CONNECT WITH US
NEWS TAGGED DEVELOPMENT
Monday 27 July 2026
Samsung to use 2nm process for HBM5 base die as heat challenge grows

Samsung Electronics plans to manufacture the base die for its next-generation HBM5 memory using a 2nm gate-all-around foundry process,...

Monday 27 July 2026
AIDC secures NT$22 billion in civil aviation, engine contracts to boost long-term growth
Taiwanese aerospace company Aerospace Industrial Development (AIDC) secured new contracts worth more than NT$22 billion (approx. US$680.27 million) with several major aerospace companies...
Monday 27 July 2026
Stalled drone law aside, Taiwan's industry wants Taiwan's own DARPA

Taiwan's proposed legislation governing unmanned systems remains stalled as competing political parties continue to debate multiple...

Monday 27 July 2026
India's NIELIT and SCL expand access to indigenous semiconductor design kit through eChipHub
India's National Institute of Electronics and Information Technology (NIELIT) and the Semiconductor Laboratory (SCL) have collaborated to make SCL's indigenous 1.2-micrometer Process...
Monday 27 July 2026
IBM agrees to acquire HRL Laboratories to expand quantum computing capabilities
IBM has signed a definitive agreement to acquire HRL Laboratories, a US research and development company known for its work in quantum technologies, to strengthen its long-term quantum...
Monday 27 July 2026
Hitachi selected for Japan quantum computing project with Intel collaboration
Hitachi has been selected as the prospective implementation organization for a Japanese government-backed project to advance next-generation quantum computers, with Intel contributing...
Sunday 26 July 2026
AUO's Micro LED push signals a broader shift from displays to smart interfaces
AUO says its Micro LED technology is moving beyond screens and into a broader smart interface platform, even as one high-profile automotive project was shelved. The company argues...
Saturday 25 July 2026
Rapidus links 2nm chips, HBM and advanced packaging in AI foundry strategy
Rapidus is treating advanced packaging as a central part of its 2nm foundry strategy, not a downstream assembly service. The Japanese chipmaker aims to connect design enablement, front-end...
Saturday 25 July 2026
Taiwan firms push local robot dog parts, eye non-China supply chains

As global companies rush to tap the robotics boom, Taiwan's manufacturers are focusing on a blue ocean strategy centered on components,...

Saturday 25 July 2026
China folds data centers into 15th Five-Year renewable energy plan
China's National Development and Reform Commission (NDRC) and the National Energy Administration (NEA) on the 23rd released the 15th Five-Year Plan for Renewable Energy Development,...
Saturday 25 July 2026
Chunghwa Telecom urges Taiwan to integrate low-altitude communications into key infrastructure
Chunghwa Telecom (CHT) has called on the Taiwan government to build low-altitude communications into national critical infrastructure planning as drones move toward beyond visual line...
Saturday 25 July 2026
Hisense expands AI strategy into energy, chips, and automotive electronics
Hisense outlined a broader AI strategy at its global partner conference in New York, saying it will expand beyond home appliances into semiconductors, smart energy, laser displays,...
Saturday 25 July 2026
South Korean leaders meet Nvidia as AI partnerships expand
South Korean President Jae Myung Lee, senior government officials, business executives, and researchers gathered in San Francisco this week for an AI summit with Nvidia and industry...
Saturday 25 July 2026
Intel, China-based Lens Technology partner to explore glass substrate semiconductor packaging
Intel Corporation and Lens Technology have announced a strategic collaboration to explore the development of advanced semiconductor packaging technologies using glass substrates. The...
Friday 24 July 2026
Huawei founder endorses Tau Law as sole path for post-Moore chip development

Huawei founder Ren Zhengfei has publicly endorsed the company's τ (tau) Law as Huawei's sole technological path for advancing semiconductor...