Faraday Technology, a Taiwan-based provider of fabless ASIC services and silicon IP, expects to post a revenue decrease of 4-6% sequentially in the fourth quarter of 2023.
Socionext has announced a partnership with Arm and TSMC to develop an innovative, power-optimized 32-core CPU chiplet in TSMC's 2nm silicon technology, enabling scalable performance...
The US Department of Commerce outlined new rules regarding expanded export restrictions to prevent China from acquiring advanced chips, closed loopholes, and added a new parameter...
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the launch of its integrated design ecosystem (IDE), a collaborative design toolset optimized...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
Silicon photonics technology was hotly discussed during the SEMICON Taiwan 2023. At the Silicon Photonics Global Summit held September 5 alongside the exhibition, I was invited to...
Alberto Sangiovanni-Vincentelli, professor and Edgar L. and Harold H. Buttner Chair of Electrical Engineering and Computer Science Department at the University of California, Berkeley,...
In light of the fact that Chinese foundries can still obtain used equipment and consumables for process technology upgrades despite the US ban, the US could target advanced packaging...
In the three major segments of the semiconductor value chain: design, manufacturing, and packaging/testing, China's weakest link is manufacturing. In the packaging and testing field,...
VeriSilicon, a major player in China's RISC-V ecosystem and also the country's largest chip design IP vendor, has on August 18 inaugerated its new R&D center in Shanghai. focusing...
Former TSMC COO, Chiang Shang-yi, currently the chief strategy officer at Foxconn semiconductors, faced challenges when he returned to China's SMIC in December 2020. He encountered...
AMD plans to incorporate TSMC's 3D SoIC (system on integrated circuits) stacking and chiplet packaging technology into its gaming notebook processors, following the company's implementation...
China-based IC assembly and testing company Tongfu Microelectronics has recently released its performance forecast for the first half of 2023. The net profit attributable to shareholders...
As it is becoming much more difficult and expensive to pack more transistors into a single chip, the chip industry pins its hope on chiplet technology when the global demand for HPC...
China-based startup Yuanli Semiconductor (temporary translation) has introduced the concept of AI Chiplets, aiming to reconstruct AI chips and target the edge inference market.
