SiPh and glass substrates seen as new areas of focus for TSMC and Nvidia

Monica Chen, Hsinchu; Jack Wu, DIGITIMES Asia Tuesday 1 October 2024 0

Credit: DIGITIMES

The next technologies tasked with breaking through the bottleneck of Moore's Law will be silicon photonics (SiPh) and co-packaged optics (CPO). Additionally, TSMC has resumed its R&D for glass substrate technology, going head-to-head with Intel,...

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