CONNECT WITH US
NEWS TAGGED DEVELOPMENT
Friday 13 November 2026
Quantum computing faces security, geopolitical, talent hurdles
The 2026 UK National Quantum Technologies Showcase recently concluded in London, where the DIGITIMES team interviewed experts from the UK's industry, academia, and research sectors...
Friday 13 November 2026
Taiwan’s drone makers look beyond hardware to AI
DIGITIMES hosted a Tech Forum on developments in unmanned vehicles and Taoyuan's low-altitude economy, with Taoyuan Mayor Simon Chang, Qisda Chairman Peter Chen and Auden Techno Chairman...
Thursday 12 November 2026
Taiwan's electronics industry targets four overseas tech parks under TEEMA's global expansion plan
The Taiwan Electrical and Electronic Manufacturers' Association (TEEMA) released its first industry white paper in 78 years on November 11, proposing a "Taiwan+N" global expansion...
Thursday 12 November 2026
Innovation, AI investments will shape the future, says Kinpo president Hsu
The award ceremony for the fourth K. T. Li Award was held in Taipei on November 10, with this year's awards presented by former President Ing-wen Tsai to Kinpo-Compal Group president...
Thursday 12 November 2026
TECO pivots to AI infrastructure services with Japan project
TECO Electric & Machinery is expanding into global AI computing infrastructure, announcing on the November 11 that it will partner with AI cloud service provider GMI Cloud and...
Thursday 12 November 2026
Samsung explores electronic skin for humanoid robot hands
Samsung Electronics is testing electronic skin on the hands of its humanoid robots with South Korean startup Midas H&T, seeking to overcome a key commercialization barrier: combining...
Thursday 12 November 2026
Commentary: AI trend holds despite looming funding squeeze
The US midterm election results, which delivered a major Democratic victory, and national security concerns surrounding an affair between an alleged Chinese spy and Nvidia CEO Jensen...
Thursday 12 November 2026
Taiwan mobilizes academic R&D to address post-Moore semiconductor equipment gaps
Taiwan is stepping up efforts to develop next-generation semiconductor research equipment, as conventional commercial tools increasingly fall short of emerging R&D requirements...
Wednesday 11 November 2026
Samsung targets early 2027 for first 3D Cube-H design kit
Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Wednesday 11 November 2026
Asia Electronic Materials advances PTFE Hybrid solution for AI clients
Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit...
Wednesday 11 November 2026
SK Hynix taps HBM veteran to lead US business as competition intensifies
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
Wednesday 11 November 2026
SynPower and AblePrint to co-develop equipment to curb substrate warpage
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions,...
Wednesday 11 November 2026
SK Hynix taps Nvidia to speed up memory chip simulations
SK Hynix is using Nvidia's AI technology and GPU acceleration to speed up memory chip simulations, with improvements in etching-process development and tests of thermal and elastic...
Wednesday 11 November 2026
ASMedia raises own-brand prices as chip supply costs climb
ASMedia Technology reported consolidated revenue of NT$2.66 billion (approx. US$80.9 million) in the third quarter of 2026, with a gross margin of 51.6%, as rising substrate, outsourced...
Wednesday 11 November 2026
Grab, SoftBank deepen Malaysia's push to become SEA's AI infrastructure hub
Grab and SoftBank Group plan to invest a combined US$1.85 billion in two AI infrastructure projects, including data centers, in Malaysia, as they seek to capitalize on growing demand...