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NEWS TAGGED MERGER
Friday 12 March 2010
Ralink and TrendChip enter into merger agreement
Taiwan-based WLAN chip maker Ralink Technology and sDSL CPE chipset supplier TrendChip Technologies have announced that a merger agreement has been approved by their boards of dire...
Wednesday 10 March 2010
Raydium February 2010 revenues drop 16%
LCD driver IC maker Raydium Semiconductor reported revenues of NT$688 million (US$21.64 million) in February, down 16% on month. The company has increased its wafer starts with foundries...
Wednesday 3 March 2010
Rumor says Ralink and TrendChip to merge
Ralink Technology may merge with TrendChip Technologies, according to market rumors. Both companies declined to comment on the speculation, while shares of the two companies surged...
Wednesday 24 February 2010
Innolux to issue over NT$34 billion new shares
Taiwan-based LCD panel maker Innolux Display on February 23 announced the issuance of new shares worth NT$34.754 billion (US$1.086 billion), its capital increment due to its merger...
Tuesday 9 February 2010
CMO, Innolux, TPO revise merger date again
Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays have rescheduled the date of their merger to March 18 from April 1, the date they set just last week, according to...
Tuesday 2 February 2010
Lextar to set up LED subsidiary in China
LED epitaxial wafer maker Lextar Electronics, a subsidiary of AU Optronics (AUO), will invest US$20 million to set a subsidiary of its own in Suzhou, eastern China, according to...
Tuesday 2 February 2010
HannStar Display swings to losses in 4Q09
Taiwan-based TFT-LCD panel maker HannStar Display swung to an operating loss of NT$2.568 billion (US$80.3 million) and net loss of NT$4.304 billion in fourth-quarter 2009, partly...
Friday 29 January 2010
CMO, Innolux and TPO set new merger schedule
Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays have rescheduled their merger date for April 1, a month later than the date they last set, according to the companie...
Wednesday 27 January 2010
Driver IC backend supply to tighten, says Chipbond chairman
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Tuesday 26 January 2010
Chipbond capex to more than double in 2010
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
Friday 22 January 2010
Shanghai government to invest in new HHNEC-GSMC 12-inch fab
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
Thursday 21 January 2010
AUO reportedly headhunting talent from CMO
AU Optronics (AUO) reportedly has set up an office in southern Taiwan to headhunt talent from Chi Mei Optoelectronics (CMO) ahead of the rival LCD panel maker's merger with Innolux...
Wednesday 20 January 2010
Chipbond, IST merger may complete ahead of schedule
LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...
Wednesday 13 January 2010
Chi Mei Corporation to merge with subsidiary, downsize capital
Chi Mei Corporation, a producer of plastic resins and intermediate petrochemicals, will merge with its wholly owned subsidiary Chi Mei Specialty Chemicals in line with the ongoing...
Tuesday 12 January 2010
CMO, Innolux, TPO merger moves ahead to March 1
Taiwan-based Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays on January 11 decided to push forward the official date for their merger from April 30, 2010 to March...
Research Report Database
Samsung expands mobile phone production beyond Asian countries, says DIGITIMES Research
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research