Taiwan-based TFT-LCD panel maker HannStar Display swung to an operating loss of NT$2.568 billion (US$80.3 million) and net loss of NT$4.304 billion in fourth-quarter 2009, partly...
Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays have rescheduled their merger date for April 1, a month later than the date they last set, according to the companie...
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
AU Optronics (AUO) reportedly has set up an office in southern Taiwan to headhunt talent from Chi Mei Optoelectronics (CMO) ahead of the rival LCD panel maker's merger with Innolux...
LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...
Chi Mei Corporation, a producer of plastic resins and intermediate petrochemicals, will merge with its wholly owned subsidiary Chi Mei Specialty Chemicals in line with the ongoing...
Taiwan-based Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays on January 11 decided to push forward the official date for their merger from April 30, 2010 to March...
Innolux Display and Chi Mei Optoelectronics (CMO) will hold a board of directors meeting on January to officially approve the merger of the two companies on April 30, 2010.
Powertech Technology (PTI) chairman DK Tsai has denied rumors that the memory IC packaging and testing house plans to merge with Orient Semiconductor Electronics (OSE), a memory card...
Merger talks between Hua Hong NEC (HHNEC) and Grace Semiconductor Manufacturing Corporation (GSMC), which have drawn active involvement from the Shanghai municipal government, are...
LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...
Singapore-based Chartered Semiconductor Manufacturing, which is scheduled to be delisted from the Nasdaq stock market on December 28, has begun to proceed with its merger with Globalfoundries...
The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...
