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Friday 15 April 2022
ASE capacity utilization to stay high for IDMs, HPC chip vendors
Taiwan's leading OSAT ASE Technology is expected to sustain high capacity utilization throughout 2022, bolstered by expanded outsourcing orders from automotive chip IDMs and long-term...
Tuesday 12 April 2022
PTI obtains backend orders for new MediaTek smartphone APs
Powertech Technology (PTI) has obtained orders for packaging MediaTek's smartphone application processors slated for launch later in 2022, under the chipmaker's strategy to diversify...
Thursday 7 April 2022
Unimicron, Nan Ya PCB see Kunshan lockdown slightly affect April revenues
An extended COVID lockdown in Kunshan, China is not much constraining PCB and IC substrate supply from plants there operated by Taiwan-based makers Unimicron Technology and Nan Ya...
Friday 1 April 2022
IC test interface vendors diversifying into non-handset chip segments
Taiwan's IC test interface specialists including Chunghwa Precision Test Tech (CHPT) are striving hard to strengthen deployments in multiple market segments beyond handsets as demand...
Friday 1 April 2022
Power Logic holds rosy outlook on 2H22 operation
Cooling fan maker Power Logic is optimistic about its business operation in the second half of 2022, according to company chairman and president Vincent Hsu at a March 31 investor...
Thursday 24 March 2022
MediaTek to continue mobile SoC shipments for Samsung midrange handsets
MediaTek will continue to penetrate its 4G and 5G handset APs into Samsung Electronics midrange smartphone models in 2022, allowing its backend partners in Taiwan to benefit and indirectly...
Thursday 24 March 2022
Samsung, Intel keen to take slices of foundry market from TSMC
Samsung Electronics and Intel have both stepped up efforts to expand their respective foundry businesses, eyeing bigger slices of the global foundry market particularly in the advanced...
Wednesday 23 March 2022
New Nvidia GPU fabbed by TSMC with 4nm process
Nvidia has announced its next-generation accelerated computing platform with Hopper architecture, dubbed H100 GPU, which is built using TSMC's 4nm (N4) process customized for the...
Monday 21 March 2022
TSMC may triple CoWoS material purchases for Nvidia new HPC chips
Nvidia is set to launch new HPC GPU platforms for datacenter, AI and gaming applications in 2022, and its manufacturing partner TSMC reportedly is expected to triple order placements...
Friday 18 March 2022
Samsung responds to Galaxy smartphone throttling, poor sub-5nm foundry yields
Samsung Electronics has made an unusual move by responding to its negative rumors - one about the Game Optimisation Service (GOS) app on the Galaxy S22 series; and the other regarding...
Thursday 17 March 2022
Zhen Ding looks to rank among world's top-5 IC substrate suppliers by 2030
Taiwan's leading PCB specialist Zhen Ding Technology is gearing up to carry out its ambitious 10-year development roadmaps for IC substrates, aiming to rank among the world's top-5...
Friday 11 March 2022
Mobo and graphics card makers turn cautious amid demand uncertainty
Taiwan-based main motherboard (mobo) and graphic card vendors including Asustek Computer, Gigabyte Technology and Micro-Star International (MSI), as well as smaller peers ASRock and...
Wednesday 9 March 2022
AEWIN's small footprint rackmount edge computing server integrated with double-width GPU boosts performance and reliability
The emergence of 5G, Artificial Intelligence (AI) and Internet of Things (IoT) technologies can unlock digital transformation to meet the needs of various industries such as manufacturing,...
Monday 7 March 2022
OSATs slowing down wirebonding capacity expansions for 2H22
Taiwan's OSATs are slowing down their logic IC wirebonding capacity expansions as the visibility of orders for processing consumer ICs is still unclear beyond the second quarter of...
Wednesday 23 February 2022
Intel's IDM 2.0 vision juggles chip cost and performance
It remains to be seen how Intel will materialize its IDM 2.0 growth vision, but the chipmaker will have to face a trade-off between production cost and chip performance in determining...
TPCA
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research