Taiwan's OSATs and foundry TSMC that boasts testing capacity have refrained from making the expected purchases of new wafer probers and automated testing equipment (ATE) from major...

Testing house King Yuan Electronics (KYEC) continues to see sluggish demand for handset SoCs, despite robust demand for HPC processors, according to industry sources.

Tai-Tech Advanced Electronics, a power inductor specialist, recently announced plans to establish a new plant in Johor Bahru, Malaysia for the production of automotive electronics...

IC materials distributors have enjoyed a ramp-up in orders for heat sinks, thanks to strong advanced packaging demand for HPC chips, according to industry sources.

Cooling solution supplier Yen Sun Technology is optimistic about demand for HPC device applications, according to the Taiwan-based company.

As it is becoming much more difficult and expensive to pack more transistors into a single chip, the chip industry pins its hope on chiplet technology when the global demand for HPC...

Despite facing various regulatory restrictions from the US, the Chinese IC industry has not changed its goal of achieving semiconductor autonomy. In terms of IC design, many Chinese...

IC test interface specialist WinWay Technology expects a stronger second half of 2023 than the first, buoyed by demand for AI and HPC device applications.

In response to the advent of the AI era, Samsung Electronics is gearing up to strengthen its semiconductor ecosystem, and has further announced that it will expand the provision of...

Nvidia is reportedly mulling outsourcing a portion of its AI GPUs to Samsung Electronics for fabrication amid increasingly tight capacity supply from TSMC. Industry observers noted...

European IDMs differ slightly from their US counterparts in terms of manufacturing capacity deployments, focusing more on expanding wafer fab capacity than backend packaging and testing...

Samsung Electronics has disclosed its latest advanced process development roadmap at the just-ended 2023 Samsung Foundry Forum, with plans to mass produce 2nm chips by 2025 and commercialize...

Due to the bandwidth limitations of DDR SDRAM in high-speed computation, high bandwidth memory (HBM) is rapidly gaining popularity as a means to circumvent memory transmission speed...

Samsung Electronics made several announcements during the recent annual Samsung Foundry Forum (SFF).

The production of AI server chips necessitates not only advanced process fabrication but also the packaging used for high-end HPC processors; however, the supply of advanced packaging...