According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
The integration of silicon photonics co-packaged optics (CPO) technology into network communication chips has become inevitable**, driven by its ability** to enable high-speed, low-latency...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
With the recent surge in AI, silicon photonics, and co-packaged optics (CPO), combined with TSMC's advancements in cutting-edge processes, Taiwan's materials analysis leader MSScorps...
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in System-in-Package (SiP) modules, has accelerated the deployment of Silicon Photonics (SiPh)...
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...