Arm is partnering with Taiwan's Industrial Technology Research Institute (ITRI) to develop an ecosystem platform available for international IC design startups looking to invest in...

With the introduction of 5G, cellular frequency bands have increased considerably, requiring innovative solutions for the packaging of RF front-end modules for smartphones and other...

Intel has revealed the roadmap of its process and packaging innovations that will power the next wave of products through 2025 and beyond.

A team of 25 startups from Taiwan participated in the French government-supported VivaTech 2021 in Paris in mid June, with five of them winning four awards of the annual event, according...

Micron Technology has unveiled memory and storage innovations across its portfolio based on its 176-layer NAND and 1α (1-alpha) DRAM technology, as well as what the company...

TSMC at its ongoing technology symposium held online has unveiled its latest innovations in advanced logic technology, specialty technologies, and the additions of its 3DFabric advanced...

The pandemic has been accelerating digital transformation at enterprises and industries worldwide with over 65% of global GDP estimated to come from digital products and services...

US-based semiconductor equipment vendor KLA is looking to beef up its operations in Taiwan with plans to hire an additional 100 staff this year.

The Acer Group via its four affiliates - AOpen, Acer Being Communication, Acer ITS and Altos Computing - is eyeing the business opportunities from smart city development particularly...

Micron Technology has announced updates to the company's portfolio strategy to further strengthen its focus on memory and storage innovations for the data center, with plans to cease...

Kioxia held a groundbreaking ceremony for a semiconductor fabrication facility, dubbed Fab 7, at its factory site in Yokkaichi, Japan on February 24. The facility will be dedicated...

Samsung Electronics has announced mass production of its most advanced line of datacenter SSDs - the PM9A3 E1.S - which fully complies with the Open Compute Project (OCP) NVMe Cloud...

Kioxia and Western Digital jointly announced they have developed their sixth-generation, 162-layer 3D flash memory technology.

At CES 2021's online exhibition, many notebook brand vendors showcased gaming products featuring higher resolution panels, new type of Chromebooks and dual-screen models eyeing the...

MSI, a world leader in gaming hardware and computing solutions, unveils an innovative lineup of gaming, creator and business products at its virtual launch event, "MSI Premiere 2021:...