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Wednesday 27 January 2010
Driver IC backend supply to tighten, says Chipbond chairman
Fei-Jain Wu, chairman of driver-IC backend house Chipbond Technology, has predicted that demand for wafer probe testing will exceed supply in March 2010. Wu also believes a similar...
Tuesday 26 January 2010
Chipbond capex to more than double in 2010
Chipbond Technology has set a capex goal of NT$1.5 billion (US$47 million) for 2010 compared to NT$700 million allocated for the previous year, according to company chairman Fei-Jain...
Friday 22 January 2010
Shanghai government to invest in new HHNEC-GSMC 12-inch fab
The Shanghai municipal government will invest 4.5 billion yuan (US$658.7 million) in a new 12-inch (300mm) wafer fab to be built by a joint venture of Hua Hong NEC (HHNEC) and Grace...
Thursday 21 January 2010
AUO reportedly headhunting talent from CMO
AU Optronics (AUO) reportedly has set up an office in southern Taiwan to headhunt talent from Chi Mei Optoelectronics (CMO) ahead of the rival LCD panel maker's merger with Innolux...
Wednesday 20 January 2010
Chipbond, IST merger may complete ahead of schedule
LCD driver IC packaging house Chipbond Technology has said its merger with International Semiconductor Technology (IST) may be finalized on April 1, 2010 at the earliest. The merger...
Wednesday 13 January 2010
Chi Mei Corporation to merge with subsidiary, downsize capital
Chi Mei Corporation, a producer of plastic resins and intermediate petrochemicals, will merge with its wholly owned subsidiary Chi Mei Specialty Chemicals in line with the ongoing...
Tuesday 12 January 2010
CMO, Innolux, TPO merger moves ahead to March 1
Taiwan-based Chi Mei Optoelectronics (CMO), Innolux Display and TPO Displays on January 11 decided to push forward the official date for their merger from April 30, 2010 to March...
Monday 4 January 2010
Innolux, CMO to hold board of directors meeting on January 6 for official merger approval
Innolux Display and Chi Mei Optoelectronics (CMO) will hold a board of directors meeting on January to officially approve the merger of the two companies on April 30, 2010.
Wednesday 30 December 2009
PTI chairman denies merger rumors
Powertech Technology (PTI) chairman DK Tsai has denied rumors that the memory IC packaging and testing house plans to merge with Orient Semiconductor Electronics (OSE), a memory card...
Tuesday 29 December 2009
HHNEC-GSMC merger talks proceeding at slow pace
Merger talks between Hua Hong NEC (HHNEC) and Grace Semiconductor Manufacturing Corporation (GSMC), which have drawn active involvement from the Shanghai municipal government, are...
Monday 28 December 2009
Chipbond-IST merger set to complete in June 2010
LCD driver IC packaging house International Semiconductor Technology (IST) has announced that its board of directors on December 25 approved a deal to merge with Chipbond Technology,...
Tuesday 22 December 2009
Charterted, Globalfoundries set to merge foundry operations
Singapore-based Chartered Semiconductor Manufacturing, which is scheduled to be delisted from the Nasdaq stock market on December 28, has begun to proceed with its merger with Globalfoundries...
Thursday 17 December 2009
Taiwan IC backend industry to see more consolidation in 2010, says TICP chairman
The Taiwan IC packaging and testing industry will continue to consolidate in 2010, in the wake of Chipbond Technology's recently-announced merger with counterpart International Semiconductor...
Wednesday 16 December 2009
AUO LED affiliates Lextar and LightHouse to merge
Taiwan-based LED epitaxial wafer and chipmaker Lextar Electronics on December 15 announced its merger with SMD LED maker LightHouse Technology through a 1:1 stock swap, with the former...
Friday 11 December 2009
CMO says price-fixing fine not to affect Innolux merger
Chi Mei Optoelectronics (CMO) has said that its settlement with the US Department of Justice (DOJ) to resolve anti-trust allegations will not affect its plan to merge with Innolux...
CPC
Summary of Tech Supply Chain News!
SLMs to increase presence in GenAI business opportunities, says DIGITIMES Research
Generative AI market to reach US$1.5 trillion by 2030 with Taiwan holds hardware advantage; software and services to see promising future, says DIGITIMES Research
Competitive color technologies expand e-paper market potential, moving beyond zero-sum game, says DIGITIMES Research