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Thursday 1 October 2026
Synopsys and Amazon sign US$1 billion-plus deal to speed custom chip development
Synopsys announced a strategic agreement with Amazon on September 30, a multi-year deal valued at more than US$1 billion that is intended to speed up Amazon's custom silicon work and...
Thursday 1 October 2026
China's share of global solar module demand falls below 40% as Europe, India gain ground
The global solar module market is undergoing a significant geographic shift in 2026. China remains the world's largest source of module demand, but its share of global shipments is...
Thursday 1 October 2026
BOE eyes closer ties with Samsung, LG as it pushes into chip packaging
China's BOE Technology is seeking closer ties with Samsung Electronics and LG Electronics as the display maker expands beyond panels into semiconductor glass substrates and advanced...
Thursday 1 October 2026
Samsung AI Forum 2026 puts agentic AI at center of transformation across devices, robotics, and chipmaking
Samsung Electronics brought global AI experts and researchers together in Seoul on September 30 for the Samsung AI Forum 2026, exploring how agentic AI and physical AI can deliver...
Thursday 1 October 2026
US unveils South Korea's US$20B nuclear, Alaska LNG investment
The US has unilaterally announced South Korea's investment package in the US, including Alaska LNG development and the construction of eight large nuclear power plants. Seoul had previously...
Thursday 1 October 2026
China Rare Earth Group moves downstream, linking rare-earth magnets to robot direct-drive systems
China Rare Earth Innovation Technology and Beijing-based Direct Drive Tech signed a strategic cooperation agreement on September 29 to jointly develop high-performance magnetic materials...
Thursday 1 October 2026
AI boom drives Southern Taiwan Science Park revenue past NT$1.7 trillion in 1H26
The Southern Taiwan Science Park (STSP) posted revenue of NT$1.77 trillion (approx. US$55.66 billion) in the first half of 2026, up 28.57% from the same period in 2025. Growth was...
Thursday 1 October 2026
How a TSMC veteran is steering Singapore's lab-to-fab chip strategy
Yee-Chia Yeo, vice president for innovation and enterprise at A*STAR, returned to Singapore in 2022 and has since turned years of industry experience into a strategy for advancing...
Thursday 1 October 2026
Nvidia pushes full-stack AI agent security as OpenAI sits out partner roster
Amid growing concerns over increasingly autonomous AI systems, Nvidia CEO Jensen Huang has repeatedly argued that AI agent jailbreaks are fundamentally an "engineering problem" that...
Thursday 1 October 2026
From Excel to Editable Presentations: AI Streamlines Financial Reporting

Financial institutions routinely process massive volumes of operational data, turning complex analysis into executive presentations for trend tracking, performance evaluations,...

Wednesday 30 September 2026
Taiwan backs TSMC's US push but insists core R&D stays home
Taiwan's semiconductor industry, which originated in the Hsinchu Science Park and later expanded to the Central and Southern Taiwan Science Parks, now encompasses manufacturing bases...
Wednesday 30 September 2026
ASE Technology buys Singapore factory for AI chip testing expansion
ASE Technology Holding's Singapore unit has approved the purchase of a factory in Yishun Industrial Park from Dutch LED maker Lumileds Singapore for about US$68.44 million, or about...
Wednesday 30 September 2026
SK Hynix resumes DDR4, DDR5 packaging orders with Winpac
SK Hynix has resumed outsourcing DRAM packaging to South Korean outsourced semiconductor assembly and test (OSAT) provider Winpac, reviving a supplier relationship that ended in 2023...
Wednesday 30 September 2026
Jensen Huang rejects AI doomsday framing, calls safety an engineering problem
As warnings about catastrophic AI risks intensify, Nvidia CEO Jensen Huang is making a different case: AI safety should be treated as an engineering challenge, not a justification...
Wednesday 30 September 2026
India bars Semicon 2.0 chip plants from selling or mortgaging assets before full production
India has barred semiconductor projects approved under its Semicon 2.0 program from selling, disposing of, or mortgaging project assets until commercial production of the entire project...