China's National Semiconductor Industry Investment Fund (aka the Big Fund) continues to pour money into China's domestic fab toolmakers, looking to rev up the development of China's...

Many IDMs and pure-play foundries, including second-tier ones, are all poised to expand their fab capacities sparking concerns that the arrival of the additional capacities could...

TSMC is expected to kick off equipment move-in at its new advanced packaging fab in Chunan, northern Taiwan later in the second half of this year, according to a report by Taiwan's...

ASE Technology and Powertech Technology (PTI) have both stepped up their deployments in the panel-level packaging (PLP) field, and are involved in multiple computing chip design projects,...

TSMC has introduced its new advanced packaging technology dubbed COUPE (compact universal photonic engine) heterogeneous integration technology for silicon photonic ASICs targeting...

Taiwan-based UVAT Technology, a supplier of etching and sputtering equipment, expects robust demand for advanced packaging and ABF substrate manufacturing to drive its revenue growth...

China-based OSATs including JCET, Tongfu Microelectronics and Tianshui Huatain Technology have all moved to enhance their QFN (quad flat no-lead) packaging capability for automotive...

At Intel's Architecture Day 2021, two new X86 cores, two new datacenter SoCs and two discrete GPUs were introduced. Intel also disclosed it is among the top customers of TSMC, which...

Foxconn Technology (Hon Hai Precision Industry) has started installing equipment including lithography systems for high-end IC packaging at its chip plant in Qingdao, northeast China,...

Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.

China-based OSATs including Jiangsu Changjiang Electronics Technology (JCET), Huatian Technology and Tongfu Microelectronics have stepped up their deployments in the advanced packaging...

Intel, AMD and Nvidia are heating up competition to win more capacity support from suppliers of ABF substrates needed to process their HPC chips through at least 2025, according to...

Pure-play foundry TSMC is expected to kick off equipment move-in at its new advanced 5nm fab in the US state of Arizona as early as mid 2022, according to industry sources.

TSMC will be stepping up its advanced process capacity expansion through 2023, according to company CEO CC Wei.

With more mmWave-capable and HPC chip designs being developed, AiP, 3D stacking and other advanced packaging technologies will be increasingly needed for commercial applications,...