Taiwan's semiconductor output hit NT$5.3 trillion (approx. US$175.3 billion) in 2024 and is expected to exceed NT$6 trillion soon, fueled by demand in AI, high-performance computing...
Chroma ATE Inc. will participate in SEMICON Taiwan 2025, presenting a full suite of breakthrough semiconductor test solutions. The showcase will focus on applications in AI chips,...
The global auto market split sharply in the first half of 2025 amid uncertainty over US tariff policy. Electronics and manufacturing giants are responding by pivoting toward in-vehicle...
With the rapid expansion of artificial intelligence (AI), high-performance computing (HPC), and data center applications, the demand for high-speed chip-to-chip interconnects has...
IBM and AMD announced plans to develop next-generation computing architectures that combine quantum computers with high-performance computing (HPC), a concept known as quantum-centric...
Samsung Electronics' foundry business plans to leverage its Hyper Cell technology to maintain its competitiveness in the 2nm semiconductor process. By adopting a more flexible chip...
Yen Sun Technology (YS Tech), a manufacturer of automotive electronics and technology systems, is optimistic that customer orders will return to normal once the US tariff situation...
Daxin Materials reported solid operational performance in the first half of 2025, with expectations for continued growth in the semiconductor and display materials sectors in the...
Giga Storage announced a partnership with electric bus manufacturer Tron-e on August 5, 2025, to co-develop the Xinpu Tron-e Smart Industrial Park. This initiative marks Giga Storage's...
Horng Terng Automation, a leading manufacturer of advanced semiconductor packaging equipment, has leveraged its joint development efforts with packaging clients and mastery of critical...
ASE Holdings posted solid growth in advanced packaging and testing in the first half of 2025, fueled by robust demand for AI-related high-performance computing (HPC) chips. However,...
As artificial intelligence and high-performance computing enter a phase of explosive growth, the limitations of traditional chip manufacturing and the slowing of Moore's Law have...
With the 2025 OCP APAC Summit set to kick off next week in Taipei, industry attention is turning toward the next wave of AI and high-performance computing (HPC) infrastructure.
Samsung Electronics has reportedly secured new clients for its 8nm wafer foundry services through collaboration with its Design Solution Partners (DSPs). This development is expected...
