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NEWS TAGGED CPO
Friday 3 July 2026
BOE targets AI packaging with Micro LED optical interconnect and glass substrate CPO

BOE, China's leading display panel maker, is accelerating its move into next-generation packaging technologies for the AI era. The company...

Friday 3 July 2026
Competing Paths in Data Center Optics: XPO Could Beat CPO to Mass Production in 2027
DIGITIMES notes that Arista Networks unveiled XPO at The Optical Fiber Communication Conference and Exhibition 2026 (OFC 2026). Unlike CPO, which is associated with more disruptive...
Tuesday 30 June 2026
Ability Opto-Electronics targets CPO growth with V-groove and MT lines

Ability Opto-Electronics Technology, an optics maker, said on June 29 that its V-groove and mechanical transfer (MT) products for co-packaged...

Tuesday 30 June 2026
Interview: Why DuPont spinoff Qnity is betting its Taiwan growth on packaging, not process nodes

As Taiwan becomes the core of the global AI hardware supply chain, Qnity — the century-old company spun off from US chemicals...

Monday 29 June 2026
Foxconn unit ShunSin confirms TSMC COUPE partnership; capex to hit NT$5 billion for CPO and OCS
ShunSin Technology Holdings, Foxconn's semiconductor packaging and testing subsidiary, is accelerating its transition toward co-packaged optics (CPO). The company's latest appointment...
Saturday 27 June 2026
ShunSin sees CPO potential, adds TSMC veterans as independents
ShunSin, a Foxconn-affiliated packaging and testing company, held its 2026 annual general meeting, with chairman Shang-Yi Chiang presiding. Chiang said ShunSin will leverage its packaging,...
Friday 26 June 2026
AuthenX targets AI data center interconnects with plug-and-play FAU for CPO
AI-driven hyperscale data center expansion is pushing the global AI race beyond raw GPU computing power into a broader contest over high-speed interconnects and electro-optical integration...
Thursday 25 June 2026
Nvidia CPO roadmap positions TSMC COUPE for next AI infrastructure wave
Co-packaged optics (CPO) is rapidly emerging as a foundational architecture for next-generation AI infrastructure. With Nvidia's latest Scale-Up CPO switch roadmap now taking shape,...
Monday 22 June 2026
Ma-tek ramps silicon photonics testing investment with first system due in August

Semiconductor testing and analysis service provider Ma-tek held its annual shareholders' meeting on June 18. Chairperson Yong-Fen Hsieh...

Thursday 18 June 2026
Interview: MicroLED and SiPh eye 3.2T AI data race
The AI wave is rapidly reshaping the global semiconductor supply chain, and that upheaval is opening a new growth chapter for Taiwan's LED industry. As Taiwan's LED makers move away...
Wednesday 17 June 2026
Superior Plating Technology turns to AI liquid cooling and CPO

Superior Plating Technology chairman Lei-Je Hua said the company is shifting more resources into AI liquid cooling, CPO communication...

Tuesday 16 June 2026
Supply security over cost: Google leads CSP charge to diversify InP substrate sourcing

China has recently eased controls on some indium phosphide (InP) substrates, relieving a bottleneck in optical communications capacity...

Monday 15 June 2026
Exclusive: Wiwynn president rallies AI ecosystem to tackle power, cooling, optics

AI is reshaping Taiwan into the center of a technological revolution, and the upstream and downstream supply chain is running at full...

Saturday 13 June 2026
Commentary: Precision vs. breadth—Why Taiwan's lens giants have opposite CPO playbooks

Optical industry leaders Largan and Genius Electronic Optical (GSEO) have recently discussed progress in co-packaged optics (CPO), a...

Thursday 11 June 2026
CPO delays may shift AI networking demand, not derail it

Concerns have emerged in recent weeks that the commercialization of co-packaged optics (CPO), a technology widely viewed as the future...