Infineon Technologies has disclosed it has signed a memorandum of understanding with Hyundai Motor Group where Infineon will support startups with product level technical expertise...
Taiwan-based IC design houses, particularly those engaged in consumer ICs, have come under increasing pressure to maintain their quotes for 2022 as customers are more reluctant to...
Automotive IDMs have notified their clients about 10-20% price hikes for their chips starting 2022 as they continue to face mounting costs for raw materials, according to industry...
International IDMs and chipmakers are set to ramp up their output for automotive MCUs in the next few years to meet ever-growing demand for such chips, according to industry source...
Fueled by pent-up demand for automotive electronics caused by semiconductor supply chain disruptions, worldwide installed capacity for power and compound semiconductor fabs is projected...
Taiwan-based backend houses continue to land shifted orders for MOSFET and other power ICs from Southeast Asia, where operations at fabs run by international IDMs are being disrupted...
China-based OSAT Tongfu Microelectronics plans to raise up to CNY5.5 billion (US$854 million) to fund its upcoming capacity expansions for a variety of segments, according to industry...
China with its 14th 5-year Plan (2021-2025) will be stepping up the development of the country's homegrown third-generation semiconductor industry supply chain, according to industry...
IDMs including TI, Infineon, STMicroelectronics and Microchip have all stepped up their deployments in the market for power devices using GaN, SiC and other third-generation semiconductor...
China auto and semiconductor makers are stepping up the development and production of their homegrown SiC chips and modules for EV applications, according to industry sources.
International IDMs, Taiwan's EMS leader Foxconn and China's semiconductor and EV vendor BYD Group are all keenly deepening their deployments in third-generation semiconductors GaN...
IDMs including Infineon, Rohm and STMicroelectronics are transitioning to 8-inch wafer fabrication for third-generation semiconductors such as GaN and SiC, according to industry so...
As the application market for third-generation semiconductors GaN and SiC devices is on track for rapid expansion, international IDMs including Cree, Infineon, SMT Microelectronics...
GlobalFoundries (GF) reportedly has quietly applied to US Securities and Exchange Commission for an IPO (initial public offering) listing on New York Stock Exchange in late 2021 or...
