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Monday 15 September 2025
China targets CoWoP leapfrog as Taiwan holds tech edge
Recent market reports indicate that CoWoP has shown preliminary test results exceeding expectations. Nvidia, which leads its development, is expected to accelerate mass production...
Monday 15 September 2025
Japan grants up to JPY536 billion subsidy to Micron for advanced DRAM production
The Ministry of Economy, Trade and Industry (METI) of Japan announced on September 12, 2025, that it will provide Micron Technology with subsidies amounting to as much as JPY536 billion...
Monday 15 September 2025
Omnipotent combination of semiconductor and AI ushers in new phase of technological explosion, says former TSMC R&D VP
Former TSMC R&D vice president Jack Sun, who currently serves as senior vice president at National Yang Ming Chiao Tung University (NYCU), emphasized that semiconductors can no...
Monday 15 September 2025
Foxconn advances strategic investments to lead AI smart glasses industry
As the smartphone market nears saturation, smart glasses are emerging as the next frontier for AI-enabled wearable devices. Foxconn is positioning itself beyond contract assembly...
Monday 15 September 2025
Taiwan's Teco and Kenda explore digital twin applications

Dassault Systèmes held its annual summit forum in Taiwan on September 11, 2025, highlighting digital twin adoption in local industries...

Sunday 14 September 2025
Beyond the data center: Nvidia’s GB10 and DGX Spark mark a new phase in its AI strategy
At the recent Hot Chips 2025 conference, Nvidia detailed its latest GB10 system-on-chip (SoC) architecture, representing a miniaturized application of the Blackwell GPU architecture...
Sunday 14 September 2025
Beijing Tsinghua professor warns China must cut AI reliance on Nvidia

Wei Shaojun, vice chairman of the China Semiconductor Industry Association and professor at Tsinghua University, has called on Asian...

Saturday 13 September 2025
Utechzone joins 3D IC alliance to expand semiconductor testing capabilities and depth
To accelerate the development of heterogeneous integration and advanced packaging technologies, the "3DIC Advanced Manufacturing Alliance" was officially established on September...
Saturday 13 September 2025
TSMC builds new fab supply chain hub in southern Taiwan
TSMC continues to advance its investment plan for the Pingtung Science Park, officially opening the site for vendors to begin construction. Arthur Chuang, vice president of Facility...
Friday 12 September 2025
South Korea targets massive hydrogen market, aiming to become global leader by 2030
The South Korean government is accelerating the development of its hydrogen economy, focusing on three key policy directions: demand market expansion, supply planning, and infrastructure...
Friday 12 September 2025
SEMICON Taiwan 2025: AMD pushes panel-level, 3D, and optical packaging as AI demands soar
At SEMICON Taiwan 2025, AMD Fellow Daniel Ng, who heads the company's OSAT technology development, laid out a stark assessment of the semiconductor industry's next bottleneck: the...
Friday 12 September 2025
Commentary: MicroLED is lighting up display industry, but can it open new doors?
AUO recently announced a collaboration with leading satellite navigation and smart wearable brand Garmin to launch the world's first smartwatch featuring microLED display technology,...
Friday 12 September 2025
SEMICON Taiwan 2025: IBM's roadmap for semiconductor and quantum development extends through 2042
At a SEMICON Taiwan forum on Quantum computing, IBM Japan CTO and Vice President Norishige Morimoto detailed how AI's growing complexity—estimated to have surged by more than...
Friday 12 September 2025
SEMICON Taiwan 2025: Hanwha Semitech maps out roadmap for advanced packaging equipment with 2026 launch plans
Hanwha Semitech has announced a new strategic roadmap to strengthen its position in the advanced semiconductor packaging equipment market, unveiling next-generation systems set to...
Friday 12 September 2025
SK hynix Completes World's First HBM4 Development and Readies Mass Production
Seoul, September 12, 2025 – SK hynix Inc. announced today that it has completed development and finished preparation of HBM4, a next generation memory product for ultra-high...