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    Exclusive: Chinese automakers lead in zonal E/E architecture, but geopolitics could hinder global rollout
    3h 23min ago
    Chinese semiconductor equipment makers deepen SEA OSAT presence
    3h 23min ago
    China, US AI capex gap persists amid token prices surge
    3h 23min ago
    Singapore chip firms showcase cross-border manufacturing and testing strengths
    3h 24min ago
    Commentary: Big Fund bets on DeepSeek as China, the US shift AI rivalry to hidden models
    3h 24min ago
    Samsung and SK Hynix China staff reportedly seek higher bonuses
    3h 24min ago
    NEWS TAGGED HPC
    Tuesday 5 May 2026
    Machvision sales hit a record high on strengthening AOI demand
    Machvision reported consolidated revenue of about NT$343 million (US$10.84 million) for April 2026, up 1.4% from the previous month and 3.75% from a year earlier, marking another monthly...
    Tuesday 5 May 2026
    CHPT posts record April revenue on AI-driven HPC demand
    Semiconductor test interface provider Chunghwa Precision Test Tech (CHPT) said its revenue in April 2026 continued to set a new all-time monthly high, driven by rising demand for semiconductor...
    Monday 4 May 2026
    ADT lands US AI chip deal using Samsung 4nm
    ADTechnology said it has signed a KRW40 billion (US$27.1 million) turnkey contract with a US-based AI fabless company to develop and supply HPC SoC chiplets for AI data-center applications...
    Thursday 30 April 2026
    Chunghwa Precision Test raises capex as HPC probe card orders hit 30% of sales
    Chunghwa Precision Test Tech reported that strong demand from high-performance computing chip customers drove first-quarter 2026 revenue to NT$1.357 billion (US$43 million) and operating...
    Wednesday 29 April 2026
    Chroma Paper Award: Boosting AI Innovation and Industry-Academia Ties

    Chroma ATE Inc. successfully concluded the 3rd Chroma Paper Award on March 19, marking another milestone in the company's ongoing commitment to industry-academia collaboration...

    Friday 24 April 2026
    SMIC returns to advanced packaging, scales team to boost AI chip strategy

    China's leading foundry, SMIC, is quietly recalibrating its strategy, moving beyond its long-standing focus on front-end wafer manufacturing...

    Thursday 23 April 2026
    TSMC targets 2029 production for A13 and A12 as next AI chip nodes
    At its North America Technology Symposium, TSMC showcased a range of innovations in advanced process technologies. Following the introduction of its A14 process in 2025, the company...
    Sunday 19 April 2026
    ASE's CoPos advanced packaging accelerates as Skytech and CMIt boost equipment deliveries
    AI and high-performance computing (HPC) are driving increasingly stringent chip performance demands, marking a pivotal shift in advanced packaging technology from traditional wafers...
    Thursday 16 April 2026
    TSMC guides over 15% 2Q26 revenue growth, N3 margins set to top average
    TSMC posted a record profit of NT$572.48 billion (US$18.06 billion) in the first quarter of 2026, marking another high in overall performance. For the second quarter of 2026, TSMC...
    Thursday 16 April 2026
    Global Expansion of 2.5D/3D Packaging: Strategic Moves in the US, Asia, and Beyond

    Introduction

    Thursday 16 April 2026
    TSMC 1Q26 earnings: AI demand sends profit up 58%, gross margin to all-time high
    Taiwan Semiconductor Manufacturing Company (TSMC) reported a first-quarter 2026 revenue of US$35.90 billion, a 40.6% jump from a year earlier, as insatiable demand for artificial intelligence...
    Tuesday 14 April 2026
    King Yuan Electronics posts record 1Q26 revenue, raises capex to NT$50 billion
    Benefiting from continued demand driven by artificial intelligence (AI), high-performance computing (HPC), and application-specific integrated circuits (ASIC), semiconductor testing...
    Friday 10 April 2026
    China OSATs step up investment drive as AI demand lifts advanced packaging race

    China's outsourced semiconductor assembly and test (OSAT) sector is accelerating capacity expansion and technology upgrades, with leading...

    Friday 10 April 2026
    Column: Corintis uses algorithms to target chip hotspots for precise cooling
    As HPC and AI processors push computing performance to unprecedented levels, transistor density has reached a point where thermal behavior is no longer uniform. Instead of gradual,...
    Friday 10 April 2026
    Praise Victor Industrial aims to break Fujibo's soft pad dominance with 2Q26 sample certification
    As AI and high-performance computing (HPC) demand surges and the semiconductor supply chain undergoes accelerating restructuring, structural changes are emerging in the critical materials...
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    BIZ FOCUS
    Feb 9, 08:00
    iCatch and DXOMARK Establish Taiwan's First Next Generation Imaging Laboratory
    Friday 6 February 2026
    2026 Market Outlook: Key Opportunities & Risks to Watch
    Thursday 5 February 2026
    Attopsemi Scales I-fuse Technology to 7nm following 12nm Silicon Success
    Wednesday 4 February 2026
    Teaching Machines to Feel the World TOUCH Lab Redefines Sensing
    biz
    RESEARCH INSIGHTS
    Weekly research roundup: Qualcomm's AI strategy, memory giants and updated 2026 smartphone outlook