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NEWS TAGGED CPO
Friday 11 September 2026
ficonTEC breaks CPO test bottleneck, teams with Hermes Testing
German silicon photonics (SiPh) test equipment maker ficonTEC has broken through a major bottleneck in co-packaged optics (CPO) "electrical-in, optical-out" testing and launched what...
Friday 11 September 2026
AUO, Innolux accelerate shift from displays to AI, CPO, advanced packaging
Taiwan's panel makers posted mixed August results as the industry's strategic focus shifts beyond monthly revenue toward AI, advanced packaging and co-packaged optics (CPO). AUO and...
Friday 11 September 2026
CPO startup Ayar Labs raises 2026 funding to US$650 million, adds Wiwynn as investor

Ayar Labs, a co-packaged optics (CPO) startup, has raised an additional US$150 million, bringing the primary capital it has raised so...

Thursday 10 September 2026
Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

Shenzhen Huachuang Xinguang says MicroLED optical interconnect technology is feasible and expects to target data center applications...

Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
Wednesday 9 September 2026
WinWay revenue surges on AI chip pin-count demand
Semiconductor test interface maker WinWay said AI-related orders drove August 2026 revenue to NT$1.706 billion (US$53.8 million), up more than 2x year-over-year and a record high for...
Tuesday 8 September 2026
CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different...
Tuesday 8 September 2026
Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO
AI demand is accelerating advanced packaging and high-speed optical interconnect development, pushing Taiwan display makers Innolux and AUO deeper into the semiconductor supply cha...
Sunday 6 September 2026
BenQ Materials targets CPO in semiconductor push
BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
Sunday 6 September 2026
Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
Saturday 5 September 2026
SiPh, optical lens demand ignite laser race
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
Friday 4 September 2026
CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026
K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
Friday 4 September 2026
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...