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NEWS TAGGED FC SUBSTRATE
Wednesday 12 November 2008
IC substrate maker Kinsus to see sales decline more than 15% in 4Q amid weak order volumes
IC substrate maker Kinsus Interconnect Technology expects to see a sales decline of more than 15% in the fourth quarter, while its utilization rate will be in the 65-70% range and...
Tuesday 28 October 2008
Next-generation Intel Nehalem CPU to increase consumption of FC substrates
The number of substrate layers for the next-generation Intel Nehalem-based CPU has been decided, according to industry sources, with 12 layers being the maximum, double the current...
Friday 24 October 2008
PCB maker NPC expected to see 10% sales decline in 4Q
According to Nan Ya Printed Circuit Board (NPC), demand for traditional PCBs and wire-bonding substrates is falling but shipments of flip-chip (FC) substrates remains relatively strong...
Friday 19 September 2008
Intel Nehalem CPUs expected to boost substrate demand
The launch of second-phase Intel Nehalem-based CPUs (scheduled for the third quarter of 2009) is expected to have a corresponding impact on substrate demand, according to industry...
Friday 19 September 2008
FC shipments remain strong, but other IC substrate segments constraining overall growth
Taiwan investors forecast that sales for IC substrate makers in the third quarter will have only single-digit growth due to weak demand for wire bonding substrates and PCBs, which...
Wednesday 27 August 2008
Nan Ya forecast to challenge NT$11 billion in 3Q08 sales on healthy flip-chip demand
After enjoying strong performance in second quarter 2008, Nan Ya Printed Circuit Board (NPC) is optimistic about its third-quarter performance.
Wednesday 6 August 2008
Netbooks and handsets to drive up PPT sales in 3Q08
Seeing its July sales sustain an upward trend, Phoenix Precision Technology (PPT) has delivered an optimistic outlook for the third quarter, with flip-chip (FC) and chip-scale packaging...
Monday 4 August 2008
Unimicron blames profitability erosion on exchange losses
Unimicron Technology has blamed the failure of its second-quarter profits to meet expectations to exchange losses. As demand from all major segments is showing signs of recovery,...
Friday 25 July 2008
NPC expects its FC substrate capacity to tighten in latter part of 3Q
Nan Ya Printed Circuit Board (NPC) reiterated its strong sales guidance for the third quarter, indicating that it anticipates the utilization rate for its flip-chip (FC) substrate...
Friday 20 June 2008
NPC to see utilization rate increase to 95% in 3Q08
Taiwan-based flip chip (FC) substrate maker Nan Ya Printed Circuit Board (NPC) is expected to see its utilization rate reach 95% in the third quarter, with the proportion of production...
Vortex
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research