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Monday 13 October 2025
Russia unveils 10-year roadmap for EUV lithography development
The Institute of Physics of Microstructures of the Russian Academy of Sciences (IPM RAS) has recently announced a long-term roadmap for the development of an extreme ultraviolet (EUV)...
Monday 13 October 2025
Weekly news roundup: China pushes DUV breakthroughs, Intel and AMD weigh partnership, Arm CEO reflects on Nvidia's strategic pivot
Below are the top DIGITIMES Asia stories from October 6 to 12, 2025.
Monday 13 October 2025
Smart Robot SIG joins 60+ Taiwan companies for application-driven development
The newly founded Smart Robot Application Special Interest Group (SIG) has brought together over 60 Taiwanese companies to focus on application-oriented deployment of intelligent...
Monday 13 October 2025
OpenAI's South Korean partnerships raise questions over spending sustainability
OpenAI CEO Sam Altman's recent multibillion-dollar partnerships with Samsung Group and SK Group for the Stargate AI infrastructure project have intensified scrutiny over the company's...
Saturday 11 October 2025
Tainan pitches semiconductor heartland to Nvidia for Taiwan HQ
Nvidia's investment plans in Taipei City have encountered changes. Taiwan's Ministry of Economic Affairs (MOEA) has been conducting a nationwide land inventory, while Tainan City...
Friday 10 October 2025
SEMICON West 2025: Chip leaders urge policy stability to counter China
At the geopolitics forum of SEMICON West 2025, corporate government affairs executives from Arm Holdings, ASML, Entegris, Intel, and Lam Research all presented policy recommendations...
Friday 10 October 2025
FuriosaAI leads South Korea's physical AI push
As South Korea aims to become a top-three global AI powerhouse, neural processing unit (NPU) startup FuriosaAI envisions AI's ultimate evolution into physical AI. The company believes...
Thursday 9 October 2025
NSTC gathers global experts to explore future of humanoid robots
Taiwan's National Science and Technology Council (NSTC) will soon host a Smart Robotics Forum, inviting experts from the US, Japan, and Germany to share insights on the latest humanoid...
Thursday 9 October 2025
Commentary: China's TGV ambitions face an uphill battle
China's development of through glass via (TGV) technology, crucial for advanced semiconductor packaging in AI and high-performance computing chips, encounters significant hurdles,...
Thursday 9 October 2025
Taiwanese firms set to revamp HR deployment as US, Thailand tighten expat rules
The restructuring of global supply chains under the Donald Trump 2.0 era is forcing companies to rethink human resource strategies. At TSMC's wafer fabrication facilities in Arizona,...
Thursday 9 October 2025
Parallel development key to meet surging AI packaging demand, says TSMC Advanced Packaging Division VP
SEMICON West 2025 was held for the first time in Phoenix, Arizona, with a significant increase in the number of CEO Summits and various forums compared to previous years, with one...
Thursday 9 October 2025
Speed vs. strategy: the diverging paths of Tesla and China's EV makers

In the rapidly evolving race to dominate automotive electrification and vehicle electronics, speed and timing have become the ultimate...

Thursday 9 October 2025
Taiwan's semiconductor playbook finds new home in Arizona
Taiwan has become Arizona's blueprint for semiconductor success. At the Arizona Semiconductor Leadership Day forum held prior to 2025 SEMICON West, the island emerged as more than...
Wednesday 8 October 2025
Tescan acquires FemtoInnovations and launches Laser Technology Business Unit

Tescan Group in September 26, 2025  announced the acquisition of FemtoInnovations, a leading innovator in ultrafast laser technologies, and the creation of a dedicated...

Wednesday 8 October 2025
China and Taiwan chart diverging paths in the 12-Inch SiC market
In the high-stakes arena of silicon carbide (SiC) innovation, a quiet transformation is underway. While much attention has focused on non-Chinese supply chains entering advanced packaging...