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Thursday 15 October 2026
Samsung, Applied Materials back startup targeting chip packaging warpage
Samsung Ventures and Applied Ventures, the venture capital arm of Applied Materials, have invested in US-based Flexcompute, backing simulation technology designed to predict semiconductor...
Thursday 15 October 2026
Taiwan Perovskite Solar Corp. deploys AI to optimize R&D, explore smart energy applications
Taiwan Perovskite Solar Corp. (TPSC) showcased its theme, "PEROVSKITE AI," at Energy Taiwan 2026, highlighting a two-way synergy between artificial intelligence and perovskite technology...
Thursday 15 October 2026
Genius Electronic Optical secures US$150 million 3M investment for optical communications
Genius Electronic Optical, a leading manufacturer of optical lenses and precision optical components, announced on October 15 that it had formed a strategic partnership with 3M, a...
Thursday 15 October 2026
LX Semicon puts SiC patents up for sale as Novatek gains ground
South Korea's LX Semicon is seeking buyers for more than 60 silicon carbide (SiC) power semiconductor patents, winding down a business it entered five years ago to reduce its reliance...
Thursday 15 October 2026
Analysis: Elon Musk's Terafab chases 10 chip iterations a year — can it rival TSMC?
Speaking to more than 2,000 Tesla owners and investors at the X Takeover event held at Tesla's Gigafactory in Austin, Texas, on October 11, Elon Musk made a candid admission: "To be...
Thursday 15 October 2026
Taiwanese chipmaker TASC targets 2027 growth with InP optical chips, glucose sensors nearing mass production
Taiwan-Asia Semiconductor Corporation (TASC) is benefiting from seasonal demand for sensing chips and new wearable launches by major US and European brands. AI server expansion has...
Thursday 15 October 2026
Taiwan urged to recruit more from overseas to address talent shortage
Pegatron chairman T.H. Tung and Topco Scientific founder J.W. Kuo called for Taiwan to recruit talent from overseas as the country faces intensifying industrial challenges. Speaking...
Thursday 15 October 2026
IBM, MeitY Startup Hub sign pact to boost India's deep tech startups
IBM and MeitY Startup Hub, an initiative of India's Ministry of Electronics and Information Technology (MeitY), have signed a memorandum of understanding (MoU) to support India's deep...
Thursday 15 October 2026
Semiconductors to consume 30% of Taiwan's power by 2035
Rising demand for semiconductor wafer fabrication, memory, advanced packaging and high-end servers is driving a sharp increase in Taiwan's power consumption. Taipower estimates that...
Thursday 15 October 2026
ProLogium targets AI data centers, aviation with solid-state batteries
ProLogium Technology is accelerating the development of non-automotive markets for its all-solid-state batteries, targeting AI data centers, aviation, and humanoid robots as electric...
Thursday 15 October 2026
Auden expects stronger growth in 2027, sees satellite industry taking another 2–3 years to gain momentum
RF antenna and communications technology company Auden Techno recently inaugurated its global headquarters and R&D center in Bade, Taoyuan. Chairman Chang Yu-Pin said the company's...
Thursday 15 October 2026
Applied Materials tracks 100-plus fabs as cleanroom capacity limits equipment growth
Applied Materials tracked more than 100 wafer fabrication projects worldwide over the past two quarters as strong artificial intelligence demand continued to meet constraints in cleanroom...
Thursday 15 October 2026
Applied Materials targets AI-driven semiconductor equipment growth through 2030
Applied Materials is increasing investments in research and development, manufacturing and its global supply chain as it targets greater market share and profitability through 2030...
Thursday 15 October 2026
Pegatron chair opposes Taipei airport relocation for AI park, proposes alternative
Pegatron Chairman Tung Tzu-Hsien expressed opposition to a proposal to relocate Taipei Songshan Airport and redevelop the site into an AI industrial park, arguing that major capital...
Wednesday 14 October 2026
Broadcom executive says chipmakers must tackle packaging, power limits together
Broadcom's Frank Ostojic said semiconductor firms need joint innovation across equipment, materials, and design to overcome bottlenecks that affect AI chips worldwide. He warned that...