Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...
China-based OSATs including Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics have stepped up their deployments in the advanced packaging...
Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...
Pure-play foundry TSMC is expected to kick off equipment move-in at its new advanced 5nm fab in the US state of Arizona as early as mid 2022, according to industry sources.
With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...
AMD at the ongoing Computex 2021 talked about its 3D chipset processor developed jointly with TSMC, which provides its 3D silicon stacking and advanced packaging technologies.
Global Unichip Corp (GUC), the advanced ASIC leader, announces GLink-3D die-on-die interface IP using TSMC's N5 and N6 processes and 3DFabric advanced packaging technology for AI,...
Semiconductor chips have been the hottest trending topic recently due to their indispensability in all types of applications, including automobiles, mobile phones, military weapons,...
Intel has announced plans to invest US$3.5 billion to equip its New Mexico operations for the manufacturing of advanced semiconductor packaging technologies, including its Foveros...
Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing...
Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...
ASM Pacific Technology's (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments - SMT Solutions Segment and Materials Segment...
