Semiconductor materials distributor Wah Lee Industrial has enjoyed robust orders catering to customers' advanced packaging needs, such as TSMC's CoWoS, as a result of the AI server...
Intel has struck a deal with the US Department of Defense to develop and manufacture chips with its 18A (18-angstrom or 1.8nm) process technology under the DoD's Rapid Assured Microelectronics...
All the new iPhone series for 2023 are very likely to feature Dynamic Island display technology, but Taiwanese partners in the supply chain, such as camera modules...
Recognizing the strategic importance of semiconductor packaging technology, the South Korean government is reportedly initiating a major packaging technology R&D project aimed...
TSMC has recently initiated a new round of orders with advanced packaging equipment suppliers including Apic Yamada, Disco, Gudeng Precision Industrial and Scientech, according to...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
Semiconductor backend houses, such as leading OSAT ASE Technology Holdings (ASEH) and test interface specialist Chunghwa Precision Test Tech (CHPT), are expected to see sales growth...
Taiwan-based ASIC manufacturer, Faraday Technology, has experienced a significant decline in profits in Q2 this year, influenced by the revenue decrease in its three major product...
TSMC's latest development roadmaps show its advanced manufacturing process technology will remain rooted in Taiwan, with not only its 2nm chip plant already under construction in...
According to Intel, Boeing and Northrop Grumman have joined phase two of the Department of Defense's RAMP-C program, which aims to facilitate a leading-edge US foundry ecosystem on...
Reports stated that due to Samsung Foundry's massive improvement in its 4nm process yield rate, it has already secured an AI chip foundry order from a major data center client.
Amid the ongoing US-China trade war, Chinese communication system giants such as Huawei and ZTE have taken a low-key approach on the international stage, but back in their home country,...
TSMC has stepped up its pace of orders with backend equipment suppliers, as the foundry commences its chip-on-wafer-on-substrate (CoWoS) packaging capacity expansion plan, according...
System vendors are seeking capacity support from IC analysis laboratories for 2024 through their contracted IP service providers, as they foresee high demand for advanced packaging,...
IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.
