Taiwan's government is moving its quantum technology development program into a second phase, centered on building a national-level heterogeneous hybrid computing platform that integrates...
Taiwan's Ministry of Economic Affairs (MOEA) reported on January 20, 2026, that strong demand for IC manufacturing and AI servers propelled export orders to new heights in December...
As the global semiconductor industry enters the post-Moore's Law era amid surging demand for artificial intelligence (AI) and high-performance computing (HPC), advanced packaging has...
TSMC held its earnings conference call on January 15, 2026, and guided for the first quarter. The company expects revenue to range between US$34.6–35.8 billion. Gross margin...
Generative AI is reshaping TSMC's customer structure. While Apple remains TSMC's largest single customer by revenue share, the rapid growth of high-performance computing (HPC) businesses...
As Micro LED moves into non-display application opportunities, PlayNitride Technologies announced a partnership with Brillink Technologies, a leader in two-dimensional array optical...
WUS Printed Circuit (Kunshan) Co. plans to invest up to US$300 million in a high-density optical-electrical printed circuit board (PCB) project aimed at supporting next-generation...
Taiwan's outsourced semiconductor assembly and test (OSAT) industry closed December 2025 with a pattern that investors have increasingly come to expect: revenue growth was widespread...
Chunghwa Precision Test Tech (CHPT) said that although revenue in December 2025 and the fourth quarter both declined compared with the same period in 2024, overall full-year performance...
Semiconductor test equipment supplier Advantest and Tokyo Seimitsu have announced a joint plan to co-develop a next-generation die-level prober for high-performance computing compo...
Tenstorrent, under Jim Keller, cut 7.5% of its staff to boost teamwork, launched the Ascalon RISC-V CPU in China for AI and HPC markets, and is partnering with CoreLab and former Arm...
Taiwan-based printed circuit board (PCB) manufacturer WUS Printed Circuit announced an ambitious plan on December 11 to drive its high-performance computing (HPC) segment to account...
AI data centers are seeing rapidly increasing demand for HPC and big data processing. The shift from traditional copper wiring to fiber optics boosts data transfer rates while lowering...
AMD and Hewlett Packard Enterprise (HPE) are expanding their long-standing partnership with a new plan to deliver open, rack-scale infrastructure for the AI era. HPE becomes one of...
At its investor conference on November 27, 2025, Gigastorage Corporation shared details regarding its strategic shift from its early photovoltaic (PV) business toward AI computing,...
