Advanced packaging for Silicon Photonics (SiPh) and Co-Packaged Optics (CPO) has emerged as an additional forward-thinking trend, following CoWoS, InFO, and SoIC.
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in System-in-Package (SiP) modules, has accelerated the deployment of Silicon Photonics (SiPh)...
High Bandwidth Memory (HBM) is a graphic memory with high bandwidth. Its main function is to support High-Performance Computing (HPC) or high-speed parallel computing with CPU/GPU...
As the AI and HPC markets develop, high-performance computing is rapidly growing, driving the demand for high-speed transmission. Naturally, the complexity of chip design has also...
The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself...
Foxconn Interconnect Technology (FIT), a subsidiary of Hon Hai Technology Group (Foxconn), has partnered with MediaTek to co-develop a groundbreaking 51.2T solution incorporating...
MediaTek has launched its next-generation ASIC design platform with co-packaged optics (CPO) solutions, which industry observers say marks a major step in the vendor's development...
Ranovus, a Canadian silicon photonics scaleup company specializing in high-speed optical interconnect chips, announced on March 20, 2024, a groundbreaking partnership with MediaTek...
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
