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Thursday 5 December 2019
Nan Ya may double capex in 2020 to hike ABF, SiP substrate capacity
Taiwan-based Nan Ya PCB is expected to double its 2020 capex from NT$3.5 billion (US$114.8 billion) in 2019 to expand capacity for ABF substrates for 5G network applications and SiP...
Thursday 28 November 2019
CCL firm EMC gearing up for 5G handset application orders
As motherboard upgrades at 5G smartphones are gaining momentum, Taiwan-based CCL maker is poised to compete with Japanese peer Panasonic to benefit more from the first wave of 5G...
Wednesday 20 November 2019
Highlights of the day: Anylayer HDI boards demand rising from Chinese handset vendors
Chinese handset vendors are eager to adopt anylayer HDI boards for their high-end smartphones, but they currently have to source such boards from outside of China despite the country's...
Wednesday 20 November 2019
Anylayer HDI demand from Chinese handset vendors rising sharply
Chinese handset vendors are keen on utilizing anylayer HDI boards as mainboards for high-end smartphones adopting 7nm APs, and Taiwan-based PCB makers including Compeq Manufacturing...
Tuesday 19 November 2019
Unimicron to invest more for ABF substrate capacity expansion in China
Taiwan-based PCB and IC substrate supplier Unimicron Technology has disclosed plans to invest a total of about US$74.9 million for capacity expansions at its plants in China in 202...
Monday 18 November 2019
Anylayer HDI demand for 7nm APs surges from Chinese handset vendors
Demand for anylayer HDI boards from Chinese handset vendors has been increasing sharply as such boards are badly needed for carrying 7nm APs, now mainstream core SoCs for their smartphones,...
Monday 18 November 2019
PCB production lines may remain humming during Lunar New Year
Taiwan-based PCB makers are planning to maintain normal production during the Lunar New Year holidays in late January thanks to clear visibility of orders from Apple and Chinese handset...
Friday 15 November 2019
HDI boards to enter new wave of growth in 5G, IoT era
Supply of HDI (high-density interconnect) boards has fallen short of demand in the second half of 2019, with Taiwan makers having to reschedule shipments to fulfill mounting orders...
Wednesday 13 November 2019
PCB maker Zhen Ding plans record capex for 2020
Taiwan's top PCB maker Zhen Ding Technology (ZDT) will budget a record high capex for 2020 and expects its revenues for the year to grow significantly from 2019 on stronger shipments...
Tuesday 12 November 2019
Compeq, Tripod post strong earnings, see tight capacity for any-layer HDI boards
Taiwan-based PCB suppliers Compeq Manufacturing and Tripod Technology have both disclosed strong earnings for the third quarter of 2019 and that tight capacity for any-layer HDI boards...
Tuesday 12 November 2019
HDI PCB makers to expand output in 2021
High-density interconnection (HDI) PCB specialists including Compeq Manufacturing and Tripod Technology are both scheduled to have their new production capacities come online in 2021...
Tuesday 5 November 2019
China PCB firm to expand production capacity
China's Dongshan Precision Manufacturing (DSBJ) has disclosed a plan to invest a total of CNY2.16 billion (US$307.9 million) in its new PCB capaciy expansion project.
Friday 1 November 2019
Unitech posts record 3Q19 results on robust rigid-flex board demand
Robust shipments of rigid-flex boards - reportedly for AirPods 2 - boosted Taiwan-based PCB maker Unitech's third-quarter 2019 revenues to a new high of NT$6.204 billion (US$203.65...
Thursday 31 October 2019
PCB maker Dynamic returns to profitability in 3Q19
Taiwan-based PCB maker Dynamic Electronics returned to profitability in the third quarter of 2019, with its net earnings skyrocketing 48.37 folds on year to NT$121 million (US$3.97...
Wednesday 16 October 2019
PCB makers gaining from handset HDI mainboard upgrades
Taiwan-based PCB suppliers are expected to see their HDI board production lines running at full capacity through the end of 2019, bolstered by upgrades in smartphone mainboards, according...