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Tuesday 24 June 2025
Samsung takes cautious approach to adopting next-gen smartphone battery technologies
While Chinese smartphone manufacturers are using large battery capacities and fast charging speeds to launch a fierce marketing war, Samsung Electronics has chosen to "take a step...
Tuesday 24 June 2025
Tesla robotaxi quietly launches as auto camera margins squeeze suppliers
Tesla's robotaxi service has soft-launched with limited fanfare, though the autonomous vehicle sector continues drawing global investor interest. Industry analysts are tracking related...
Tuesday 24 June 2025
Taiwan govt research subsidies to power next-gen nuclear energy development
Having just delivered its promise to end nuclear power use in Taiwan, the government is now offering subsidies to research emerging nuclear power technologies.
Tuesday 24 June 2025
Samsung Electro-Mechanics begins silicon capacitor supply to Marvell Technology, marking entry into AI chip components
Samsung Electro-Mechanics has started supplying silicon capacitors to Marvell Technology, a leading US integrated circuit (IC) design company. This development marks Samsung Electro-Mechanics's...
Tuesday 24 June 2025
Ukraine defense delegation seeks Taiwan tech partnerships
A Ukrainian delegation with nearly 20 industry representatives, led by Lviv deputy mayor Serhiy Kiral has visited Taiwan recently, while defense and drone companies had comprised...
Tuesday 24 June 2025
China’s AI firms exploit Southeast Asia detour, weakening Huawei’s domestic chip ambitions
Chinese AI firms are reportedly utilizing AI compute resources in Southeast Asian nations to bypass US sanctions, exploiting regulatory frameworks that align with local laws and limit...
Tuesday 24 June 2025
UALink camp's first chip aims for tape-out, poised to challenge Nvidia
Following Nvidia's announcement of NVLink Fusion, the competition between NVLink and UALink has resurfaced.
Monday 23 June 2025
Huawei HarmonyOS 6.0 preview: AI evolution targets Apple iOS 26
Huawei officially unveiled the HarmonyOS 6.0 Beta version at the "Huawei Developer Conference 2025" (HDC 2025) held in Songshan Lake on June 20, 2025, opening developer preview opportunities...
Monday 23 June 2025
Frank Lee takes over Co-Tech chairman position, optimistic about AI-driven enterprise upgrades
Taiwan-based niche copper foil material manufacturer Co-Tech held its annual shareholders meeting on June 23, 2025. Chairman Raymond Soong officially stepped down after an 11-year...
Monday 23 June 2025
Chip makers brace for brutal competition as cloud ASIC market heats up
Industry forecasts for application-specific integrated circuits have turned bullish, with major players and research firms upgrading their cloud ASIC demand projections for 2026-2028...
Monday 23 June 2025
AI chip design seen in second inning, says Synopsys executive
At its annual SNUG Taiwan event this week, Synopsys Senior Vice President of IP Group John Koeter told DIGITIMES that if AI chip development were a baseball game, the industry...
Monday 23 June 2025
CSCC ramps up advanced carbon materials for AI server power systems amid green shift
China Steel Chemical Corporation (CSCC) held its 2025 annual shareholders meeting on June 17, addressing significant operational and strategic shifts amid a challenging market environment...
Saturday 21 June 2025
Taiwan shifts to private firms after ITRI exits stalled B5G project
Taiwan's Industrial Technology Research Institute (ITRI) will end its contract with the Taiwan Space Agency after admitting that low-Earth orbit satellite development falls outside...
Friday 20 June 2025
GBM expands AI product line via Lincstech acquisition, focus on Singapore and Malaysia operations
Global Brands Manufacture (GBM), a PCB and EMS subsidiary of Walsin Technology, recently held a shareholders' meeting led by chairman Yu-Heng Chiao to discuss acquiring Japan's Lincstech...
Friday 20 June 2025
Samsung and SK Hynix reportedly accelerate VCT DRAM development as stepping stone to 3D DRAM
Samsung and SK Hynix are advancing vertical channel transistor (VCT) technology through 4F² DRAM prototypes as a transitional step toward 3D DRAM, while Micron is bypassing VCT...