Samsung Electronics has announced that its second-generation 10nm FinFET process technology, 10LPP (Low Power Plus), has been qualified and is ready for production. With further enhancement...
Samsung Electronics has announced its production ramp-up of the 10nm FinFET process technology is on track with steady high yield to meet customer needs on schedule.
China-based IC foundries, such as Shanghai Huali Microelectronics (HLMC), are evaluating plans to offer FD-SOI process technology since they are less competitive in the mainstream...
Taiwan-based eMemory has announced the availability of NeoFuse technology qualified for TSMC's 16nm FinFET compact (16FFC) process. Customers have already embedded the NeoFuse IP...
Globalfoundries has announced the addition of eight new partners to its growing FDXcelerator program. They are Advanced Semiconductor Engineering (ASE), Amkor Technology, Infosys,...
Nanoelectronics research center imec has reported for the first time the CMOS integration of vertically stacked gate-all-around (GAA) silicon nanowire MOSFETs. Key in the integration...
Taiwan-based eMemory, a logic NVM IP provider, has announced the successful demonstration of its security-enhanced NeoFuse IP in TSMC's 10nm FinFET process, along with IP design kits...
United Microelectronics (UMC) is expected to move its 14nm FinFET process to volume production in the second quarter of 2017, with Bitcoin mining company BitFury being the first customer,...
Development of TSMC's 7nm technology is well on track, and the process will be ready for risk production in the second quarter of 2017, company co-CEO Mark Liu said at an October...
Cadence Design Systems has announced several important deliveries in its collaboration with TSMC to advance 7nm FinFET designs for mobile and high-performance computing (HPC) platf...
Globalfoundries has announced plans to deliver a new leading-edge 7nm FinFET semiconductor technology, which provides more processing power for data centers, networking, premium mobile...
Taiwan Semiconductor Manufacturing Company (TSMC) has recently begun to tape out the design for Apple's A11 processor built on a 10nm FinFET process, according to industry sources.
ARM and TSMC have announced a multi-year agreement to collaborate on a 7nm FinFET process technology which includes a design solution for future low-power, high-performance compute...
Samsung Electronics has begun mass production of advanced logic chips utilizing its 14nm LPP (low-power plus) process, according to the South Korea-based chipmaker.
