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NEWS TAGGED FC SUBSTRATE
Tuesday 25 May 2010
Nanya PCB to expand capacity for FC substrates and HDI boards
Nanya PCB has revealed plans to boost its flip-chip (FC) substrate capacity by 5-7 million units for a total of 35-37 million units a month by the end of June 2010, and also expand...
Thursday 29 April 2010
Unimicron to ramp up FC substrate capacity by 15-18% in 3Q10
Unimicron Technology plans to ramp up its capacity for flip-chip (FC) substrates by 15-18% in the third quarter to meet increasing demand, company spokesman Shen Tsai-sheng said at...
Thursday 25 February 2010
IC substrate maker Kinsus expects 2010 capex to reach NT$1.5 billion
IC substrate maker Kinsus Interconnect Technology expects its capex for 2010 to reach NT$1.5 billion (US$46.8 million), up from NT$800 million in 2009. The company also revealed that...
Tuesday 3 November 2009
NPC likely to receive FC substrate backend orders from Intel after NGK stops its supply
IC substrate supplier Nan Ya Printed Circuit Board (NPC) may see weaker order volumes in the short term because its Japan-based strategic partner NGK Spark Plugs has announced that...
Tuesday 11 August 2009
IC substrate makers Kinsus, PPT report growth in July revenues
Taiwan IC substrate makers Kinsus Interconnect Technology and Phoenix Precision Technology (PPT) both saw July revenues hit the highest monthly levels of 2009, and market watchers...
Thursday 16 July 2009
NPC kicks off FC substrate capacity ramp
Taiwan-based Nan Ya Printed Circuit Board (NPC) has kicked off its expansion plans aiming to ramp up its monthly output of flip-chip (FC) substrates to 40 million units by the end...
Wednesday 24 June 2009
Nanya PCB expects strong 2H09 on CE demand
Nan Ya Printed Circuit Board (NPC) has forecast its revenue ratio between the first and second halves of 2009 may be between 30:70 and 40:60, according to company president Otto Chang...
Wednesday 20 May 2009
STATS ChipPAC delivers low-cost flip-chip technology
STATS ChipPAC, a Singapore-based semiconductor packaging and testing service provider, has announced a new flip-chip (FC) technology that it says offers cost savings over standard...
Wednesday 22 April 2009
IC substrate makers Kinsus and PPT see mixed 1Q09 results
IC substrate maker Kinsus Interconnect Technology may post better than expected results for the first quarter of this year, as peer maker Phoenix Precision Technology (PPT) saw losses...
Monday 6 April 2009
PPT and NPC see FC substrate utilization up
Global flip-chip (FC) substrate suppliers are expected to report shipment growth in March thanks to increased orders from Intel and AMD. Taiwan-based Phoenix Precision Technology...
Friday 20 March 2009
Kinsus expects strong substrate shipment growth in March due to China 3G deployment
IC substrate maker Kinsus Interconnect Technology estimates that March revenues will top NT$700 million (US$20.74 million) because China handset makers have expanded deployment of...
Wednesday 4 March 2009
Altera guidance revision to spur growth for Taiwan suppliers
Altera's recently-revised guidance for the first quarter of 2009 is good news for its contract suppliers in Taiwan, which include foundry partner Taiwan Semiconductor Manufacturing...
Friday 20 February 2009
Kinsus BT-based FC and FC CSP substrate shipments to increase in 2009
Kinsus Interconnect Technology has reported January sales of NT$433 million (US$12.45 million), down 21% on month. The company expects sales to increase to NT$500-550 million in February...
Tuesday 6 January 2009
IC substrate sales slumped in December 08 due to decline in handset and PC demand
IC substrate makers saw weak performance in December 2008 due to a sharp decline in demand for consumer electronics, handsets and PC products. Phoenix Precision Technology (PPT) has...
Wednesday 24 December 2008
IC substrate makers' utilization rates drop sharply in December
IC substrate makers' utilization rates in December have dropped due to declining orders. Nan Ya Printed Circuit Board (NPC)'s utilization rate for flip-chip (FC) substrates has fallen...
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