At the 2025 OCP Global Summit, Taiwan-based interconnect solutions provider BizLink unveiled a full suite of high-speed connectivity and AI-ready data center solutions, showcasing...
Alcor Micro Corporation, a subsidiary of Egis Technology, is showcasing its latest Arm architecture CPU platform, Mobius100 (CSS V3), at the 2025 Open Compute Project (OCP) Global...
TSMC reported consolidated revenue of NT$330.98 billion (US$10.8 billion) in September 2025, a slight 1.4% decrease from August but a 31.4% increase year-over-year, marking a record...
China's glass substrate through glass via (TGV) industry has made significant progress, with companies pushing innovations from materials to mass production. Despite challenges in...
ASE Technology Holding has initiated construction of a new K18B factory at the Nanzi Science Park in Kaohsiung to address growing demand in artificial intelligence (AI), automotive...
TSMC's 2nm (N2) process is nearing mass production, with industry sources indicating it has secured up to 15 customers. About 10 are focused on high-performance computing (HPC), showing...
The National Science and Technology Council (NSTC) is planning to implement a quantum computing mainframe construction project in 2026, aiming to integrate quantum computing mainframes...
The integration of quantum computing mainframes with high-performance computing (HPC) platforms is driving the transformation and upgrading of key future industries, making it a major...
Hermes-Epitek's semiconductor wafer testing solutions subsidiary, HTSI, will be listed on the over-the-counter (OTC) market on September 17, 2025. President Steven Wang stated that...
Taiwan's semiconductor output hit NT$5.3 trillion (approx. US$175.3 billion) in 2024 and is expected to exceed NT$6 trillion soon, fueled by demand in AI, high-performance computing...
Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips,...
The global auto market split sharply in the first half of 2025 amid uncertainty over US tariff policy. Electronics and manufacturing giants are responding by pivoting toward in-vehicle...
With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has...
IBM and AMD announced plans to develop next-generation computing architectures that combine quantum computers with high-performance computing (HPC), a concept known as quantum-centric...
