The AI boom is driving chipmaking advancements, with Co-Packaged Optics (CPO) promising to stake a claim as a favored semiconductor packaging technology along with CoWoS.
India-based EMS player Kaynes Semicon believes its OSAT project is expected to be approved and eyes advanced packaging, including Co-Packaged Optics (CPO), to differentiate itself...
Foxconn Interconnect Technology (FIT), a subsidiary of Hon Hai Technology Group (Foxconn), has partnered with MediaTek to co-develop a groundbreaking 51.2T solution incorporating...
MediaTek has launched its next-generation ASIC design platform with co-packaged optics (CPO) solutions, which industry observers say marks a major step in the vendor's development...
Ranovus, a Canadian silicon photonics scaleup company specializing in high-speed optical interconnect chips, announced on March 20, 2024, a groundbreaking partnership with MediaTek...
OSAT providers are optimistic about business opportunities accompanying the AI boom, with many gearing up to develop new packaging technologies to support silicon photonics.
Semiconductor demand is improving gradually, with IC packaging and testing houses expressing optimism about market prospects for 2024 and focusing on AI chips and Co-Packaged Optics...
ShunSin Technology, a subsidiary of Hon Hai Technology Group (Foxconn) that specializes in system-in-package (SiP) modules, has announced plans to open a subsidiary in Vietnam for...
Elite Advanced Laser (eLaser), a Taiwan-based provider of optical communication solutions, is strategically adapting to the demands of the AI-driven era, with a particular focus on...
Where to find entrepreneurial opportunities? They can be found from electromagnetic waves, especially at the application level, where different wavelengths can be utilized at different...
AI chips and co-packaged optics (CPO) will stimulate demand for advanced packaging in 2024, during which the semiconductor industry is expected to rebound.
High-speed data transmission has come into the spotlight along with cloud-based AI accelerator chips as one of the most vital capabilities in the electronics industry, and silicon...
Generative AI has driven the demand for high-performance computing (HPC) and high-speed transmission, which in turn is adding development momentum to silicon photonics optical communication...
OSATs are bracing for a surge in demand for heterogeneous integration, which will necessitate CoWoS, silicon photonics (SiPh), and other new technologies in 2024, according to industry...
