TSMC's CoWoS, ASE Technology's FOCoS, and other advanced packaging technologies are expected to draw an influx of orders for AI and HPC processors, according to industry sources.
Taiwan's leading OSAT ASE Technology and its affiliate Siliconware Precision Industries (SPIL) have officially joined the supply chain of silicon photonics high-speed networking chips...
Sources say Samsung Electronics is establishing a hyperscale data center for storage and analysis of the statistical data collected in semiconductor processes. Big data analysis and...
EDA specialist Synopsys has recently announced its collaboration with TSMC to deliver digital and custom design EDA flows on the foundry's most advanced N2 (2nm) process, aiming to...
TSMC will see the baseline 3nm process technology (N3B) dominate 90% of its N3 family capacity in 2023, and nearly 90% of the N3B capacity reportedly has been booked by Apple for...
The overall data communication optics market is expected to grow sharply in the next decade, driven by the ever-larger dataset of AI and machine learning (ML) models, with co-packaged...
Nan Ya PCB, among Taiwan's major ABF substrate suppliers, saw its net profits hit an eight-quarter low of NT$2.325 billion (US$75.8 million) in the first quarter of 2023. EPS for...
AP Memory Technology, which specializes in customized IoT RAM and other DRAM memory, will extend its AI memory business by entering the HPC area, according to company president Wen...
Ansys and TSMC continue their long-standing technology collaboration to announce the certification of Ansys' power integrity software for TSMC's N2 process technology.
NeoFuse, a security-enhanced version of eMemory's one-time programmable (OTP) non-volatile memory (NVM) technology, has been qualified on the TSMC N5 process. Another design tape-out...
TSMC expects its second-quarter revenue in US dollar terms to register a sequential decline of 6.7% at the midpoint, with gross margin and operating margin estimated at 52–54%...
System-level testing demand for advanced ICs has been rising. Foundries including TSMC, Intel and Samsung Electronics, as well as OSATs such as ASE Technology, are already involved,...
Samsung Electronics has seen its 12-inch wafer fab capacity utilization rise to 90% in the second quarter from 80% registered a quarter earlier, driven by stable 5/4nm process performance...
