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NEWS TAGGED HPC
Thursday 15 October 2026
TSMC's AI-fuelled profit streak hits sixth straight record in 3Q26, but 2nm expansion weighs on margins
On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6...
Wednesday 14 October 2026
Y.S. Tech reports liquid-cooling orders secured through early 2028
Y.S. Tech said automotive product orders were visible through the first quarter of 2028 as the automotive electronics and technology systems maker expanded its automotive and high-performance...
Tuesday 13 October 2026
Taiwan's ICT sector enjoys 3-year boom as US debt swells
Driven by robust demand for AI, high-performance computing (HPC), and cloud data services, Taiwan's information and communications technology (ICT) production momentum has soared for...
Monday 12 October 2026
HTSI September revenue surges 150% as AI chip testing demand accelerates
Hermes Testing Solutions (HTSI) reported September revenue of NT$514 million (US$16.10 million), up 2.35% month over month and 150.33% year over year, as shipments of customized products,...
Friday 9 October 2026
Applied Materials, Intel target AI chip bottlenecks with interconnect scaling and Foveros 3D
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
Wednesday 7 October 2026
Hua Yang, Zeiss launch COSMA-M for chip metrology
Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance...
Tuesday 6 October 2026
3.2T optical upgrade triggers PCB redesign, shrinking supplier pool to 3
As AI computing clusters continue to expand, performance requirements for scale-out interconnects between racks are rising rapidly. This is pushing traditional pluggable optical transceivers...
Wednesday 30 September 2026
Samsung expects HPC to account for 66% of foundry business by 2029
Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...
Wednesday 30 September 2026
Powering Next-Gen AI: Materials Enabling Advanced Packaging's Future

As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...

Tuesday 22 September 2026
TSMC, ASE break ground on Taiwan's first advanced packaging cluster in Kaohsiung

Rising demand for advanced packaging tied to AI and high-performance computing (HPC) is driving development at Baipu Industrial Park...

Monday 14 September 2026
AI server tracker: Taiwan testing suppliers accelerate as AI chip complexity raises interface demand
Taiwan's semiconductor testing supply chain continued to ride strong AI and high-performance computing (HPC) demand in August 2026, with all four major suppliers posting year-over-year...
Monday 14 September 2026
Hauman Unveils Micro LED Testing Breakthrough for AI Optical Interconnects

As AI-driven high-performance computing (HPC) and chip-to-chip optical interconnects continue to see rapid growth, Hauman Technologies, a leader in test and measurement...

Friday 11 September 2026
Global IC substrate market to surge 32% to US$19.5 billion in 2026 as Taiwan, Korea lead ABF, BT
Rising demand for generative AI, high-performance computing (HPC), and data center buildouts is pushing the global IC substrate industry into a new phase marked by upgrades in high-end...
Thursday 10 September 2026
AI semiconductor equipment boom redraws Taiwan IPC market: Edge AI, advanced packaging lift high-end demand
AI and high-performance computing (HPC) demand is sustaining strong investment in advanced semiconductor processes, high-bandwidth memory (HBM), and advanced packaging, lifting the...
Monday 7 September 2026
Yaho rides TSMC, Micron expansion wave to tap facility integration, equipment installation market
Artificial intelligence (AI) and high-performance computing (HPC) are driving the global semiconductor industry into a new expansion cycle, with fabs extending from Taiwan to the US,...