News tagged CPO at DIGITIMES

NEWS TAGGED CPO

Monday 31 August 2026

TSMC sees SiPh going mainstream in 2027

Silicon photonics (SiPh) will become mainstream in 2027, with market share topping 50%, as AI scale-out drives explosive growth in optical transceiver demand, said K.C. Hsu, TSMC's...

Monday 31 August 2026

ASE: CPO scale-out demands deeper supply-chain coordination for mass production

SEMICON Taiwan 2026 kicked off its pre-show program with the Silicon Photonics Global Summit.

Monday 31 August 2026

South Korea risks 'HBM 2.0' trap in emerging CPO market

Co-packaged optics (CPO) is emerging as a critical next-generation technology for AI infrastructure, but unless South Korea strengthens its integration and validation capabilities,...

Thursday 27 August 2026

HTSI targets AI chip demand with SiPh, CPO, packaging push

Hermes Testing Solutions (HTSI) said revenue for the first seven months of 2026 reached NT$2.7 billion (US$83.8 million), up 128.2% year-over-year and already exceeding its full-year...

Thursday 27 August 2026

ASMPT Showcases Advanced Packaging Innovation at SEMICON Taiwan 2026

Global technology and innovation leader ASMPT will showcase its advanced packaging portfolio at SEMICON Taiwan 2026, taking place from September 2 to 4 in Taipei. At...

Thursday 27 August 2026

AI glass substrate race shifts toward reliability and mass production

The competition to develop glass substrates for artificial intelligence (AI) semiconductor packaging is intensifying, with Japanese and South Korean manufacturers pursuing different...

Tuesday 25 August 2026

Nvidia and SK Hynix CPO strategies diverge as 3D optics look toward a post-2030 horizon

On August 20, SK Hynix's global research team published a paper in Nature Electronics detailing its co-packaged optics (CPO) development for high-performance computing (HPC)...

Monday 24 August 2026

Analysis: SK Hynix pushes beyond HBM with HBF and CPO

SK Hynix is moving on several fronts as it pushes deeper into system-level memory competition. From high-bandwidth memory (HBM) and high-bandwidth flash (HBF) to a recently published...

Monday 24 August 2026

ASE's Huang urges AI profits to fund R&D for CPO, PLP

As chip processes move to 2nm and advanced packaging accelerates heterogeneous integration, semiconductor materials are shifting from...

Monday 24 August 2026

CPO hurdles linger as 800G and 1.6T SiPh surge, says analyst

Challenges around co-packaged optics (CPO) remain unresolved, but they have not slowed the rapid rise of 800G and 1.6T silicon photonics, DIGITIMES analyst Kiwi Hsu said on August...

Friday 21 August 2026

Hiwin expands into CPO optical coupling process; 2H26 robotics revenue outlook brightens

Hiwin Technologies Chairman Eric Y. T. Chuo stated that the company has supplied samples of miniature ball screws and single-axis robots to co-packaged optics (CPO) vendors across...

Friday 21 August 2026

Power supply lags behind AI compute growth: chips, optical interconnects battle for energy efficiency

At the "AI on Chips: Semiconductor Industry Trends Forum" hosted by DIGITIMES in Taipei on August 20, semiconductor, investment, and...

Friday 21 August 2026

JCET profit surges 79% on AI demand, with advanced packaging and CPO gaining scale

JCET Group reported record first-half revenue for 2026, with demand from artificial intelligence infrastructure and high-performance...

Friday 21 August 2026

Research Insight: CPO gains momentum as AI interconnect demands outpace chip gains

The AI industry is watching the rise of co-packaged optics (CPO) as faster AI systems now depend on more efficient links between chips and data centers. At DIGITIMES Tech Forum 2026...

Friday 21 August 2026

SK hynix outlines CPO roadmap as AI computing shifts from chips to systems

SK hynix has published a technical roadmap for co-packaged optics (CPO) in the journal Nature Electronics, positioning the world's largest supplier of high-bandwidth memory...

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