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Thursday 2 July 2009
Taiwan-based notebook vendors under pressure of falling prices while component costs rise
Taiwan-based notebook vendors, despite a better-than-expected business outlook for the latter half of 2009, are still suffering drops in product pricing and increased costs for some...
Wednesday 1 July 2009
Intel entry-level G31 chipset in tight supply
The supply of Intel's entry-level G31 IGP chipset, which currently accounts for 50% in Intel's total shipments to the channel, has fallen far short of demand, according to sources...
Tuesday 16 June 2009
AMD to launch 8 series chipsets in January 2010, say Taiwan makers
AMD is scheduled to launch its 8 series chipsets, RD890 to replace the RD790 (790FX) and RS880D, in January 2010, with EVT (engineering verification test) and DVT (design verification...
Thursday 4 June 2009
Qualcomm expands Snapdragon platform with 45nm chipset for smarter smartphones and smartbooks
Qualcomm has announced it is expanding the Snapdragon platform with a next-generation chipset that uses 45nm process technology to provide faster processing, significant battery life...
Thursday 4 June 2009
Computex 2009: DS2 showcases 200Mbps powerline communication chipset
DS2, a supplier of high-speed powerline communications technology, will launch AITANA++, the third-generation of its 200Mbps powerline communication (PLC) chipset at Computex 2009...
Tuesday 2 June 2009
Computex 2009: Intel introduces new CPUs, chipset, and wireless technology
Intel has introduced four new processors, including a low-power version, and a value chipset, to usher in mainstream ultra-thin notebooks. Intel CULV processors will enable new consumer...
Tuesday 26 May 2009
Intel delays debut of Core i5 platform until early September
Intel has decided to postpone the debut of its new mainstream desktop PC platform, Lynnfield processors (tentatively Core i5) and 5-series chipsets, from July as originally scheduled,...
Monday 18 May 2009
AMD to showcase new notebook platform at Computex 2009, says paper
AMD plans to showcase its new notebook platform (Tigris) at Computex 2009, according to a Chinese-language Commercial Times report. The new platform consists a 45nm dual-core...
Tuesday 12 May 2009
China market: China Telecom signs CDMA chipset cooperation agreement with VIA Group, says paper
China Telecom has signed a cooperation pact with the VIA Technologies Group, aiming to develop CDMA 2000 handsets using chipset solutions from VIA's subsidiary, VIA Telecom, according...
Thursday 7 May 2009
Acer starts selling ultra-thin notebook
Acer has started selling its first CULV-based ultra-thin notebook – the 13.3-inch Timeline 3810T. The notebook adopts Intel's Core 2 Solo SU3500 CPU and GS45 chipset, along...
Thursday 7 May 2009
SiS announces chipset adopted in Pegatron nettop
Silicon Integrated System (SiS) has announced that its SiS672/96/307DV chipset has been adopted by Pegatron Technology for its Ultra Slim Atom nettop.
Wednesday 6 May 2009
Nvidia chipset sales benefit from increasing share of AMD CPUs
Nvidia's AMD-based chipset sales are expected to increase and help the company's market share rise for the first half of 2009 benefiting from AMD's increasing CPU market share, according...
Wednesday 6 May 2009
Chipset makers VIA and SiS post weak April
VIA Technologies saw revenues in April slide 48.01% on year to NT$350 million (US$10.5 million), while Silicon Integrated System (SiS) recorded a revenue decline of 31.35% on year...
Monday 4 May 2009
Netbook growth might end when economy recovers, says iSuppli
As consumers' disposable incomes dwindle, they are flocking to buy low-cost netbook PCs, driving global shipments up by 68.5% in 2009 and by a 2,424% in 2008, according to iSuppli.
Friday 24 April 2009
Intel says no plans to develop chipset solutions for WiMAX CPE products
Intel currently has no plans to step into the development of chipset solutions for WiMAX CPE (customer premise equipment) products, but will focus on solutions for WiMAX modules used...