With TSMC and Samsung Electronics stepping up the development of their sub-5nm process technologies, ASML will continue to see strong extreme ultraviolet (EUV) lithography equipment...
Samsung Electronics has kicked off volume production of 16Gb LPDDR5 chips using EUV-based 1znm process technology at its Pyeongtaek fab, while SK Hynix plans to install EUV exposure...
Many international semiconductor equipment and materials suppliers have been stepping up investments or strengthening deployments in Taiwan seeking to better serve TSMC's ecosystem...
China's SMIC is struggling to obtain crucial EUV lithography equipment for the development of its sub-7nm process technologies, and will be seeking a dialogue with ASML with the help...
Entegris has announced it has agreed to settle patent litigation and disputes with Gudeng Precision related to reticle pod technology for both conventional and EUV lithography. The...
TSMC is on track to enter 3nm chip production with monthly output set to reach 55,000 wafers in the second half of 2022, according to sources familiar with the matter. The 3nm process...
China's Huawei reportedly is looking to build its own 45nm chip fabrication lines without US technology this year, which industry sources believe is "mission impossible."
ASML has announced it will set up an EUV technology training center at Southern Taiwan Science Park (STSP), giving a boost to the EUV technology cluster headed by TSMC.
Gudeng Precision Industrial, a member of TSMC Grand Alliance and Taiwan's first semiconductor equipment maker allowed to join SEMI in setting next-generation equipment standards after...
Taiwan-based semiconductor equipment suppliers engaged in TSMC's supply chain are set to be among the beneficiaries of the foundry house's advanced process capacity expansion with...
Whenever Moore's Law has seemingly reached its physical limits, there have been always new tech innovations emerging to break the limits, with EUV process and advanced packaging technology...