Reports stated that due to Samsung Foundry's massive improvement in its 4nm process yield rate, it has already secured an AI chip foundry order from a major data center client.
Amid the ongoing US-China trade war, Chinese communication system giants such as Huawei and ZTE have taken a low-key approach on the international stage, but back in their home country,...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging,...
IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.
The ongoing trend of automotive electrification, intelligentization and connectivity are driving a significant increase in the quantity and cost of chips used in vehicles. The cost...
Samsung Electronics plans to apply its in-house developed advanced packaging technology in 3nm GAA process manufacturing by 2025, but frontend manufacturing yields continue to play...
Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...
As the geopolitical tensions between the US and China are leading to reshaping the global supply chain landscape, China-based JCET is looking to grab a bigger pie of the rising Chinese...
Pure-play foundry TSMC will see its fab utilization rates, notably for sub-7nm process manufacturing, rise substantially in the second half of this year, according to sources at fab...
The production of AI server chips necessitates not only advanced process fabrication but also the packaging used for high-end HPC processors; however, the supply of advanced packaging...
Nvidia CEO Jensen Huang's exclamation of the arrival of "AI's iPhone moment" sparked an explosive demand for AI HPC (high-performance computing) chips. For 2.5D advanced packaging...
TSMC has readied plans to build new CoWoS (Chip on Wafer on Substrate) capacity at its manufacturing complex in the Central Taiwan Science Park (CTSP) to meet a rapid surge in demand...
Intel's planned new assembly and testing plant in Poland may help take orders from external customers for Intel Foundry Services (IFS), particularly for advanced packaging and testing...
Integrated Service Technology (iST), a specialist in IC materials analysis, has reported a 10.2% increase in revenue year-over-year from January to May, thanks to robust reliability...
