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Thursday 15 October 2026
ProLogium targets AI data centers, aviation with solid-state batteries
ProLogium Technology is accelerating the development of non-automotive markets for its all-solid-state batteries, targeting AI data centers, aviation, and humanoid robots as electric...
Thursday 15 October 2026
Auden expects stronger growth in 2027, sees satellite industry taking another 2–3 years to gain momentum
RF antenna and communications technology company Auden Techno recently inaugurated its global headquarters and R&D center in Bade, Taoyuan. Chairman Chang Yu-Pin said the company's...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Thursday 15 October 2026
Applied Materials targets AI-driven semiconductor equipment growth through 2030
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
Thursday 15 October 2026
Pegatron chair opposes Taipei airport relocation for AI park, proposes alternative
Pegatron Chairman Tung Tzu-Hsien expressed opposition to a proposal to relocate Taipei Songshan Airport and redevelop the site into an AI industrial park, arguing that major capital...
Wednesday 14 October 2026
Broadcom executive says chipmakers must tackle packaging, power limits together
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...
Wednesday 14 October 2026
CyberTAN sells Hsinchu site in US$68B deal to fund strategy shift
CyberTAN Technology's sale of its Hsinchu Science Park factory and auxiliary facilities signals a broader shift toward higher-growth networking and AI infrastructure. The move may...
Wednesday 14 October 2026
Applied Materials CEO says AI race hinges on technology and capacity
The contest for leadership in AI computing is being fought on two fronts—technology and manufacturing capacity—and chipmakers must advance chips, memory, advanced packaging...
Wednesday 14 October 2026
Chinese automakers face three hidden barriers in European expansion
China-based automakers are mounting an aggressive push into Europe, enjoying rapid early momentum. However, supply chain analysts note that the ultra-fast development model perfected...
Wednesday 14 October 2026
SK Hynix, Micron confront AI memory bottlenecks with HBM standardization, chip integration
AI infrastructure expansion is shifting semiconductor competition beyond individual chip performance towards memory bandwidth, data-transfer power consumption, transistor scaling,...
Wednesday 14 October 2026
TSMC, Intel, Samsung seek to break AI chipmaking's next barrier through early technology integration
Senior executives from TSMC, Intel, and Samsung Electronics outlined the growing challenges of AI chip development, spanning advanced semiconductor processes, 3D integration, and research...
Wednesday 14 October 2026
Pegatron showcases rack-scale AI infrastructure at OCP Global Summit
Pegatron showcased its end-to-end AI infrastructure capabilities at the Open Compute Project (OCP) Global Summit 2026, highlighting Nvidia-based products designed to move from engineering...
Tuesday 13 October 2026
Taisic Materials expands SiC capacity for AI data centers, 8-inch markets
Taisic Materials, a Foxconn-backed company under Kenmec Group, operates 65 crystal-growth furnaces as it expands silicon carbide (SiC) ingot and substrate production for AI data centers,...
Tuesday 13 October 2026
SK Hynix unveils low-power processor design for SSDs
SK Hynix has unveiled a new processor architecture designed to reduce power consumption and chip area in solid-state drive (SSD) controllers, expanding its efforts to address storage...
Tuesday 13 October 2026
Stellantis rejects brand split, urges EU to reward local carmaking
At the Paris Motor Show, Stellantis NV CEO Antonio Filosa rejected proposals to split the company's European and US brands and said the company would not sell Maserati. The automaker...