The AI surge requires TSMC to swiftly expand its production capacity for chip-on-wafer-on-substrate (CoWoS) packaging. Simultaneously, the foundry's production capacity for 3D-stacked...
Despite AI servers gaining traction among component suppliers and system assemblers, traditional high-performance computing (HPC) applications continue to be in high demand, according...
Chunghwa Precision Test Tech (CHPT), a leading provider of chip testing and wafer probing solutions, expects significant growth in revenue and gross margin in the second half of 2024...
Silicon photonics technology has become a focal point for the semiconductor industry amid the push for generative AI and high-performance computing (HPC), and TSMC has taken the lead...
As the global semiconductor foundry market shows signs of recovery, Samsung Electronics continues to trail significantly behind sector leader TSMC in market share. Additionally, it...
Irvine, CA – Henkel recently announced that it has commercialized a semiconductor capillary underfill encapsulant to address the unique requirements of the market's most demanding...
Worldwide silicon wafer shipments increased 7.1% quarter-on-quarter to 3.035 billion square inches in the second quarter of 2024, but saw an 8.9% decline from the 3.33 billion square...
Chunghwa Precision Test (CHPT), a leading probe card manufacturer, anticipates strong performance in the second half of 2024, with growth driven by increasing demand for high-performance...
The booming development of AI applications is accelerating the advancement of IC process production, with fabless chipmakers also upgrading manufacturing specifications for their...
Although initial demand for HPC and AI smartphone chips is expected to remain strong as the traditional peak season approaches, recent observations indicate potentially lower-than-expected...
TSMC's high-performance computing (HPC) revenue share continued to rise in Q2 2024, boosting overall performance. Although Samsung Electronics aims to increase its HPC sales proportion,...
Micron Technology has disclosed that it is currently conducting sampling of its Multiplexed Rank Dual Inline Memory Modules (MRDIMM) for memory-intensive applications, including AI...
The next generation of memory technology for High-Performance Computing (HPC) is on the horizon with the upcoming finalization of the HBM4 (High-Bandwidth Memory) specifications by...
Samsung has announced plans to expand its support for DSPs (Design Service Partners) to help South Korean IC design companies deepen their presence in the HPC (High-Performance Computing)...
