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NEWS TAGGED CPO
Thursday 10 September 2026
Huachuang Xinguang sees MicroLED optical interconnects entering data centers in 3 to 5 years

Shenzhen Huachuang Xinguang says MicroLED optical interconnect technology is feasible and expects to target data center applications...

Thursday 10 September 2026
AUO matching glass substrate size stokes TSMC collab speculation
AUO is accelerating its transformation by extending its established large-format panel manufacturing capabilities into advanced semiconductor packaging.
Thursday 10 September 2026
Hermes Testing ships membrane probe cards, targets SiPh and CPO
Hermes Testing Solutions said its August revenue kept rising and topped NT$500 million for the first time, setting a new monthly record on steady growth in semiconductor test equipment...
Wednesday 9 September 2026
WinWay revenue surges on AI chip pin-count demand
Semiconductor test interface maker WinWay said AI-related orders drove August 2026 revenue to NT$1.706 billion (US$53.8 million), up more than 2x year-over-year and a record high for...
Tuesday 8 September 2026
CPO testing faces hurdles from Insertion 1 to 4, with '100% testing' expected to accelerate in 2027
Co-packaged optics (CPO) has officially entered the mass-production deployment stage, but the critical testing processes responsible for safeguarding yield continue to face different...
Tuesday 8 September 2026
Innolux, AUO take display technology into AI chips with FOPLP, glass substrates, Micro LED CPO
AI demand is accelerating advanced packaging and high-speed optical interconnect development, pushing Taiwan display makers Innolux and AUO deeper into the semiconductor supply cha...
Sunday 6 September 2026
BenQ Materials targets CPO in semiconductor push
BenQ Materials Group has formally positioned semiconductor materials as a key future growth driver, using its existing coating, membrane, foaming, and adhesive technologies to move...
Sunday 6 September 2026
Podcast highlights: SoIC vs CoWoS, HBM5 hybrid bonding, and EMIB-T's yield problem
In a podcast, DIGITIMES analyst Luke Lin said hybrid bonding is drawing fresh attention at SEMICON Taiwan 2026 and could become a key driver of advanced packaging capacity expansion...
Saturday 5 September 2026
SiPh, optical lens demand ignite laser race
Silicon photonics (SiPh) is emerging as a core theme at SEMICON Taiwan 2026, and while the sector is still in an early, fast-growing stage, production-line investments are already...
Friday 4 September 2026
CPO testing shifts to mid-stage to avoid costly failures, Chroma says

Co-packaged optics (CPO) is forcing chipmakers and equipment suppliers to rethink where testing should take place, as long optical test...

Friday 4 September 2026
K&S targets CPO, CoPoS growth with expanded TCB advanced packaging roadmap
Singapore-based semiconductor packaging equipment maker Kulicke and Soffa (K&S) said AI demand is spreading into adjacent applications, lifting 2026 orders for wire bonding equipment...
Friday 4 September 2026
CPO high-density optical interconnects drive E&R's submicron 2D FAU breakthrough
To meet next-generation high-speed optical interconnect demand, fiber array units (FAU) are moving from traditional one-dimensional layouts to high-density two-dimensional (2D) architectures,...
Friday 4 September 2026
Silicon photonics testing shift could reshape how CPO suppliers win business
As silicon photonics (SiPh) and co-packaged optics (CPO) move toward mass production, suppliers say testing is shifting earlier in the process to catch defects at the wafer stage,...
Thursday 3 September 2026
Broadcom says CPO fits scale-out better than scale-up
Broadcom Senior Vice President and General Manager of the Core Switching Group Asad Khamisy said at the Semicon Taiwan 2026 master forum that co-packaged optics (CPO) is not necessarily...
Thursday 3 September 2026
CPO material race widens as Taiwan eyes key role
At the Semicon Network Summit 2026, speakers from Marvell, the Netherlands Organisation for Applied Scientific Research's Holst Centre, the UK Semiconductor Centre, and the Taiwan...