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Wednesday 14 October 2026
Broadcom executive says chipmakers must tackle packaging, power limits together
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Wednesday 14 October 2026
CyberTAN sells Hsinchu site in US$68B deal to fund strategy shift
CyberTAN Technology's sale of its Hsinchu Science Park factory and auxiliary facilities signals a broader shift toward higher-growth networking and AI infrastructure. The move may...
Wednesday 14 October 2026
Applied Materials CEO says AI race hinges on technology and capacity
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Wednesday 14 October 2026
Chinese automakers face three hidden barriers in European expansion
China-based automakers are mounting an aggressive push into Europe, enjoying rapid early momentum. However, supply chain analysts note that the ultra-fast development model perfected...
Wednesday 14 October 2026
SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Wednesday 14 October 2026
Pegatron showcases rack-scale AI infrastructure at OCP Global Summit
Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
Tuesday 13 October 2026
Taisic Materials expands SiC capacity for AI data centers, 8-inch markets
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
Tuesday 13 October 2026
SK Hynix unveils low-power processor design for SSDs
SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
Tuesday 13 October 2026
Stellantis rejects brand split, urges EU to reward local carmaking
At the Paris Motor Show, Stellantis NV CEO Antonio Filosa rejected proposals to split the company's European and US brands and said the company would not sell Maserati. The automaker...
Tuesday 13 October 2026
South Korea's YMT targets fivefold rise in glass-substrate plating capacity
South Korean electronic materials supplier YMT is accelerating its expansion into glass-substrate electroplating. The company plans to increase related capacity to roughly four times...
Tuesday 13 October 2026
Ecosia drops Mistral AI models for Chinese open-weight alternatives
Europe's drive for sovereign AI faces a new test as German search engine Ecosia abandons France's Mistral AI models in favor of open-source AI, including models from China. Ecosia...
Tuesday 13 October 2026
Applied Materials opens R&D center to speed chipmaking for the AI era
Applied Materials has opened its Equipment and Process Innovation and Commercialization (EPIC) Center in Sunnyvale, California, positioning the Silicon Valley site as a new hub for...
Tuesday 13 October 2026
Geothermal power too costly for chipmakers? Taiwan's semiconductor industry sees value beyond electricity prices
As geothermal energy prepares to enter Taiwan's semiconductor renewable electricity market, the most immediate question is how much each kilowatt-hour (kWh) will cost compared with...
Tuesday 13 October 2026
Nan Pao sees breakthroughs in adhesives for semiconductors, foldable displays
Nan Pao Resins Chemical reported September revenue of NT$2.308 billion (US$72.35 million), up 16.5% year-over-year and a record for the same period, as it continued to develop new...