Taiwan's Ministry of Economic Affairs (MOEA) Department of Statistics reported on March 21 that February export orders hit US$49.45 billion, rising 5.3% from January and surging 31.1%...
MiTAC Holdings Corporation (MHC)'s subsidiary MiTAC Computing Technology introduced its latest AI infrastructure solutions at Nvidia GTC 2025, debuting the MiTAC G4527G6 AI server...
Neousys Technology Inc., a leading industrial PC (IPC) manufacturer, is unveiling its next-generation rugged edge AI computing platform at GTC 2025 to drive real-world AI adoption...
Compal Electronics has announced its participation in Nvidia GTC 2025 (March 17 - March 20), where it will showcase the latest technological breakthroughs in the AI-HPC GPU server...
The late 2024 surge in enthusiasm for artificial intelligence (AI) and high-performance computing (HPC) continues strong, driven by global cloud providers developing their own chips...
Samsung Electronics is ramping up its advanced foundry push, targeting mass production of its fourth-generation 4nm process (SF4X) by late 2024. Designed specifically for high-performance...
King Yuan Electronics (KYEC) remains upbeat about advanced testing demand for AI and HPC chips and has not ruled out the possibility of establishing a factory in the US.
On March 5, Giga Computing, a subsidiary of Gigabyte, announced it had signed a memorandum of understanding (MOU) with South Korea's SK Telecom and SK Enmove. The three parties will...
Alibaba's DAMO Academy has introduced its first server-grade RISC-V processor, the C930, designed for high-performance computing (HPC) applications. Announced at the XuanTie RISC-V...
IC testing firm Ardentec anticipates sequential revenue growth through the fourth quarter of 2025, driven by a consistent rise in demand for AI and HPC device applications. The company...
STMicroelectronics (STM) is partnering with Amazon Web Services (AWS) to develop a data center photonic chip that delivers 800Gbps and 1.6Tbps optical interconnect speeds for AI and...
As AI applications advance, the demand for high-performance and energy-efficient memory is growing across on-device AI, high-performance computing (HPC), and data centers. In response,...
Cable and connector maker BizLink expects steady demand for high-performance computing (HPC) and semiconductor production equipment (SPE) to drive growth in 2025, with chairman Roger...
ASE Technology Holdings (ASE) and Powertech Technology (PTI) are ramping up investments in fan-out panel-level packaging (FOPLP) to capitalize on surging artificial intelligence (AI)...
Global packaging and testing leader ASE Technology Holdings (ASE) expects total capital expenditure (capex) for the year to grow significantly by over 60%, primarily allocated for...
