Coupang announced on November 5 that it was expanding the operating space at its first warehouse and logistics center in Taoyuan, Taiwan, as the company's local business continued...
As weak end demand and intensifying competition weigh on the global display industry, Taiwan panel makers are pursuing new growth beyond traditional display manufacturing, with automotive...
Eight Taiwanese electronics manufacturers have disclosed approximately US$2.9 billion in factory-related asset transactions and investment plans in Texas since January 2024, accounting...
Acer is set to approve a senior executive reshuffle at its board meeting on Thursday afternoon, with Acer Being Communication general manager Chan-ping Bo reportedly taking over product...
Industrial PC (IPC) maker Advantech announced on November 5, 2026, that founder K.C. Liu will become full-time chairman on January 1, 2027, while Miller Chang, currently president...
US voters favored restrictions on data center development in 40 of 41 local ballot measures across 10 states on November 3, signaling growing opposition to AI infrastructure expansion...
The European Union has launched a EUR525 million (approx. US$590 million) initiative to strengthen its semiconductor design industry, seeking to narrow the gap with the US and China...
Taiwan's deep geothermal sector is reporting fresh progress after a 2,049-meter well that reached temperatures of 140 degrees Celsius was completed in a challenging metamorphic rock...
OpenAI plans to acquire Pierre Computer Company, extending its push into the infrastructure behind AI-generated software as competition expands beyond coding assistants to the systems...
FPT has begun trial operations at a semiconductor testing and packaging plant in Vietnam's Bac Ninh province, initially focusing on chip testing as it prepares to expand into packaging...
Taiwan and the Netherlands announced four joint research and development collaborations on November 4 under their bilateral Technology Bridge Program, targeting photonic packaging,...
HCLTech said AI chips will need about 1.5 years to move into mass adoption beyond cloud infrastructure, as the industry develops integrated semiconductor platforms to support large-scale...
ASML and TSMC announced plans in September 2026, ahead of the SPIE BACUS symposium, to advance high-numerical-aperture extreme ultraviolet (High NA EUV) lithography by replacing the...
Voters in Sunbury, Ohio, approved a ban on large data centers in the November 3 election, raising a new obstacle to Amazon's proposed US$2 billion project as communities across the...
AI demand continues to heat up while major global memory makers shift capacity toward higher-value products, keeping niche memory supplies tight in the near term. China-based IC design...
