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Thursday 26 March 2026
China's Naura and AMEC lead China's push into advanced chip packaging
As advanced packaging pushes toward 3D integration and high-bandwidth computing, hybrid bonding has emerged as a critical battleground for semiconductor equipment makers.
Thursday 26 March 2026
Automakers face costly software gamble as industry shifts to software-defined vehicles
The shift to software-defined vehicles (SDVs) will affect consumers, suppliers, and investors worldwide: automakers face huge upfront R&D and cloud costs, uncertain software revenue,...
Thursday 26 March 2026
Taiwan's robotics alliance mobilizes cross-domain resources to tackle aging society needs and compete globally
Taiwan is accelerating its robotics strategy to address a rapidly aging population and capture emerging global demand, with the Robotics Innovation Alliance (RIA) mobilizing cross-industry...
Thursday 26 March 2026
Broadcom to mass-produce 400G single-lane PAM4 DSP by 2027, vows to maintain lead
Broadcom recently announced that it completed development of a 400G single-lane PAM4 digital signal processor (DSP) at the Optical Fiber Communication Conference (OFC) 2026, signaling...
Thursday 26 March 2026
Tescan Opens Korea Demo Lab for APAC Semiconductor and Academia

Tescan  announced the official opening of its upgraded Tescan Korea Demo Lab & Office in Seoul, bringing together its relocated Korea office and enhanced demo...

Wednesday 25 March 2026
Taipei as 'heart of global AI': Mayor Chiang showcases city's growing industrial magnetism at AI Expo

Driven by a wave of massive technological investments and strategic corporate partnerships, Taipei City is rapidly transforming into a premier global...

Wednesday 25 March 2026
Taiwan defense groups urge support for drone industry in face of budget delays
As countries worldwide actively develop their drone industries and build autonomous supply chains, Taiwan's progress remains stalled. In a statement issued on March 22, Taiwan's Executive...
Wednesday 25 March 2026
Denso proposes acquisition of Rohm to strengthen automotive and power control
Automotive parts giant Denso, closely linked with Toyota Motor, has officially submitted a proposal to acquire shares in Rohm Semiconductor, signaling its clear intent to pursue a...
Wednesday 25 March 2026
Ramon.Space and Foxconn unit team to develop orbital data centers
Ramon.Space and Ingrasys announced an expanded collaboration to jointly develop a space data center platform, signaling a move to address rising energy and bandwidth pressures on terrestrial...
Wednesday 25 March 2026
'China Speed': the new benchmark in global auto competition
Through highly centralized supply chains, a software-first development philosophy, and extensive state subsidies, Chinese automakers have compressed traditional vehicle development...
Wednesday 25 March 2026
Taiwan chipmakers chase drone imaging edge with thermal and AI
Non-China supply chains in the drone sector are emerging as a new battleground for global technology vendors, with Taiwan's chipmakers increasingly expanding into the space. Among...
Wednesday 25 March 2026
Arm defends shift into chips as AGI CPU targets agentic AI demand
Arm unveiled its first "Arm AGI CPU" on March 24 at its Arm Everywhere event, marking a major shift in its business model. The chip, conceived three years ago and now ready for mass...
Tuesday 24 March 2026
Sharp taps BD chief as CEO in post-restructuring shift
Sharp Corporation, a subsidiary of Foxconn, has named its Chief Business Development Officer, Tetsuji Kawamura, as its next president and CEO, placing an executive with deep overseas...
Tuesday 24 March 2026
Samsung reportedly developing next-gen tri-fold and slider phones for 2027 launch
Samsung Electronics is reportedly advancing development of its next-generation tri-fold smartphone following the Galaxy Z TriFold, which ceased production just three months after launch...