Young Optics' consolidated revenue declined by 14.6% year over year in 2024 to NT$2.572 billion (US$78.7 million), largely due to competition from Chinese mid-range single-panel LCD...
Win Semiconductors, the leading gallium arsenide (GaAs) foundry, sees signs of recovery after industry downturns. As demand for mobile phones and Wi-Fi power amplifiers stabilizes,...
SK Hynix's memory business in China faces numerous uncertainties due to the ongoing US-China conflict. Chief Production Officer (CPO) Young-Sik Kim will reportedly lead the Wuxi fab...
Despite TSMC estimating that the mass production of silicon photonic (SiPh) co-packaged optics (CPO) technology will still require more than one to one and a half years, the optical...
Electric vehicle charge point operator (CPO) EVGallop Mobility System, commonly known as U-Power, intends to file for an initial public offering (IPO) in Taiwan by the end of 2025.
According to industry sources, TSMC is working to integrate CoWoS and SiPh, seeking to launch co-packaged optics (CPO) in 2026 that may inject fresh momentum into the semiconductor...
At SEDEX 2024 in Seoul, Samsung Electronics, SK Hynix, and Intel showcased advanced packaging technologies as essential for future semiconductor innovations. With a focus on AI and...
The integration of silicon photonics co-packaged optics (CPO) technology into network communication chips has become inevitable**, driven by its ability** to enable high-speed, low-latency...
The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its...
With the recent surge in AI, silicon photonics, and co-packaged optics (CPO), combined with TSMC's advancements in cutting-edge processes, Taiwan's materials analysis leader MSScorps...
In the silicon photonics packaging and testing interface sector, WinWay Technology has intensified its efforts and anticipates that its co-packaged optics (CPO) product will be prepared...
Broadcom business development manager for co-packaged optics (CPO) Tzu How Chow introduced and discussed various optical communications technologies during the Power and Opto Semiconductor...
Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
