Foxconn Electronics (Hon Hai Precision Industry) has dismissed a recent Chinese-language media report in Taiwan that claimed the EMS giant was mulling acquiring a 40% stake in Amtran...
The merger of Ralink Technology and TrendChip Technologies is expected to help Taiwan-based networking equipment makers expand their presence in the telecom procurement markets, according...
Taiwan-based LCD TV maker Amtran Technology has declined to respond to recent rumors that Foxconn Electronics (Hon Hai Precision Industry) will merge with Amtran.
Taiwan-based WLAN chip maker Ralink Technology and sDSL CPE chipset supplier TrendChip Technologies have announced that a merger agreement has been approved by their boards of dire...
LCD driver IC maker Raydium Semiconductor reported revenues of NT$688 million (US$21.64 million) in February, down 16% on month. The company has increased its wafer starts with foundries...
Ralink Technology may merge with TrendChip Technologies, according to market rumors. Both companies declined to comment on the speculation, while shares of the two companies surged...
Taiwan-based LCD panel maker Innolux Display on February 23 announced the issuance of new shares worth NT$34.754 billion (US$1.086 billion), its capital increment due to its merger...
Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays have rescheduled the date of their merger to March 18 from April 1, the date they set just last week, according to...
LED epitaxial wafer maker Lextar Electronics, a subsidiary of AU Optronics (AUO), will invest US$20 million to set a subsidiary of its own in Suzhou, eastern China, according to...
Taiwan-based TFT-LCD panel maker HannStar Display swung to an operating loss of NT$2.568 billion (US$80.3 million) and net loss of NT$4.304 billion in fourth-quarter 2009, partly...
Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays have rescheduled their merger date for April 1, a month later than the date they last set, according to the companie...
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
