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NEWS TAGGED FINFET
Tuesday 14 July 2015
Globalfoundries rolls out 22nm FD-SOI technology
Globalfoundries has announced the availability of a 22nm process technology platform developed specifically to meet the ultra-low-power requirements of next-generation connected devices...
Monday 22 June 2015
ARM, UMC team to tape out Cortex-A based 14nm FinFET chip
United Microelectronics (UMC) has announced that it is collaborating with ARM to tape out a process qualification vehicle (PQV) test chip on the foundry's 14nm FinFET technology to...
Wednesday 3 June 2015
Globalfoundries announces design infrastructure for 14nm FinFET process
In collaboration with design ecosystem partners, Globalfoundries has announced the availability of digital design flows for customers designing on its latest manufacturing technology...
Tuesday 2 June 2015
UMC developing 18nm process technology
Taiwan-based contract chipmaker United Microelectronics (UMC) internally has made a decision to move to 18nm process technology from 28nm, as the foundry finds it tougher and would...
Thursday 28 May 2015
TSMC to triple 16nm chip capacity by end-2016, says co-CEO
TSMC is set to move its 16nm FinFET Plus (16FF+) process to commercial production in the second half of 2015, and plans to introduce a compact version of the 16FF+ process in early...
Friday 10 April 2015
Synopsys announces availability of silicon-proven IP portfolio for TSMC 16nm FinFET Plus processes
Synopsys has announced the availability of a portfolio of DesignWare PHY IP for TSMC's 16nm FinFET Plus (16FF+) processes.
Thursday 9 April 2015
Cadence digital and custom/analog tools achieve TSMC certification for 10nm FinFET early design starts
Cadence Design Systems has announced that its digital and custom/analog tools have achieved certification from TSMC for its most-current version of 10nm FinFET Design Rule Manual...
Wednesday 25 March 2015
TSMC to supply chips for rumored iPhone 6S and 6C
Taiwan Semiconductor Manufacturing Company (TSMC) will remain the major processor supplier for Apple in the second half of 2015 as the foundry will supply 20nm chips for an upcoming...
Thursday 26 February 2015
Commentary: 14nm FinFET process, Galaxy S6 crucial to Samsung semiconductor business
The debut of Samsung Electronics's new flagship smartphone the Galaxy S6 at the upcoming MWC 2015 will mark the world's first smartphone powered by a 14nm 3D FinFET processor and...
Tuesday 17 February 2015
TSMC orders equipment for NT$3.5 billion
Taiwan Semiconductor Manufacturing Company (TSMC) has purchased facility and engineering equipment from Hitachi High-Technologies, Hitachi Kokusai Electric, ASML, Applied Materials...
Monday 16 February 2015
Global Unichip expects 1Q15 sales to grow on-quarter
Global Unichip, an IC design service provider partnering with Taiwan Semiconductor Manufacturing Company (TSMC), expects to report a sequential increase in first-quarter revenues...
Monday 16 February 2015
Samsung announces mass production of 14nm FinFET mobile chips
Samsung Electronics has begun mass production of mobile application processors built using 14nm FinFET process technology.
Friday 16 January 2015
TSMC to prevail in FinFET segment in 2016 and beyond, says company chairman
Taiwan Semiconductor Manufacturing Company (TSMC) will gain a majority of market share in the FinFET segment in 2016 although it will lose out to rival Samsung Electronics in 2015,...
Thursday 15 January 2015
Samsung and Globalfoundries reportedly win majority of A9 orders
Samsung Electronics and Globalfoundries have secured a combined 70% of orders for Apple's A9 processors with their 14nm FinFET technology, according to industry sources.
Wednesday 14 January 2015
Samsung said to dump Qualcomm chip in Galaxy S6
Rumors have circulated in the industry that Samsung Electronics will dump Qualcomm's Snapdragon 810 processor for use in its next-generation Galaxy S-series flagship smartphone, in...
CPC
Summary of Tech Supply Chain News!
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
Competitive color technologies expand e-paper market potential, moving beyond zero-sum game, says DIGITIMES Research