North America-based manufacturers of semiconductor equipment posted US$323.4 million in orders in June 2009 (three-month average basis) and a book-to-bill ratio of 0.77, according...
Rises in the book-to-bill ratio for the North America and Japan semiconductor equipment sectors is giving optimism the industry downturn has bottomed out, but The Information Network...
North America-based manufacturers of semiconductor equipment posted US$288.5 million in orders in May 2009 (three-month average basis) and a book-to-bill ratio of 0.74, according...
Japan-based semiconductor equipment manufacturers posted about 25.97 billion yen (US$268.76 million) in orders in May 2009 (three-month average basis) and a book-to-bill ratio of...
Japan-based semiconductor equipment manufacturers posted 17,945 million yen (US$556.7 million) in orders in April 2009 (three-month average basis) and a book-to-bill ratio of 0.44,...
Rigid PCB shipments were down 30.5% and bookings were down 39.8% in March 2009 from March 2008, according to IPC. Year to date, rigid PCB shipments were down 24.6% and bookings were...
The Japan semiconductor equipment book-to-bill ratio reached another new low in March, breaking the record level of 0.35 generated in February 2009 (three-month average), data gathered...
Japan-based manufacturers of semiconductor equipment posted 13.68 billion yen (US$143 million) in orders in February 2009 (three-month average) and a book-to-bill ratio of 0.35, according...
