The Global Electronics Association hosted a panel titled "Component to System Integration Advances" during the IMPACT 2026 symposium, bringing together industry leaders from Unimicron,...
Rapid advances in AI and high-performance computing (HPC) are driving printed circuit boards (PCBs) toward higher layer counts, greater density, and higher-performance materials, triggering...
Packaging, substrate, printed circuit board (PCB), and assembly makers need closer coordination to meet the demands of AI and high-performance computing (HPC), as package-to-board...
ASE, together with National Cheng Kung University (NCKU), National Sun Yat-sen University (NSYSU), and National Chung Cheng University (CCU), unveiled 18 technology research projects...
Taiwan Semiconductor Manufacturing (TSMC) is seeing rising demand for CPUs related to agentic artificial intelligence (AI), but has not yet included CPUs in its calculations of AI...
On October 15, 2026, TSMC reported its sixth consecutive quarter of record net profit, with third-quarter earnings rising 68.7% year-over-year to NT$763.06 billion (approx. US$23.6...
Y.S. Tech said automotive product orders were visible through the first quarter of 2028 as the automotive electronics and technology systems maker expanded its automotive and high-performance...
Driven by robust demand for AI, high-performance computing (HPC), and cloud data services, Taiwan's information and communications technology (ICT) production momentum has soared for...
Hermes Testing Solutions (HTSI) reported September revenue of NT$514 million (US$16.10 million), up 2.35% month over month and 150.33% year over year, as shipments of customized products,...
AI chip manufacturing demands are accelerating development of advanced logic and packaging technologies, prompting Applied Materials and Intel to expand their collaboration on next-generation...
Hua Yang Precision Machinery has teamed up with Zeiss to launch COSMA-M, a high-precision measurement system aimed at the semiconductor metrology market as demand surges from AI, high-performance...
As AI computing clusters continue to expand, performance requirements for scale-out interconnects between racks are rising rapidly. This is pushing traditional pluggable optical transceivers...
Samsung Electronics expects high-performance computing (HPC) to account for 66% of its foundry business by 2029, up from 28% currently, as the company shifts its contract chipmaking...
As artificial intelligence (AI) and high-performance computing (HPC) drive unprecedented demands on semiconductor performance, materials are playing an increasingly critical...
