Kinsus Interconnect Technology is on track to expand its production capacity for ABF substrates by 30-40% in 2022, and by another 40% in 2023, to meet ever-increasing demand for processing...
SK Hynix has developed processing-in-memory (PIM), a next-generation memory chip with computing capabilities, according to the company. PIM provides a solution for data congestion...
MediaTek has completed its growth plan for the next three years, and plans to achieve medium double-digit sales increases in multiple product lines rather than just handset SoCs,...
Samsung Electronics has reported consolidated revenue climbed to a record high of KRW76.57 trillion (US$63.65 billion) in the fourth quarter of 2021, when its foundry business posted...
Taiwan-based ABF substrate suppliers expect the activation of new production capacities later this year and in 2023 to boost their profits amid tight supplies, according to industry...
Samsung Electronics has announced its new premium mobile processor, the Exynos 2200, which is equipped with a powerful Samsung Xclipse graphics processing unit (GPU) based on AMD...
PC processor prices are poised to rise substantially in 2022 to reflect rising foundry costs; processors fabricated using sub-7nm process nodes are particularly likely to rise in...
China-based GPU developer Innosilicon is planning to begin wafer production for its in-house developed GPU, Fantasy One, in 2022; the chip will be manufactured via a 5nm node and...
AMD has launched its first 3D desktop processor for the consumer segment at CES 2022, which is expected to be fabricated by TSMC using 3D SoIC (system on integrated chips) technology,...
Taiwan-based OSATs and IC test interface solution providers are upbeat about demand for new processors unveiled by vendors including AMD and Nvidia for the next couple of years, according...
Power management ICs and SGT (split-gate trench) MOSFETs for Vcore regulators will remain in robust demand in 2022, as such regulators are needed to support new CPU and GPU solutions...
China IC designer Unison has entered volume production of two 5G smartphone SoCs fabricated using 6nm EUV process, dubbed T770 and T760, looking to expand its presence in the 5G handset...
China's Loongson Technology, a CPU designer funded by the Institute of Computing Technologies of the Chinese Academy of Sciences (CAS), has secured recently approval to launch an...
With liquid cooling solutions especially immersive ones expected to turn more popular in the server, switch and datacenter industries, Allen Wu, CEO of Kaori Heat Treatment, expects...
Samsung Electronics has introduced three automotive chip solutions, the Exynos Auto T5123 for 5G connectivity, the Exynos Auto V7 for comprehensive in-vehicle infotainment systems...
