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Friday 28 August 2026
Huawei targets 100 million HarmonyOS 6 devices, paving way for global expansion next
Huawei rotating chairman Eric Xu said at the HarmonyOS Ecosystem Conference 2026 in Shenzhen on August 28 that the HarmonyOS ecosystem now has more than 100,000 native applications,...
Friday 28 August 2026
Samsung eyes zHBM products from 2029 as heat remains key hurdle
Samsung Electronics expects products based on its first-generation zHBM specifications to appear in 2029 or later, giving the 3D memory concept unveiled earlier this month an initial...
Friday 28 August 2026
SK Hynix weighs closer ties with Kioxia in NAND
SK Hynix is weighing closer cooperation with Japan's Kioxia Holdings in NAND flash, extending the strategic message from its newly launched US HBM expansion into a memory segment where...
Friday 28 August 2026
Lam Research breaks ground on Oregon lab expansion for AI chip development
Lam Research has begun work on a new Oregon research lab as part of a more than US$3 billion global investment aimed at speeding development of advanced AI chips. The expansion could...
Friday 28 August 2026
Renesas opens physical AI, robotics lab in Beijing
Renesas Electronics has opened a physical AI and robotics lab in Beijing, a move that could speed the development of safer, smarter machines for factories, logistics, and homes worldwide...
Friday 28 August 2026
Taiwan's next biotech prescription: AI drug discovery, smart devices, biomedical chips
Taiwan is charting a new direction for its biomedical industry, drawing on its strengths in semiconductors, AI hardware, precision manufacturing and healthcare. AI-powered drug discovery,...
Friday 28 August 2026
China's industrial reboot: AI, chips, robotics, 6G define next five years
China is setting out a five-year industrial strategy centred on artificial intelligence (AI), semiconductors, 6G, robotics and advanced manufacturing, seeking to strengthen the country's...
Friday 28 August 2026
Wah Lee targets 2Q27 ODM phase as robotics push moves beyond components
Wah Lee Industrial is targeting the second quarter of 2027 to move its Physical AI push into an ODM development phase, signaling an effort to capture more value beyond supplying materials,...
Thursday 27 August 2026
Ford adopts Apple Maps data for next-gen smart driving
Ford Motor Company has announced that it will be adopting Apple's MapKit for Automotive software development kit (SDK) for its own universal EV platform, and feed Apple Maps data to...
Thursday 27 August 2026
Doosan thins memory-package CCL insulation to 13µm
Doosan Corporation's Electro-Materials BG has developed copper-clad laminate (CCL) technology that reduces the prepreg (PPG) insulating layer used in memory semiconductor package substrates...
Thursday 27 August 2026
China's AI software strategy gains scale as OpenHarmony ecosystem tops 1.35 billion devices
China is placing artificial intelligence, industrial software and open-source ecosystems at the centre of its next phase of manufacturing digitalisation, seeking to strengthen domestic...
Thursday 27 August 2026
Taiwan plans higher power growth to meet AI demand, officials say
Taiwan's government said it will raise electricity supply capacity as it responds to rising demand from AI and industry. The comments came on August 26 at the opening of the 2026 New...
Thursday 27 August 2026
China open-source AI usage hits record high as DeepSeek leads
China's open-weight AI models have surged in usage and have now overtaken proprietary models for the first time. South China Morning Post (SCMP), citing data from US web development...
Thursday 27 August 2026
Tesla doubles down on custom AI chips as Musk claims AI5 can beat NVIDIA on efficiency and cost
Tesla CEO Elon Musk recently said the company's upcoming AI5 inference chip could deliver two to three times the performance per watt of Nvidia products when deployed in autonomous...
Thursday 27 August 2026
Beijing's AI4Chip plan puts AI to work on EDA, fabs, advanced packaging
Beijing is extending artificial intelligence deeper into semiconductor production, targeting chip design, wafer fabrication, packaging, testing, equipment, and materials under what...