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NEWS TAGGED CHIPLET
Monday 21 October 2024
Imec builds chiplet ecosystem for smart cars, uniting semiconductor, automotive giants
As the automotive industry advances toward electrification and greater electronic integration, a key challenge is that vehicle chips cannot be upgraded as quickly as those in the...
Monday 7 October 2024
Rapidus to build backend semiconductor manufacturing process R&D center
Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known...
Thursday 8 August 2024
China rushing into chiplet and HBM fab tool development
China-based semiconductor equipment manufacturers have expedited their domestic development efforts, foraying into the chiplet and HBM memory sectors, according to industry sources...
Monday 29 July 2024
Samsung invests in AI chip startups DreamBig and Axelera AI
Samsung Electronics is ramping up investment efforts in AI chip startups to strengthen its competitiveness in new-generation AI semiconductor technologies.
Thursday 13 June 2024
Rapidus anticipates achieving a US$6.4 bln revenue target by 2030
Rapidus chairman Tetsuro Higashi said the Japanese pure-play foundry that aims to mass-produce 2nm chips could achieve its revenue target 10 years earlier than planned, as the AI...
Thursday 6 June 2024
Intel's Lunar Lake rescued by TSMC 3nm process?
Intel CEO Pat Gelsinger's keynote at COMPUTEX 2024, specifically mentioned the collaboration with TSMC, which allowed Intel to realize the mass production of Lunar Lake in advancing...
Tuesday 28 May 2024
China can break through US EUV ban with mature-node innovation, but how?
China's Huawei claims to have successfully achieved domestic substitution of using its self-developed 7nm and 5nm chips in its smartphones and has boosted market standings of HiSilicon...
Friday 10 May 2024
Rapidus gears up for advanced packaging and chiplet technologies as it races to 2nm production
Japan's semiconductor foundry startup Rapidus, now on a mission to mass produce 2nm chips by 2027, is developing advanced packaging and chiplet technologies, with a particular focus...
Friday 3 May 2024
Japan takes ambitious action on advanced packaging technology to capture Chiplet and AI chip opportunities
The potential of advanced packaging technology to upgrade chip performance has attracted many Japanese equipment and material suppliers to allocate their resources in this highly...
Friday 12 April 2024
Cadence and Arm come together to drive automotive chiplet ecosystem
Cadence's solution includes a digital twin.
Monday 1 April 2024
Suzuki joins Japan's auto SoC alliance as government reportedly to offer subsidy
Suzuki Motor has become the latest member of Japan's Advanced SoC Research for Automotive (ASRA).
Friday 22 March 2024
Chiplet challenges: MediaTek believes AI can help
Chiplet technology is being embraced as a major semiconductor trend as Moore's Law slows down, but there are still many challenges during the design process.
Thursday 21 March 2024
ASE expands VIPack advanced packaging solutions for AI device apps
Advanced Semiconductor Engineering (ASE), a member of ASE Technology Holding, has announced the expansion of its advanced interconnect technology on the VIPack platform. This development...
Monday 29 January 2024
AI chip advancements fuel surge in Japanese semiconductor backend process materials
Amidst the rapid advancement in AI chip development, emerging technologies like chiplets are making semiconductor backend processes more intricate. As a result, the prices and profit...
Friday 26 January 2024
Intel reportedly to integrate Samsung's LPDDR5X in Lunar Lake CPU by 3D packaging
Samsung Electronics and Intel have long competed with each other for first place in the fierce global semiconductor IDM market, and a fierce battle for orders and rankings has begun...