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NEWS TAGGED HPC
Tuesday 10 March 2026
TSMC February 2026 revenue climb on AI demand despite seasonal dip
TSMC reported February 2026 revenue of NT$317.66 billion (US$10 billion), up 22.2% year over year but down 20.8% month over month from January's NT$401.26 billion, according to the...
Friday 6 March 2026
AP Memory expands S-SiCap capacity as chipmakers shift toward custom memory
AP Memory expects growth momentum to extend into 2026, with revenue visibility already exceeding the typical six-month outlook seen in previous years. Tight supply in the global memory...
Wednesday 4 March 2026
Chunghwa Precision Test Tech posts record February revenue despite seasonal dip
Semiconductor test interface supplier Chunghwa Precision Test Tech (CHPT) said that continued demand from the high-performance computing (HPC) and mobile application processor (AP)...
Wednesday 4 March 2026
IPC vendors converge at Embedded World 2026 as edge AI drives high-performance computing demand
Demand for high-performance embedded computing platforms is rising across sectors such as smart manufacturing, transportation, healthcare, and energy infrastructure, as GenAI and other...
Sunday 1 March 2026
BizLink advances modular integration to boost data center interconnect growth
Despite no signs of a slowdown in AI infrastructure investments by global cloud service providers (CSPs), debates about a potential AI bubble persist. BizLink CEO Felix Teng emphasized...
Thursday 26 February 2026
BizLink sees HPC and semiconductor revenue surpass 50% with AI data center upgrade wave
As generative AI drives rapid expansion in data centers and high-performance computing (HPC) infrastructure, the importance of interconnect technology is evolving from traditional...
Wednesday 25 February 2026
Unimicron's 4Q25 profit surpasses combined earnings of first 3 quarters; 2026 capex raised to NT$34 billion
Given the steady demand for AI and high-performance computing (HPC) chips, Unimicron stated that orders for IC substrates and PCBs have picked up. This has not only steadily increased...
Tuesday 24 February 2026
CMAT sees order visibility extending two quarters ahead as test interface structural precision upgrades
The rapid development of AI and high-performance computing (HPC) chips is providing long-term demand support for the semiconductor advanced testing interface supply chain, driving...
Tuesday 24 February 2026
Analysis: MediaTek’s long game in cloud silicon
MediaTek CEO Rick Tsai set the climate for the company's growth trajectory at the International Solid-State Circuits Conference (ISSCC) 2026, centering his keynote speech on cloud...
Wednesday 11 February 2026
South Korean IC designers face year-long packaging delays
Surging demand for artificial intelligence servers and high-performance computing (HPC) has tightened capacity across the semiconductor supply chain. For many small South Korean communications...
Tuesday 10 February 2026
Amkor pivots toward AI and HPC with ambition to expand advanced packaging
Amkor Technology is accelerating its transition into the next wave of advanced packaging growth, focusing on high-performance computing (HPC) and artificial intelligence (AI). This...
Friday 30 January 2026
Taiwan semiconductor test supply chain poised for growth amid rising AI chip complexity
Taiwan's semiconductor test supply chain is experiencing strong growth driven by increased demand for AI and HPC chips, industry sources report. Close collaborations with foundries...
Thursday 29 January 2026
Moltbot cracks the CUDA barrier, pushing Apple's Mac mini back into AI development
Apple has long built its brand around a tightly integrated hardware and services ecosystem. In AI and high-performance computing (HPC), however, the platform has been limited by the...
Thursday 29 January 2026
Exclusive: TSMC reshapes advanced packaging expansion, shifting AP8, AP7, and US fab plans
The surge in generative AI (GenAI) and high-performance computing (HPC) demand has pushed advanced semiconductor packaging to become the most critical and constrained capacity bottleneck...
Thursday 29 January 2026
Scientech's growth signals shift in semiconductor investment toward packaging and system integration
As artificial intelligence (AI) and high-performance computing (HPC) expand rapidly, the global semiconductor industry is redirecting investments from advanced process nodes to advanced...