TSMC and other Taiwan-based pure-play foundries intend to carry out their capacity expansion projects cautiously and progressively to avoid the risk of overcapacity.
A recent fire that struck one of Renesas' plants in Japan may lead to a further tightening in the world's available production capacity for automotive chips, according to industry...
DRAM and NOR flash memory prices are expected to rise through the second half of 2021, as growth on the supply side fails to catch up, according to industry sources.
IDM vendors may consider outsourcing more of their production starting 2022, with Taiwan-based contract chipmakers being among the beneficiaries, according to industry sources.
Taiwan-based leadframe makers including Shuen Der Industry (SDI) and Jih Lin Technology are poised to post sequential revenue increases through the third quarter of 2021, thanks to...
With major Taiwan-based foundries expressing their supply commitments to their automotive customers, fabless chipmakers particularly second-tier players have expressed concerns about...
Taiwan leadframe makers are likely to raise quotes for leadframes for packaging automotive chips and power modules by 5-10% to reflect increased material costs amid increasing demand...
China Resources Microelectronics (CR Micro) has notified its clients based mainly in China about price hikes for all its power semiconductor products, including MOSFET and IGBT components,...
Foundries including TSMC, United Microelectronics (UMC) and Vanguard International Semiconductor (VIS) have seen the visibility of orders for automotive chips extended to the end...
Taiwan's discrete power component supply chain players are optimistic that demand for automotive applications will pick up steadily in 2021 after staying stagnant for quarters, with...
Demand for automotive power chips and components has started picking up since the third quarter of 2020 after experiencing almost two years of stagnancy, with sales outlook promising...
Materials analysis (MA), reliability analysis (RA) and failure analysis (FA) are increasingly needed by IC designers, wafer foundries and backend houses to support R&D projects...
The emerging market for silicon carbide (SiC) and gallium nitride (GaN) power semiconductors is rapidly evolving from a startup-dominated business to one led by large-established...
Adoption of e-SIM technology is expected to be driven mainly by handset applications in the next few years as consumers can switch their telecom service providers easily with the...
China-based Leadrive Technology, specializing in third-generation semiconductor power modules for electric vehicles, has teamed up with Japan's IDM Rohm Semiconductor to set up an...
