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Wednesday 30 October 2024
Loongson to tape out GPU as early as 2025
According to industry reports, China-based CPU developer Loongson Technology is expected to tape out a general-purpose GPU as early as 2025. Reportedly, this GPU will be built using...
Tuesday 29 October 2024
Taiwan's power woes could deter foreign investment, warns Delta founder
Despite repeated assurances from authorities that Taiwan won't face power shortages, concerns about energy supply continue to loom over the island's industrial development. Bruce...
Tuesday 29 October 2024
Taiwan should establish digital sovereignty, benchmark foundational model
In today's digital economy, the development of national-level computing power has become an important measure of global competitiveness. Computing power, as a pillar of digital infrastructure,...
Tuesday 29 October 2024
MiTAC-Synnex chair Matthew Miau reflects on 50 years of innovation, K.T. Li's legacy, and Taiwan's AI opportunities
Taiwan stands at a pivotal moment in the AI revolution. Having established itself as a leader in AI hardware manufacturing, Taiwan will also have a chance to lead in the next wave...
Tuesday 29 October 2024
Japanese companies develop 3D analog IC for ADAS, overcoming cost and technical challenges
Oki Electric Industry and Nisshinbo Micro Devices have announced the development of an analog IC for advanced driver assistance systems (ADAS) in vehicles, reports Nikkei.
Monday 28 October 2024
Taiwan launches first domestically-made high-altitude balloon to boost communication resilience
Taiwan's Ministry of Digital Affairs (MODA) launched the first test of a domestically-made high altitude platform station(HAPS) in Taitung, aiming to bolster the island's communication...
Monday 28 October 2024
Intel expands Chengdu facility with new server chip packaging and testing services
Intel announced plans to expand its Chengdu, Sichuan facility on October 28 to offer server chip packaging services. This expansion leverages the site's existing operations to address...
Monday 28 October 2024
Samsung bets on 1c-nm DRAM to compete with HBM rivals
Samsung Electronics is reportedly progressing its 1c-nanometer DRAM, regarded as a crucial potential for the company to contend with high bandwidth memory (HBM) competitors.
Monday 28 October 2024
Tokyo Electron opens third South Korea R&D center to enhance support for local chip giants
Tokyo Electron has unveiled its third R&D center, the Tokyo Electron Technology Center Korea-2, in South Korea, strategically located to better serve clients like Samsung Electronics...
Monday 28 October 2024
China's auto industry embraces local chip production with RISC-V architecture
China's automotive sector increasingly recognizes the critical importance of local chip production, prompting a shift towards the open-source RISC-V instruction set architecture....
Friday 25 October 2024
SK Hynix dismisses HBM oversupply concerns, deepens TSMC partnership for HBM4 development
SK Hynix delivered a record-breaking performance in the third quarter of 2024 with both revenue and operating profit reaching all-time highs, driven largely by its dominance in high...
Friday 25 October 2024
Samsung reveals silicon capacitors and 3.5D packaging roadmap
Jeong Gi-tae, vice president of Samsung Electronics' foundry business unit, recently revealed the development roadmap for the company's wafer foundry technology at an industry-academic...
Friday 25 October 2024
Win Semi upbeat about compound semiconductors for AI, satellite communication applications
Compound semiconductors are crucial in the rapid advancement of AI, data center applications, and satellite communication, according to Yu-Chi Wang, vice chairman of GaAs foundry...
Friday 25 October 2024
Qualcomm touts superior battery performance despite no new PC chips
Despite not announcing any new PC chips at this year's Snapdragon Summit, Qualcomm addressed performance claims made by Intel and AMD while sharing specifications for upcoming developments...
Thursday 24 October 2024
SK Hynix maintains edge in HBM3E, but HBM4 certification and Samsung's pursuit pose risks
SK Hynix will announce its financial results for the third quarter of 2024 on October 24. During its previous earnings call, the company indicated that shipments of its HBM3E products...
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Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research