The recent update to the US government's chip ban has raised concerns about its potential impact on Chinese chipmakers, particularly in the realm of high-performance computing (HPC)...
TSMC expects to post revenues of between US$18.8 billion and US$19.6 billion in the fourth quarter of 2023, which is an 11.1% sequential increase at the midpoint. Gross margin and...
Generative AI has driven the demand for high-performance computing (HPC) and high-speed transmission, which in turn is adding development momentum to silicon photonics optical communication...
SiFive, Inc., a pioneering force in RISC-V computing, has unveiled a pair of groundbreaking products to cater to the ever-growing demands of high-performance computing. The new SiFive...
Although major Taiwan-based OSATs experienced a decline in total revenue for 2023 through September, market sources state that they are gearing up for an anticipated rise in demand...
Taiwanese IC design firms are expected to increase their market share in consumer applications, as their European and American counterparts continue to withdraw from markets such...
At the TSMC 2023 OIP Ecosystem Forum, TSMC announced the new 3Dblox 2.0 open standard and major achievements of its Open Innovation Platform (OIP) 3DFabric Alliance. The 3Dblox 2.0...
In 2023, global spending on fab equipment for front-end facilities is projected to decrease by 15% before rebounding with a 15% year-over-year increase in 2024, according to a recent...
Driven by the AI frenzy, high-performance computing (HPC) chips are becoming pivotal in the semiconductor landscape, spotlighting advanced packaging technologies like CoWoS. Heat...
Advanced packaging and testing have become the hottest topics in the semiconductor industry in 2023, with TSMC's CoWoS packaging technology experiencing extremely high demand due...
The inaugural Quantum Taiwan Forum, held on the opening day of SEMICON Taiwan 2023 running September 6–8 at the Taipei Nangang Exhibition Center, gathered experts from Fujitsu,...
In light of the severe shortage of CoWoS (chip-on-wafer-on-substrate) packaging capacity for AI GPUs now in hot demand, the US and Japan reportedly are aggressively re-inviting TSMC...
With the rapidly rising popularity of generative AI, high bandwidth memory (HBM) and graphics processing units (GPU) have become highly sought-after components. However, as the semiconductor...
A surge in AI server chip demand cannot offset the overall slump in consumer electronics demand, causing TSMC to cut its revenue growth forecast for 2023 to a 10% drop. However, market...
