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NEWS TAGGED ADVANCED PACKAGING
Wednesday 21 April 2021
Qualcomm, MediaTek mull fan-out packaging for flagship handset APs
Qualcomm and MediaTek are both considering adopting fan-out PoP in the production of their flagship smartphone application processors, following in the footsteps of Apple utilizing...
Friday 16 April 2021
FC packaging demand for HPC chips rising
Demand for flip-chip (FC) packaging particularly FC-BGA will be rising significantly driven by the HPC device market boom this year, and backend houses in Taiwan and China have seen...
Tuesday 26 May 2020
ASMPT well positioned to ride the next wave of Advanced Packaging in Heterogeneous Integration
ASM Pacific Technology's (ASMPT) Back-end Equipment Segment has been renamed to Semiconductor Solutions Segment. The other two segments - SMT Solutions Segment and Materials Segment...