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NEWS TAGGED CPO
Friday 13 December 2024
TSMC to integrate CoWoS and SiPh in 2026, sources say
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
Thursday 31 October 2024
Samsung, SK Hynix, Intel put packaging at the heart of future innovation
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
Thursday 24 October 2024
PIDA seminar insights: Silicon photonics key to next-gen communication, AI and autonomous driving development
The integration of silicon photonics co-packaged optics (CPO) technology into network communication chips has become inevitable**, driven by its ability** to enable high-speed, low-latency...
Tuesday 1 October 2024
SiPh and glass substrates seen as new areas of focus for TSMC and Nvidia
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
Thursday 12 September 2024
Material analysis expert MSScorps poised for profit growth in AI, silicon photonics, and CPO markets
With the recent surge in AI, silicon photonics, and co-packaged optics (CPO), combined with TSMC's advancements in cutting-edge processes, Taiwan's materials analysis leader MSScorps...
Friday 6 September 2024
WinWay sees co-packaged optics ready for mass production by 2026
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Thursday 5 September 2024
EML technology to reach market faster than SiPh, says Broadcom exec
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Friday 16 August 2024
Intel's CHIPS Act implementation hamstrung by performance, packaging dependencies, workforce shortages
The US$39 billion funding allocation under the CHIPS and Science Act (CHIPS Act) is nearing completion.
Thursday 15 August 2024
FitTech bets on advanced packaging, silicon photonics CPO to drive 2025 growth
LED equipment manufacturer FitTech is gearing up to begin contract production of CoWoS advanced packaging equipment in the fourth quarter of 2024.
Tuesday 2 July 2024
Chipmakers gearing up for SiPh boom
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
Friday 28 June 2024
ShunSin accelerates SiPh and CPO deployment
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in System-in-Package (SiP) modules, has accelerated the deployment of Silicon Photonics (SiPh)...
Friday 28 June 2024
PCL seeks to seize AI SiPh opportunities with CPO
Transmission speeds have become crucial as data centers see rapid growth in AI applications.
Friday 7 June 2024
The Future of AI: Industry leaders discuss transformative advances in AI scalability through CPO and NPU
In the InnoVex Exploring the Future of AI Forum on June 5 during COMPUTEX 2024, three prominent figures—Dr....
Thursday 30 May 2024
HBM competition (1): advanced packaging technology divergence explained
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
Wednesday 15 May 2024
PCB industry moves up the ladder as silicon photonics packaging demand grows
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...