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NEWS TAGGED CPO
Wednesday 12 August 2026
OCP APAC 2026: Nvidia SVP Shainer on taking CPO to mass production —'can't release something just because it's cool'

Nvidia's Spectrum-6 co-packaged optics (CPO) switches are in production and shipping, Gilad Shainer, senior vice president of networking...

Wednesday 12 August 2026
MediaTek, Realtek, Himax, Elan eye optical communications boom in 2027
The use of optical communications in cloud AI data-center interconnect architectures is rising sharply, and Taiwan IC design firms including MediaTek, Realtek Semiconductor, Himax...
Wednesday 12 August 2026
OCP APAC 2026: Nvidia, Broadcom diverge on how to scale AI networks beyond the rack
Nvidia and Broadcom outlined different paths for scaling AI networks at the OCP APAC Summit in Taipei on Aug. 11, as clusters expand from rack-scale systems to entire data centers...
Tuesday 11 August 2026
Taiwan optical firms diverge in CPO push as Corning looms large

Co-packaged optics (CPO) remains a key focus in the AI era. Beyond advanced packaging and testing, compound semiconductors, and other...

Saturday 8 August 2026
Interview: Lightmatter maps CPO future with Nvidia NVLink, Taiwan supply chain
The 2026 OCP APAC Summit will take place in Taipei on August 11-12. Ahead of the event, Lightmatter founder and CEO Nicholas Harris spoke exclusively with DIGITIMES about the company's...
Friday 7 August 2026
Interview: Nvidia exec on progress of CPO production and pluggable optics
Nvidia Senior Vice President of Networking Gilad Shainer said the company is building the key network architecture and optical interconnect technologies needed for AI factory deployments...
Thursday 6 August 2026
Largan July 2026 revenue rises 11% as CPO samples progress

Largan announced on August 5 that July revenue reached NT$4.877 billion (US$150.8 million), up 31% month-over-month and 11% year-over-year...

Thursday 6 August 2026
Interview: Ayar Labs CEO sees CPO scale-up volumes rising in 2028-2029
The 2026 Open Compute Project (OCP) APAC Summit will be held in Taipei on August 11-12, bringing together global cloud service providers (CSPs), semiconductor firms, silicon photonics...
Wednesday 5 August 2026
From chip to grid: OCP CEO George Tchaparian on redefining data center architecture for the AI era
Ahead of the OCP APAC Summit in Taipei, George Tchaparian says co-packaged optics (CPO) gives Taiwan an opportunity to turn its manufacturing and packaging expertise into global...
Saturday 1 August 2026
AUO commits US$721M to TGV, glass core and CPO expansion
AUO sold three factories within two days, with disposal gains expected to reach NT$17.7 billion (approx. US$548 million). Chairman Paul Peng said the proceeds would be reinvested in...
Wednesday 29 July 2026
Corning bets on SiPh and CPO to drive AI data center growth

Corning expects AI infrastructure to become an increasingly powerful growth engine, outlining how its glass technologies will move beyond...

Thursday 23 July 2026
WAIC 2026: Lightelligence maps AI's optical future with CPO, NPO, photonic computing

Lightelligence is positioning optical interconnects, optical switching, and optical computing as the next foundation of AI infrastructure,...

Thursday 23 July 2026
Laser source outsourcing pushes back CPO rollout
While the commercialization timeline for co-packaged optics (CPO) has not accelerated as expected from the AI data center-driven demand for high-speed transmission, industry players...
Wednesday 22 July 2026
CPO commercialization opens new SiPh packaging race for Taiwan OSATs

Exploding demand for AI server computing power is pushing data-center architectures to upgrade at a faster pace, and the traditional...

Tuesday 21 July 2026
Zeiss accelerates push into AI chip advanced packaging, CPO

Zeiss is moving into a new AI chip battleground as advanced packaging and silicon photonics rise on the back of chiplet-based architectures,...