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Thursday 3 September 2026
Niching validates 500-ton press for large heat spreaders
Niching Industrial is expanding its heat-spreader capacity as AI and high-performance computing demand pushes up orders across the global semiconductor supply chain. The company said...
Thursday 3 September 2026
Zeiss deepens Taiwan bet as advanced chip packaging raises the stakes for inspection tools
Zeiss is expanding its Taiwan presence as artificial intelligence (AI) accelerates demand for smaller chips, vertical stacking, and 2.5D and 3D heterogeneous integration. The shift...
Thursday 3 September 2026
CXMT's 'Hefei Project' exposed in Samsung DRAM theft case
South Korean prosecutors allege that Chinese memory maker ChangXin Memory Technologies (CXMT) set up an internal "Hefei Project" in 2016 to obtain Samsung Electronics' core DRAM technology...
Thursday 3 September 2026
Google to expand Taipei AI infrastructure center as Taiwan ties deepen
Google will expand its AI infrastructure research and development center in Taipei's Shilin district, adding 60% more office space, as it deepens work with Taiwan's supply chain on...
Thursday 3 September 2026
Alpha Networks, ITRI develop B5G/Pre-6G Massive MIMO base stations
Network equipment maker Alpha Networks said it has teamed up with Taiwan's Industrial Technology Research Institute (ITRI) and Chen Lung Technology to jointly advance the "B5G/Pre-6G...
Wednesday 2 September 2026
TSMC moves into Baipu Industrial Park, boosts advanced packaging
TSMC will set up operations in Kaohsiung's Baipu Industrial Park, helping create Taiwan's first advanced packaging materials and equipment supply-chain cluster. Closely watched by...
Wednesday 2 September 2026
TSMC reportedly asks suppliers to develop 5μm HBM microbumps
TSMC has asked materials and equipment suppliers to develop 5-micrometer-class microbump bonding and underfill technology for advanced HBM packaging, according to ETNews,...
Wednesday 2 September 2026
Hardware isn't the problem — TSMC exec flags software, substrate gaps in 3D IC
Speaking at the SEMI 3DIC Advanced Manufacturing Alliance (3DICAMA) Global Summit on September 1, Jun He, TSMC Vice President of Advanced Packaging Technology and Service, noted that...
Wednesday 2 September 2026
AI demand push expands wafer industry's growth outlook
AI is reshaping demand well beyond chips, and GlobalWafers chair Doris Hsu said this shift is lifting the strategic importance of silicon wafers across the semiconductor supply chain...
Wednesday 2 September 2026
Micro LED maker PlayNitride targets Micro LED optical communications within two years
Micro LED maker PlayNitride Inc. expects the technology to enter commercial optical communications applications within two years, expanding beyond displays into AI devices, data center...
Wednesday 2 September 2026
8 September Hsinchu seminar: Silicon photonics driving AI chains

As AI infrastructure drives demand for higher bandwidth, lower power consumption and faster connectivity, silicon photonics is becoming increasingly important to the...

Tuesday 1 September 2026
Taoyuan eyes northern AIDC hub, touts Tatan and LNG cooling edge
Taiwan's limited land and heavy dependence on imported energy have made power a scarce and strategic resource in the compute era, putting AI data center (AIDC) site selection on the...
Tuesday 1 September 2026
Taiwan chip equipment maker Skytech opens advanced process lab with TSMC backing
Skytech and TSMC have opened an Advanced Process Laboratory focused on next-generation semiconductor manufacturing, highlighting TSMC's continued efforts to support Taiwan's domestic...
Tuesday 1 September 2026
India expands chip ambitions with full Semicon 2.0 notification
India has unveiled the next phase of its semiconductor policy, a move that could reshape global chip supply chains, investment flows, and talent markets. The expanded program aims...
Tuesday 1 September 2026
Taiwan clears Lam Research's NT$9.8 billion subsidiary injection as etch leader scales R&D worldwide
Taiwan's Ministry of Economic Affairs has approved a NT$9.835 billion (approx. US$310 million) capital injection by Lam Research into its Taiwanese subsidiary, Lam Research Taiwan,...