Samsung Electronics aims to complete its first 3D Cube-H design kit, a hybrid copper bonding technology for vertically stacked logic chips, in early 2027, with prospective customer...
Asia Electronic Materials is developing high-frequency, high-speed substrate materials based on polytetrafluoroethylene (PTFE) through a Hybrid Coreless solution and continues to submit...
South Korean memory chipmaker SK Hynix has named former development chief Hyun Ahn to lead a new Americas unit as competition for custom high-bandwidth memory (HBM) pushes suppliers...
SynPower has signed a strategic cooperation agreement with AblePrint Technology (APT) to jointly develop substrate equipment with warpage suppression annealing system (WSAS) functions,...
SK Hynix is using Nvidia's AI technology and GPU acceleration to speed up memory chip simulations, with improvements in etching-process development and tests of thermal and elastic...
ASMedia Technology reported consolidated revenue of NT$2.66 billion (approx. US$80.9 million) in the third quarter of 2026, with a gross margin of 51.6%, as rising substrate, outsourced...
Grab and SoftBank Group plan to invest a combined US$1.85 billion in two AI infrastructure projects, including data centers, in Malaysia, as they seek to capitalize on growing demand...
Sysgration returned to profitability in the third quarter of 2026 as shipments of new rugged industrial PC (IPC) projects ramped up, while gross margin rose to 22.73% from 22.23% in...
Japan's state-backed chipmaker Rapidus is facing mounting technological challenges that could delay its plan to begin mass-producing 2nm semiconductors by March 2028, potentially undermining...
Taiwan's machinery exports grew for a 21st consecutive month in October, led by electronic equipment on strong AI and semiconductor demand, according to the Taiwan Association of Machinery...
China's AI computing infrastructure is expanding rapidly, with local governments and state-backed investment platforms funding GPU purchases, server deployments, and data center construction...
Quanta Computer vice chairman C.C. Leung said on November 10, following the K.T. Li Award ceremony, that the US must continue expanding its investment in artificial intelligence (AI)...
Qisda is increasing its investment in AI, with chairman Peter Chen saying a short-term slowdown in data-center construction would not derail the long-term AI trend and could ease component...
SoftBank Group, Grab, and Petroleum Sarawak Berhad (PETROS) have entered into joint development agreements to deploy US$1.85 billion in initial seed capital for large-scale artificial...
Y.S. Tech will open a high-performance computing liquid-cooling laboratory at its new Renwu plant in Kaohsiung by the end of 2026, strengthening its ability to develop high-efficiency,...
