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Wednesday 13 May 2026
L&T Semiconductor Technologies signs multiyear agreement with Synopsys for AI-enabled power module design
L&T Semiconductor Technologies' multiyear agreement with Synopsys to use AI-enabled multiphysics simulation software could accelerate the development of power modules and intelligent...
Wednesday 13 May 2026
Imec's IC-Link joins TSMC 3DFabric Alliance, extending 3D integration access worldwide
Imec's IC-Link has joined TSMC's OIP 3DFabric Alliance, opening up broader access to TSMC's 3D stacking and packaging technologies for global ASIC customers. The move could accelerate...
Wednesday 13 May 2026
China's fiber optic giant unveils world's largest preform for AI data center boom

China's Fiberhome Telecommunication Technologies has unveiled what it claims is the world's largest optical fiber preform, highlighting...

Wednesday 13 May 2026
Taiwan to set up US industrial parks as bilateral ties deepen
The US may soon see Taiwan-style industrial parks, according to officials and industry representatives who recently visited the country to attend a trade summit. The development could...
Wednesday 13 May 2026
iCatch's 360-degree Vision-based Obstacle Avoidance System Integrated into Avilon's Drone

iCatch Technology announced that its 360-degree vision-based obstacle avoidance system has been successfully integrated into Avilon Intelligence's drone platform. Through...

Wednesday 13 May 2026
Singapore pushes ASEAN semiconductor alliance as AI reshapes global supply chains

At a time when the global semiconductor industry is undergoing a historic restructuring, the Singapore Semiconductor Industry Association...

Wednesday 13 May 2026
Indian firms step up EV battery development amid China technology concerns
Indian conglomerates are accelerating efforts to develop domestic electric vehicle (EV) and battery technologies as access to Chinese know-how becomes increasingly uncertain.
Tuesday 12 May 2026
Applied Materials and TSMC team up at EPIC Center to fast-track AI chip development
Applied Materials and TSMC have announced a partnership to accelerate semiconductor technologies for AI, aiming to speed commercialization and improve the energy efficiency of chips...
Tuesday 12 May 2026
Taipower new president focuses on AI power demand, grid resilience
Taiwan Power Company (Taipower) is entering a new wave of generation system installations at its Tunghsiao, Talin, and Hsinta Phase II plants. New president Kuo Tien-Ho, who took office...
Tuesday 12 May 2026
OpenAI launches US$4 billion deployment venture to accelerate enterprise AI adoption

OpenAI is expanding beyond AI model development and into enterprise implementation with the launch of the OpenAI Deployment Company, a new...

Tuesday 12 May 2026
Pan Jit and subsidiary sponsor Make NTU 2026 hackathon to push robotic gripper innovations
Pan Jit International and its subsidiary participated in Make NTU 2026, a 36-hour student hackathon hosted by the electrical engineering student association at National Taiwan University,...
Tuesday 12 May 2026
Japan's diamond chip startups move toward production as factory and samples advance

Japan's diamond semiconductor sector is moving closer to practical use, as university-backed startups advance factory construction,...

Monday 11 May 2026
ASE, Wus to jointly build Kaohsiung advanced packaging plant by 2029
Advanced Semiconductor Engineering (ASE) and PCB manufacturer Wus Printed Circuit are teaming up to build a new packaging facility in southern Taiwan, as the world's largest chip assembler...
Sunday 10 May 2026
King Slide says AI compute demand is not a bubble and expects strong 2Q26 orders
King Slide, a maker of server rails and high-end mechanical components, said on May 7 that AI compute demand is not a bubble and that orders were expected to remain strong in the second...
Friday 8 May 2026
TSMC reportedly pushes CoPoS exclusivity to lock in next-gen packaging lead
TSMC is accelerating the expansion of its CoWoS advanced packaging capacity while pushing ahead with the more technically demanding panel-level packaging technology CoPoS, aiming to...