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NEWS TAGGED FINFET
Friday 22 September 2017
Globalfoundries to roll out 12nm FinFET technology for high-performance devices
Globalfoundries has announced plans to introduce a new 12nm leading-performance (12LP) FinFET semiconductor manufacturing process. The technology is expected to deliver better density...
Wednesday 20 September 2017
Synopsys tapes out DesignWare, Interface IP for TSMC 7nm FinFET process
Synopsys has announced the successful tape-out of a broad portfolio of DesignWare Foundation and Interface PHY IP for TSMC's 7nm process technology, including logic libraries, embedded...
Wednesday 20 September 2017
Intel provides 10nm updates, plan for 10nm FPGA
Intel has provided updates for its 10nm process and plans for 10nm FPGAs, as well as the availability of its 64-layer 3D NAND for data center applications. The disclosures were made...
Friday 15 September 2017
IC packager ASE reportedly enters Amazon supply chain
Advanced Semiconductor Engineering (ASE) has cut into the supply chain for Amazon's datacenter construction set to begin between 2017 and 2018, by providing 2.5D IC packaging services...
Wednesday 13 September 2017
SEMICON Taiwan 2017: KLA-Tencor showcasing reticle blank inspection tools
At the ongoing SEMICON Taiwan 2017, KLA-Tencor is showcasing its new FlashScan reticle blank inspection product line which represents the company's entry into the dedicated reticle...
Wednesday 13 September 2017
TSMC starts equipment move-in at Nanjing plant
TSMC on September 12 held a ceremony to mark the start of equipment move-in at its new 12-inch wafer plant in Nanjing, China.
Tuesday 12 September 2017
Samsung intros 11nm LPP process; 7nm LPP with EUV on schedule
Samsung Electronics has added 11nm FinFET process technology (11LPP, Low Power Plus) to its advanced foundry process portfolio, offering customers with a wider range of options for...
Tuesday 12 September 2017
Xilinx, ARM, Cadence and TSMC collaborating on CCIX test chip
Xilinx, ARM, Cadence Design Systems and TSMC have announced a collaboration to build the first CCIX (cache coherent interconnect for accelerators) test chip in TSMC 7nm FinFET process...
Friday 8 September 2017
SPIL obtains packaging orders for AMD Vega 11 GPUs
AMD will continue to contract Globalfoundries to manufacture its next-generation Vega GPUs, and will have Siliconware Precision Industries (SPIL) as its major packager for the chips,...
Thursday 24 August 2017
Qualcomm Snapdragon 835 chip powers Samsung Galaxy Note8
Qualcomm has announced that its premium mobile platform is powering Samsung's latest flagship smartphone for select regions. The Samsung Galaxy Note8 is powered by the Qualcomm Snapdragon...
Wednesday 23 August 2017
China could enhance its position in post-Moore's Law era, says former TSMC COO
China's semiconductor industry could have a chance of strengthening its position in the post-Moore's Law era, according to Shang-yi Chiang, former executive VP and co-chief operating...
Monday 21 August 2017
Qualcomm to extend tie-up with TSMC, says executive
Qualcomm has been working with Taiwan's semiconductor firms for years, including an almost 10-year collaboration with TSMC, said Sudeepto Roy, VP of engineering for Qualcomm Technology...
Wednesday 16 August 2017
HiSilicon among top-5 customers of TSMC
With volume production for its Kirin 970-series chips kicking off, HiSilicon Technologies has become one of Taiwan Semiconductor Manufacturing Company's (TSMC) top-5 customers, according...
Wednesday 16 August 2017
Globalfoundries demos 2.5D HBM solution
Globalfoundries has demonstrated silicon functionality of a 2.5D packaging solution for its 14nm FinFET FX-14 integrated design system for application-specific integrated circuits...
Monday 14 August 2017
TSMC 12nm FinFET process ready for volume production in 4Q17, says report
Taiwan Semiconductor Manufacturing Company (TSMC) will enter volume production of chips built using its 12nm FinFET process in the fourth quarter of 2017, according to a recent Chinese-language...