MaxEpic, a nascent but rapidly advancing chiplet semiconductor startup based in Canada, is spearheading the development of next-generation fully-integrated power delivery and power...
Arm recently announced that it, along with AMD and Nvidia, has been appointed to the Open Compute Project (OCP) board. These companies will collaborate with major players such as...
At the OCP Global Summit 2025, Arm's Mohamed Awad, Senior Vice President and General Manager of Infrastructure Business, delivered a keynote urging the data center industry to rethink...
Chiplet architecture, already entrenched in high-performance AI data centers, is beginning to penetrate the automotive sector. With its modular design and capacity for heterogeneous...
As automotive computing platforms increasingly demand higher performance, longer lifespans, and near-zero defect rates, chip architecture faces the challenge of balancing system reliability...
The Universal Chiplet Interconnect Express (UCIe) standard has taken a decisive step forward with the release of version 3.0, delivering up to 64 GT/s throughput and doubling bandwidth...
As Taiwan maintains its global leadership in semiconductor manufacturing, the nation's academic institutions are stepping up efforts to address critical industry challenges such as...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful tape-out of the industry-leading Universal Chiplet Interconnect Express (UCIe) PHY Face-Up IP...
Samsung Electronics completed initial performance tests for 4nm chips using industry-standard chiplet packaging, marking progress in its effort to strengthen AI semiconductor foundry...
TSMC, Intel, Samsung Electronics, and Advanced Micro Devices (AMD) are backing the modular semiconductor approach that breaks down system-on-chip (SoC) designs into smaller functional...
Tenstorrent, a US-based semiconductor design firm, held a press conference on April 17 at its newly established Tokyo office to discuss its deepening collaboration with Rapidus in...
Global Unichip Corp. (GUC), the Advanced ASIC Leader, today announced the successful launch of the industry's first Universal Chiplet Interconnect Express (UCIe) PHY silicon, achieving...
Global Unichip Corp. (GUC), the Advanced ASICLeader, announced today that it has successfully taped out Universal Chiplet Interconnect Express (UCIe) PHY IP with 40Gbps per lane on...
As the automotive industry advances toward electrification and greater electronic integration, a key challenge is that vehicle chips cannot be upgraded as quickly as those in the...
Rapidus has announced plans to establish a clean room at Seiko Epson's manufacturing facility in Chitose, Hokkaido, as well as a R&D center for semiconductor post-processing known...
