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Friday 6 March 2026
Edge AI developer Microip brings AIVO platform to drone systems

Microip will attend Embedded World 2026 in Nuremberg, Germany, from March 10 to 12. The company has released details of several new hardware...

Friday 6 March 2026
South Korean Academia: NAND scaling nears ceiling; China seen closing gap
The rapid expansion of artificial intelligence is driving strong growth in the memory market. Compared with DRAM, which still has room for structural innovation, NAND flash has largely...
Friday 6 March 2026
UK space industry warns supply chain strains threaten growth, urges shift from grants to contracts
At the 2026 UK Space-Comm Expo held March 4-5 in London, a forum on "Strengthening Space Supply Chain Resilience" unexpectedly turned into an industry venting session. Participants...
Friday 6 March 2026
Unitree, Leju, and AgiBot showcase humanoid robots at AW 2026

China's leading humanoid robot developers gathered at Smart Factory and Automation World 2026 (AW 2026) in South Korea, where companies...

Friday 6 March 2026
Supply-chain firms become front-line partners as tech outpaces testing and standards
Rapid iteration in AI and low-earth orbit satellite communications has pushed suppliers to assume design and validation roles, reshaping Taiwan's position in global manufacturing e...
Friday 6 March 2026
China chip leaders call for national effort to build 'Chinese ASML'

China's semiconductor industry leaders are calling for a nationwide effort to develop a domestic equivalent of ASML within five years,...

Friday 6 March 2026
ITRI, NCU advance Taiwan-Japan space collaboration through study program

The rapid advancement of space technology has led to a growing range of applications, including satellites and launch vehicles, attracting significant cross-sector investment...

Friday 6 March 2026
Hangzhou signs US$3.7b AI GPU deal: China's multi-vendor chip strategy

On February 28, Hangzhou convened an AI development summit at the Hangzhou Civic Center aimed at positioning the city as China's leading...

Thursday 5 March 2026
Advantech optimistic about 1Q26 outlook with strong edge AI orders and B/B ratios
Industrial PC (IPC) vendor Advantech held its 2025 fourth quarter and full-year earnings conference on March 4, 2026, chaired by Chairman K.C. Liu, President Eric Chen, and President...
Thursday 5 March 2026
Pichai congratulates Google Taiwan's 20th anniversary, eyes AI era milestones
Google Taiwan marked its 20th anniversary this year, highlighting its evolution into a major hardware and AI infrastructure hub outside the company's US headquarters. At a March 4...
Thursday 5 March 2026
Suzuki to acquire Kanadevia's solid-state battery business to strengthen EV technology
Suzuki Motor Corporation said it will acquire the all-solid-state lithium-ion battery business of Japanese engineering firm Kanadevia Corporation, as the automaker steps up development...
Thursday 5 March 2026
Taiwan weighs power controls for AI data centers as compute push tests grid capacity

Taiwan is exploring regulatory measures to manage the rising electricity demand from AI computing infrastructure, even as the government...

Thursday 5 March 2026
Commentary: HBM hybrid bonding race heats up, but memory makers slow to adopt
Competition in the high bandwidth memory (HBM) market is intensifying, prompting equipment makers such as Hanwha Semitech and Semes to accelerate...
Thursday 5 March 2026
AI's power problem: US tech giants seek grid solutions while China builds energy edge

On March 4 local time, the White House will host a signing ceremony that could influence the direction of global AI competition. Technology...

Thursday 5 March 2026
Hanmi Semiconductor strengthens ties with India amid Micron facility launch
South Korean thermal compression bonder leader Hanmi Semiconductor has announced the development of the industry's first dual-function BOC COB Bonder, capable of performing both Board-on-Chip...