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    Malaysia PM highlights global partnerships as key to semiconductor growth
    5h 35min ago
    Samsung invests US$1.9 billion in Austin plantto prep for Apple CIS chip production
    5h 35min ago
    RISC-V advances into data centers with China's server chip breakthrough
    5h 35min ago
    Power shortages stall Nvidia's 100MW data centers in Santa Clara
    5h 35min ago
    Sakana AI became Japan's highest-valued startup, backed by Mitsubishi UFJ and the CIA
    5h 35min ago
    Memory shortage drives surge in orders to SMIC, marking return to manufacturing
    5h 35min ago
    NEWS TAGGED CPO
    Monday 17 November 2025
    GUC and Ayar Labs Partner to Advance Co-Packaged Optics for Hyperscalers

    Global Unichip Corp. (GUC), the Advanced ASIC leader, and Ayar Labs, a leader in co-packaged optics (CPO) for large-scale AI workloads, have announced a strategic...

    Friday 14 November 2025
    From scale-up to scale-across: How AI data centers are redefining transmission technology
    The surge in generative AI has intensified demand for AI servers and chips, shifting the focus from pure computational power to data transmission speed. This transition has accelerated...
    Monday 10 November 2025
    Lumentum’s surprise lift sparks profit rebound across Taiwan’s optical chain

    US optical communications giant Lumentum reported stronger-than-expected earnings for the quarter ended September 27, signaling renewed...

    Friday 17 October 2025
    OCP Summit: Broadcom claims 90% AI efficiency jump, reshaping optical and interconnect supply chains

    At the OCP Global Summit, Broadcom unveiled major advances in Co-Packaged Optics (CPO), claiming the technology has reached the maturity...

    Monday 22 September 2025
    Sunengine enters CPO advanced packaging supply chain
    The explosive growth in AI computing demand is driving increased needs for GPUs, ASICs, and other components, accelerating the rapid development of global data center infrastructure...
    Tuesday 16 September 2025
    TSMC’s grip on SEMICON Taiwan sets the stage for record-breaking SEMICON West
    The magnetic pull of TSMC is making waves, as the upcoming SEMICON West exhibition scheduled for October 7, 2025, at the Phoenix Convention Center in Arizona, is poised to reach record...
    Friday 12 September 2025
    SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
    At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
    Friday 12 September 2025
    SEMICON Taiwan 2025: Nvidia shifts optical roadmap from co-packaged to co-integrated optics
    Nvidia is advancing its optical interconnect research to support the growing scale of "AI factories" and accelerated computing clusters.
    Friday 12 September 2025
    SEMICON Taiwan 2025: Broadcom eyes CPO expansion beyond AI scale-out data centers
    Manish Mehta, vice president of Marketing and Operations for Broadcom's Optical Systems Division, delivered a keynote address at SEMICON Taiwan 2025 focused on heterogeneous integration...
    Thursday 4 September 2025
    Dai Nippon Printing to open first overseas R&D center in the Netherlands, focused on co-packaged optics
    Starting from September 2025, Japanese company Dai Nippon Printing (DNP) will launch its first research and development facility outside Japan, located in the High Tech Campus Eindhoven...
    Wednesday 3 September 2025
    MicroLED technology opens new opportunities for equipment makers
    MicroLED is regarded as the next-generation display technology, with Taiwan leading global development due to strong semiconductor and display integration, plus government support...
    Wednesday 3 September 2025
    China's OSAT leaders Tongfu, JCET advance co-packaged optics for AI data centers
    Surging demand for AI, large language models (LLMS), and high-performance computing is propelling co-packaged optics (CPO) into the spotlight of the semiconductor industry. The technology...
    Thursday 7 August 2025
    ASE challenges TSMC’s photonics play with CPO packaging push
    At the inaugural Open Compute Project (OCP) APAC Summit in Taipei, ASE Group Executive Vice President Tingu Yin Chang said surging AI computing demand has become the primary catalyst...
    Wednesday 6 August 2025
    OCP APAC 2025: ASE doubles down on co-packaged optics as AI reshapes semiconductor design
    As artificial intelligence continues to redefine the architecture and demands of modern computing, ASE is positioning Co-Packaged Optics (CPO) and advanced packaging at the center...
    Tuesday 29 July 2025
    SiPh among cutting-edge technologies for Taiwan's future growth
    Silicon photonics (SiPh) is one of the cutting-edge technologies in a crucial Taiwanese government AI development program that aims to create more than US$500 billion in industry...
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    Asia webinar 1205
    BIZ FOCUS
    Oct 2, 10:32
    SK Group partners with OpenAI to advance global AI infrastructure
    Thursday 30 October 2025
    Asian Power Devices Officially Launches New Vietnam Factory, Setting a New Global Production Milestone
    Thursday 30 October 2025
    BIWIN Mini SSD Named to TIME's 'Best Inventions of 2025'
    Thursday 23 October 2025
    APD: Technology-Driven Innovation Powering Global Growth
    aiexpo2026