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    China's humanoid robot giants capture 60% of orders in 3Q24
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    Intel outsources EMIB packaging to Amkor's South Korea plant
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    China's AI glasses market sees intense low-cost competition
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    Huawei's AI companion sparks new market
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    Memory spot prices surged as Samsung's RDIMM limitedly ease supply in late 4Q25
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    NEWS TAGGED CPO
    Friday 28 November 2025
    Cheng Mei delivers first CoPoS equipment to ASE
    Competing with leading players, Cheng Mei Instrument Technology recently delivered the first CoPoS measurement and inspection equipment to the ASE Group, aiming to break KLA Corporation's...
    Thursday 27 November 2025
    FOCI advances 1.6T SiPh for AI servers, eyes mass production
    Driven by the AI server market, FOCI is steadily advancing its 1.6T-class silicon photonics (SiPh) products toward mass production. General manager DD Hu announced that sample shipments...
    Tuesday 25 November 2025
    ShunSin builds full-stack optical transceiver modules and pilots CSP AI data centers
    With the wave of generative AI applications driving rapid upgrades in high-performance computing architectures and data center networks, market demand for ultra-high bandwidth, lower...
    Monday 17 November 2025
    GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

    Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...

    Friday 14 November 2025
    From scale-up to scale-across: How AI data centers are redefining transmission technology
    The surge in generative AI has intensified demand for AI servers and chips, shifting the focus from pure computational power to data transmission speed. This transition has accelerated...
    Monday 10 November 2025
    Lumentum’s surprise lift sparks profit rebound across Taiwan’s optical chain

    US optical communications giant Lumentum reported stronger-than-expected earnings for the quarter ended September 27, signaling renewed...

    Friday 17 October 2025
    OCP Summit: Broadcom claims 90% AI efficiency jump, reshaping optical and interconnect supply chains

    At the OCP Global Summit, Broadcom unveiled major advances in Co-Packaged Optics (CPO), claiming the technology has reached the maturity...

    Monday 22 September 2025
    Sunengine enters CPO advanced packaging supply chain
    The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...
    Tuesday 16 September 2025
    TSMC’s grip on SEMICON Taiwan sets the stage for record-breaking SEMICON West
    The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
    Friday 12 September 2025
    SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
    At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
    Friday 12 September 2025
    SEMICON Taiwan 2025: Nvidia shifts optical roadmap from co-packaged to co-integrated optics
    Nvidia is advancing its optical interconnect research to support the growing scale of "AI factories" and accelerated computing clusters.
    Friday 12 September 2025
    SEMICON Taiwan 2025: Broadcom eyes CPO expansion beyond AI scale-out data centers
    Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...
    Thursday 4 September 2025
    Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged optics
    Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven...
    Wednesday 3 September 2025
    MicroLED technology opens new opportunities for equipment makers
    MicroLED is regarded as the next-generation display technology, with Taiwan leading global development due to strong semiconductor and display integration, plus government support...
    Wednesday 3 September 2025
    China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
    Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
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    Research Report Database
    BIZ FOCUS
    Nov 26, 08:00
    Facing the rise of AI, how does Global Instrument Technology leverage Chunghwa Telecom's IDC for the manufacturing industry's AI-driven transformation
    Wednesday 26 November 2025
    GaNrich Delivers Portfolio from 40V to 1200V For the Data Center HVDC Architecture
    Wednesday 26 November 2025
    Smart dining transformation accelerates: ASUS IoT IoRT solutions enhance operational efficiency in chain restaurants
    Tuesday 25 November 2025
    ASUS IoT AISEHS raises intelligent security standards, helping semiconductor industry move from passive to active protection
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