act (also known as the CHIPS Act) subsidies, which aims to rebuild the country's local semiconductor supply chain, have been released, but...

TSMC is mulling to setting up an advanced packaging fab in Japan, according to sources at fab toolmakers.