China's multitude of government-supported (electronic design automation) EDA vendors are facing the prospect of elimination.

The global chiplets market is forecast to be worth around US$107 billion by 2033, up from US$3.1 billion in 2023, with a CAGR of 42.5% between 2024 and 2033. It is projected to be...

TSMC and Samsung Electronics are gearing up for a chiplet mass production race. Both industry giants are set to materialize the commercialization of UCIe (Universal Chiplet Interconnect...

The Institute of Computing Technology of the Chinese Academy of Sciences recently published a paper in the journal Fundamental Research introducing their "Big Chip" archit...

Twelve Japanese automakers, component manufacturers, and semiconductor companies have formed an alliance for the research and development of advanced automotive chips, aiming to produce...

The Industrial Base Analysis and Sustainment (IBAS) office, funded by the US Department of Defense to establish high-priority domestic capabilities to safeguard the US defense industrial...

Industry suppliers are generally optimistic about Ajinomoto Build-up Film (ABF) substrate market prospects for 2024 and 2025, citing the recovery of the PC market, a growing demand...

Despite short-term headwinds, IC backend companies are generally positive about long-term demand for chiplet devices.

At the recently concluded 2023 China International Semiconductor Summit held in Shanghai, senior executives from JCET and TSMC both emphasized the role of advanced packaging, yet...

IC testing interface specialist WinWay Technology is full steam ahead with new products, holding a "very optimistic" outlook for the second half of 2024, according to the Taiwan-based...

China government-supported chipmaker Loongson has begun research on its CPU product line entering the next-generation 7nm technology, with development beginning in 2024, according...

With TSMC's CoWoS and the 2.5D advanced packaging from OSAT companies becoming a hot topic due to capacity shortages, advanced packaging solutions are seen as the next big thing.

United Microelectronics (UMC) has launched a wafer-to-wafer (W2W) 3D IC project with partners including Advanced Semiconductor Engineering, Cadence, Faraday Technology, and Winbond...

Following the US sanction updates against Chinese semiconductor development on October 17, which established Total Processing Performance and Performance Density as the new parameters...

Substrate-based packaging for chiplet designs is gaining favor among AI HPC customers, according to sources at OSATs.